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| ? 2005 microchip technology inc. preliminary ds70139c dspic30f2011, dspic30f2012, dspic30f3012, DSPIC30F3013 data sheet high-performance digital signal controllers
ds70139c-page ii preliminary ? 2005 microchip technology inc. information contained in this publication regarding device applications and the like is pr ovided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or war- ranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip?s products as critical components in life support systems is not authorized except with express written approval by microchip. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, accuron, dspic, k ee l oq , micro id , mplab, pic, picmicro, picstart, pro mate, powersmart, rfpic, and smartshunt are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. amplab, filterlab, mxdev, mxlab, picmaster, seeval, smartsensor and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, a pplication maestro, dspicdem, dspicdem.net, dspicworks, ecan, economonitor, fansense, flexrom, fuzzylab, in-circuit serial programming, icsp, icepic, migratable memory, mpasm, mplib, mplink, mpsim, pi ckit, picdem, picdem.net, piclab, pictail, powercal, powerinfo, powermate, powertool, rflab, rfpicdem, select mode, smart serial, smarttel and total endurance are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2005, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of produc ts is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. al l of these methods, to our knowledge, require using the microchip products in a manner outsi de the operating specifications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the in tegrity of their code. ? neither microchip nor any other semiconductor manufacturer ca n guarantee the security of thei r code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improving the code protection features of our products. attempts to break microchip?s code protection feature ma y be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted wo rk, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2002 qu ality system certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona and mountain view, california in october 2003. the company?s quality system processes and procedures are for its picmicro ? 8-bit mcus, k ee l oq ? code hopping devices, serial eeproms, microper ipherals, nonvolatile memory and analog products. in addition, microchi p?s quality system for the design and manufacture of development sys tems is iso 9001:2000 certified. ? 2005 microchip technology inc. preliminary ds70139c-page 1 dspic30f2011/2012/3012/3013 high-performance modified risc cpu: ? modified harvard architecture ? c compiler optimized inst ruction set architecture ? flexible addressing modes ? 84 base instructions ? 24-bit wide instructions, 16-bit wide data path ? up to 24 kbytes on-chip flash program space ? up to 2 kbytes of on-chip data ram ? up to 1 kbytes of non-volatile data eeprom ? 16 x 16-bit working register array ? up to 30 mips operation: - dc to 40 mhz external clock input - 4 mhz-10 mhz oscillator input with pll active (4x, 8x, 16x) ? up to 21 interrupt sources: - 8 user selectable priority levels - 3 external interrupt sources - 4 processor trap sources dsp features: ? dual data fetch ? modulo and bit-reversed modes ? two 40-bit wide accumu lators with optional saturation logic ? 17-bit x 17-bit single cycle hardware fractional/ integer multiplier ? all dsp instructions are single cycle - multiply-accumulate (mac) operation ? single cycle 16 shift peripheral features: ? high current sink/source i/o pins: 25 ma/25 ma ? three 16-bit timers/counters; optionally pair up 16-bit timers into 32-bit timer modules ? 16-bit capture input functions ? 16-bit compare/pwm output functions: ? 3-wire spi? modules (supports four frame modes) ?i 2 c? module supports multi-master/slave mode and 7-bit/10-bit addressing ? up to two addressable uart modules with fifo buffers analog features: ? 12-bit analog-to-digital converter (a/d) with: - 100 ksps conversion rate - up to 10 input channels - conversion available during sleep and idle ? programmable low voltage detection (plvd) ? programmable brown-out detection and reset generation special microcontroller features: ? enhanced flash program memory: - 10,000 erase/write cycle (min.) for industrial temperature range, 100k (typical) ? data eeprom memory: - 100,000 erase/write cycle (min.) for industrial temperature range, 1m (typical) ? self-reprogrammable under software control ? power-on reset (por), power-up timer (pwrt) and oscillator start-up timer (ost) ? flexible watchdog timer (wdt) with on-chip low power rc oscillator for reliable operation ? fail-safe clock monitor operation: - detects clock failure and switches to on-chip low power rc oscillator ? programmable code protection ? in-circuit serial programming? (icsp?) ? selectable power management modes: - sleep, idle and alternate clock modes cmos technology: ? low power, high speed flash technology ? wide operating voltage range (2.5v to 5.5v) ? industrial and extended temperature ranges ? low power consumption note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descr iptions and general device functionality, refer to the dspic30f family reference manual (ds70046). for more information on the device instruction set and programming, refer to the dspic30f programmer?s reference manual (ds70030). dspic30f2011/2012/3012/3013 high-performance digital signal controllers dspic30f2011/2012/3012/3013 ds70139c-page 2 preliminary ? 2005 microchip technology inc. dspic30f2011/2012/3012/3013 sensor family pin diagrams device pins program memory sram bytes eeprom bytes timer 16-bit input cap output comp/std pwm a/d 12-bit 100 ksps uart spi ? i 2 c ? bytes instructions dspic30f2011 18 12k 4k 1024 ? 3 2 2 8 ch 1 1 1 dspic30f3012 18 24k 8k 2048 1024 3 2 2 8 ch 1 1 1 dspic30f2012 28 12k 4k 1024 ? 3 2 2 10 ch 1 1 1 DSPIC30F3013 28 24k 8k 2048 1024 3 2 2 10 ch 2 1 1 note: for descriptions of indivi dual pins, see section 1.0. emud1/sosci/t2ck/u1atx/cn1/rc13 emuc1/sosco/t1ck/u1arx/cn0/rc14 osc1/clki v dd osc2/clko/rc15 pgd/emud/an4/u1tx/sdo1/scl/cn6/rb4 av dd pgc/emuc/an5/u1rx/sdi1/sda/cn7/rb5 emud2/an7/oc2/ic2/int2/rb7 emud3/an0/v ref +/cn2/rb0 v ss an6/sck1/int0/ocfa/rb6 av ss emud3/an1/v ref -/cn3/rb1 an2/ss1 /lvdin/cn4/rb2 1 2 3 4 5 6 7 8 9 18 17 16 15 14 13 12 11 10 emuc2/oc1/ic1/int1/rd0 18-pin pdip and soic dspic30f2011 dspic30f3012 an3/cn5/rb3 mclr 28-pin pdip and soic mclr v ss v dd emud3/an0/v ref +/cn2/rb0 emuc3/an1/v ref -/cn3/rb1 av dd av ss an2/ss1 /lvdin/cn4/rb2 ic2/int2/rd9 emuc2/ic1/int1/rd8 emuc1/sosco/t1ck/u1arx/cn0/rc14 emud1/sosci/t2ck/u1atx/cn1/rc13 v ss osc2/clko/rc15 osc1/clki v dd sck1/int0/rf6 pgc/emuc/u1rx/sdi1/sda/rf2 pgd/emud/u1tx/sdo1/scl/rf3 an5/cn7/rb5 an4/cn6/rb4 an3/cn5/rb3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 an6/ocfa/rb6 emud2/an7/rb7 an8/oc1/rb8 an9/oc2/rb9 cn17/rf4 cn18/rf5 dspic30f2012 mclr v ss v dd emud3/an0/v ref +/cn2/rb0 emuc3/an1/v ref -/cn3/rb1 av dd av ss an2/ss1 /lvdin/cn4/rb2 ic2/int2/rd9 emuc2/ic1/int1/rd8 emuc1/sosco/t1ck/u1arx/cn0/rc14 emud1/sosci/t2ck/u1atx/cn1/rc13 v ss osc2/clko/rc15 osc1/clki v dd sck1/int0/rf6 pgc/emuc/u1rx/sdi1/sda/rf2 pgd/emud/u1tx/sdo1/scl/rf3 an5/cn7/rb5 an4/cn6/rb4 an3/cn5/rb3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 an6/ocfa/rb6 emud2/an7/rb7 an8/oc1/rb8 an9/oc2/rb9 u2rx/cn17/rf4 u2tx/cn18/rf5 DSPIC30F3013 28-pin spdip and soic ? 2005 microchip technology inc. preliminary ds70139c-page 3 dspic30f2011/2012/3012/3013 pin diagrams 10 11 2 3 6 1 18 19 20 21 22 12 13 14 15 8 7 16 17 23 24 25 26 27 28 9 dspic30f2011 emud1/sosci/t2ck/u1atx/cn1/rc13 5 4 av dd av ss an6/sck1/int0/ocfa/rb6 emud2/an7/oc2/ic2/int2/rb7 nc nc nc nc v dd v ss pgc/emuc/an5/u1rx/sdi1/sda/cn7/rb5 pgd/emud/an4/u1tx/sdo1/scl/cn6/rb4 nc emuc2/oc1/ic1/int1/rd0 mclr emud3/an0/v ref +/cn2/rb0 emuc3/an1/v ref -/cn3/rb1 an2/ss1 /lvdin/cn4/rb2 an3/cn5/rb3 nc nc v ss osc1/clki osc2/clko/rc15 emuc1/sosco/t1ck/u1arx/cn0/rc14 v dd nc 28-pin qfn note: for descriptions of indivi dual pins, see section 1.0. dspic30f2011/2012/3012/3013 ds70139c-page 4 preliminary ? 2005 microchip technology inc. pin diagrams 10 11 2 3 6 1 18 19 20 21 22 12 13 14 15 8 7 16 17 23 24 25 26 27 28 9 dspic30f2012 emud1/sosci/t2ck/u1atx/cn1/rc13 5 4 av dd av ss an6/ocfa/rb6 emud2/an7/rb7 an8/oc1/rb8 an9/oc2/rb9 cn17/rf4 cn18/rf5 v dd v ss pgc/emuc/u1rx/sdi1/sda/rf2 pgd/emud/u1tx/sdo1/scl/rf3 sck1/int0/rf6 emuc2/ic1/int1/rd8 mclr emud3/an0/v ref +/cn2/rb0 emuc3/an1/v ref -/cn3/rb1 an2/s s1 /lvdin/cn4/rb2 an3/cn5/rb3 an4/cn6/rb4 an5/cn7/rb5 v ss osc1/clki osc2/clko/rc15 emuc1/sosco/t1ck/u1arx/cn0/rc14 v dd ic2/int2/rd9 28-pin qfn note: for descriptions of indivi dual pins, see section 1.0. ? 2005 microchip technology inc. preliminary ds70139c-page 5 dspic30f2011/2012/3012/3013 pin diagram 44 43 42 41 40 39 38 37 36 35 12 13 14 15 16 17 18 19 20 21 3 30 29 28 27 26 25 24 23 4 5 7 8 9 10 11 1 2 32 31 nc nc nc nc nc nc v dd nc v ss pgc/emuc/an5/u1rx/sdi1/sda/cn7/rb5 nc nc emuc3 / an1/v ref -/cn3/rb1 emud3 / an0/v ref +/cn2/rb0 mclr av dd nc an6/sck1/int0/ocfa/rb6 emud2 / an7/oc2/ic2/int2/rb7 an2/s s1 /lvdin/cn4/rb2 nc an3/cn5/rb3 nc nc nc v ss osc1/clki osc2/clko/rc15 pgd/emud / an4/u1tx/sdo1/scl/cn6/rb4 nc emuc2 / oc1/ic1/int1/rd0 nc nc emuc1/sosco/t1ck/u1arx/cn0/rc14 nc nc v dd 6 22 33 34 nc av ss nc nc emud1 / sosci/t2ck/u1atx/cn1/rc13 v ss nc dspic30f3012 44-pin qfn note: for descriptions of indivi dual pins, see section 1.0. dspic30f2011/2012/3012/3013 ds70139c-page 6 preliminary ? 2005 microchip technology inc. pin diagrams note: for descriptions of indivi dual pins, see section 1.0. 44-pin qfn an8/oc1/rb8 an9/oc2/rb9 u2rx/cn17/rf4 nc u2tx/cn18/rf5 nc v dd nc v ss pgc/emuc/u1rx/sdi1/sda/rf2 nc nc emuc3 / an1/v ref -/cn3/rb1 emud3 / an0/v ref +/cn2/rb0 mclr av dd nc an6/ocfa/rb6 emud2/an7/rb7 an2/ss1 /lvdin/cn4/rb2 nc an3/cn5/rb3 an4/cn6/rb4 an5/cn7/rb5 nc v ss osc1/clki osc2/clko/rc15 pgd/emud/u1tx/sdo1/scl/rf3 sck1/int0/rf6 emuc2/ic1/int1/rd8 nc nc emuc1/sosco/t1ck/u1arx/cn0/rc14 nc ic2/int2/rd9 v dd nc av ss nc nc emud1/sosci/t2ck/u1atx/cn1/rc13 v ss nc DSPIC30F3013 44 43 42 41 40 39 38 37 36 35 12 13 14 15 16 17 18 19 20 21 3 30 29 28 27 26 25 24 23 4 5 7 8 9 10 11 1 2 32 31 6 22 33 34 ? 2005 microchip technology inc. preliminary ds70139c-page 7 dspic30f2011/2012/3012/3013 table of contents 1.0 device overview .............. ........................ .................. .................. .................. ................. ...................... .................... ................... 9 2.0 cpu architecture overview........... ....................... ...................... ....................... .................... .................... .................. ............... 17 3.0 memory organization .................... ....................... ...................... .................... .................... .............................. ................ .......... 27 4.0 address generator units............... ....................... ...................... .................... ..................... .................... .................... ............... 41 5.0 flash program memory................. ....................... ...................... ....................... ................... ............................. ......................... 47 6.0 data eeprom memory ............ ........................ .................. .................. .................. ................ ............................ ....................... 53 7.0 i/o ports .................. ........................ ..................... .................. .................. ................ ........................ ....................... ................... 57 8.0 interrupts ................... .................... .................... ..................... .................. ................ ........................ ....................... ................... 63 9.0 timer1 module ................. ........................ .................. .................. .................. ................ ....................... .................... ................. 71 10.0 timer2/3 module .............. ........................ .................. .................. .................. ................ ....................... .................... ................. 75 11.0 input capture module.................. ...................... ....................... .................... .................... ..................... .................... ................. 81 12.0 output compare module ................. ....................... ...................... ..................... ................... ............................ ................ .......... 85 13.0 spi module.................. .................... ..................... .................. .................. .................. ...................... ....................... ................... 89 14.0 i2c module .................. .................... ..................... .................. .................. .................. ...................... ....................... ................... 93 15.0 universal asynchronous receiver transmitter (uart) module . ...................... ...................... ..................... ............... ............. 101 16.0 12-bit analog-to-digital converter (a /d) module................. ..................... .................... .................. ...................... .................... 109 17.0 system integration .................... ...................... ....................... .................... .................... .................... ..................... ................. 117 18.0 instruction set summary ............... ....................... ...................... .................... .................... ............................ ............... ........... 131 19.0 development support.................... ....................... ...................... .................... ................... .................... .................... ............... 139 20.0 electrical characteristics ........... ...................... ....................... ...................... ................... ................... ..................... ................. 145 21.0 packaging information................. ...................... ....................... .................... .................... ..................... .................... ............... 187 index ..................... ..................... .................... .................... .................... .................... ......................... .................. ................ ............. 195 the microchip web site ........ .................... ..................... .................... .................. .................. ............................... ................ ............. 201 customer change notification service ..... ....................... ...................... ..................... .................... .................. .................. ............... 201 customer support ................. .................... ..................... .................. .................. ................. ................................ .................. ............. 201 reader response ................. .................... ..................... .................. .................. .................. ............................... .................. ............. 202 product identification system .......... ....................... ...................... ....................... .................... ....................... .................. ................. 203 to our valued customers it is our intention to provide our valued customers with the best documentation possible to ensure successful use of your micro chip products. to this end, we will continue to improve our publicat ions to better suit your needs. our publications will be refined and enhanced as new volumes and updates are introduced. if you have any questions or comments regarding this publication, please contact the marketing communications department via e-mail at docerrors@microchip.com or fax the reader response form in the back of this data sheet to (480) 792-4150. we welcome your feedback. most current data sheet to obtain the most up-to-date version of this data s heet, please register at our worldwide web site at: http://www.microchip.com you can determine the version of a data s heet by examining its literature number f ound on the bottom outside corner of any page . the last character of the literature num ber is the version number, (e.g., ds3 0000a is version a of document ds30000). errata an errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for curren t devices. as device/documentation issues become known to us, we wi ll publish an errata sheet. the e rrata will specify the revisi on of silicon and revision of do cument to which it applies. to determine if an errata sheet exists for a particul ar device, please check with one of the following: ? microchip?s worldwide web site; http://www.microchip.com ? your local microchip sales office (see last page) when contacting a sales office, please specify which device, re vision of silicon and data sheet (include literature number) you are using. customer notification system register on our web site at www.microchip.com to receive the most current information on all of our products. dspic30f2011/2012/3012/3013 ds70139c-page 8 preliminary ? 2005 microchip technology inc. notes: ? 2005 microchip technology inc. preliminary ds70139c-page 9 dspic30f2011/2012/3012/3013 1.0 device overview this data sheet contains information specific to the dspic30f2011, dspic30f 2012, dspic30f3012 and DSPIC30F3013 digital signal controllers. these devices contain extensive digital signal processor (dsp) functionality within a high-performance 16-bit microcontroller (mcu) architecture. the following block diagrams depict the architecture for these devices: ? figure 1-1 illustra tes the dspic30f2011 ? figure 1-2 illustra tes the dspic30f2012 ? figure 1-3 illustra tes the dspic30f3012 ? figure 1-4 illustra tes the DSPIC30F3013 following the block diagrams, table 1-1 relates the i/o functions to pinout information. note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descr iptions and general device functionality, refer to the dspic30f family reference manual (ds70046). for more information on the device instruction set and programming, refer to the dspic30f programmer?s reference manual (ds70030). dspic30f2011/2012/3012/3013 ds70139c-page 10 preliminary ? 2005 microchip technology inc. figure 1-1: dspic30f2011 block diagram power-up timer oscillator start-up timer por/bor reset watchdog timer instruction decode & control osc1/clki mclr v dd , v ss pgd/emud/an4/u1tx/sdo1/scl/cn6/rb4 low voltage detect uart1 timing generation pgc/emuc/an5/u1rx/sdi1/sda/cn7/r b5 16 pch pcl program counter alu<16> 16 24 24 24 24 x data bus ir i 2 c? an6/sck1/int0/ocfa/rb6 emud2/an7/oc2/ic2/int2/rb7 pcu 12-bit adc timers input capture module output compare module emuc1/sosco/t1ck/u1arx/cn0/rc14 emud1/sosci/t2ck/u1atx/cn1/rc13 portb portd 16 16 16 16 x 16 w reg array divide unit engine dsp decode rom latch 16 y data bus effective address x ragu x wagu y agu emud3/an0/v ref +/cn2/rb0 emuc3/an1/v ref -/cn3/rb1 an2/ss1 /lvdin/cn4/rb2 an3/cn5/rb3 osc2/clko/rc15 av dd , av ss 16 16 16 16 16 portc 16 16 16 16 8 interrupt controller psv & table data access control block stack control logic loop control logic data latch data latch y data (512 bytes) ram x data (512 bytes) ram address latch address latch emuc2/oc1/ic1/int1/rd0 16 spi1 address latch program memory (12 kbytes) data latch 16 ? 2005 microchip technology inc. preliminary ds70139c-page 11 dspic30f2011/2012/3012/3013 figure 1-2: dspic30f2012 block diagram an8/oc1/rb8 an9/oc2/rb9 power-up timer oscillator start-up timer por/bor reset watchdog timer instruction decode & control osc1/clki mclr v dd , v ss an4/cn6/rb4 low voltage detect uart1 timing generation an5/cn7/rb5 16 pch pcl program counter alu<16> 16 24 24 24 24 x data bus ir i 2 c? an6/ocfa/rb6 emud2/an7/rb7 pcu 12-bit adc timers cn18/rf5 sck1/int0/rf6 input capture module output compare module emuc1/sosco/t1ck/u1arx/cn0/rc14 emud1/sosci/t2ck/u1atx/cn1/rc13 emud3/an0/v ref +/cn2/rb0 portb pgc/emuc/u1rx/sdi1/sda/rf2 pgd/emud/u1tx/sdo1/scl/rf3 portd 16 16 16 16 x 16 w reg array divide unit engine dsp decode rom latch 16 y data bus effective address x ragu x wagu y agu an2/ss1 /lvdin/cn4/rb2 an3/cn5/rb3 osc2/clko/rc15 cn17/rf4 av dd , av ss 16 16 16 16 16 portc portf 16 16 16 16 8 interrupt controller psv & table data access control block stack control logic loop control logic data latch data latch y data (512 bytes) ram x data ram address latch address latch emuc2/ic1/int1/rd8 ic2/int2/rd9 16 emuc3/an1/v ref -/cn3/rb1 spi1 address latch program memory (12 kbytes) data latch 16 (512 bytes) dspic30f2011/2012/3012/3013 ds70139c-page 12 preliminary ? 2005 microchip technology inc. figure 1-3: dspic30f3012 block diagram power-up timer oscillator start-up timer por/bor reset watchdog timer instruction decode & control osc1/clki mclr v dd , v ss pgd/emud/an4/u1tx/s do1/scl/cn6/rb4 low voltage detect uart1 timing generation pgc/emuc/an5/u1rx/sdi1/sda/cn7/r b5 16 pch pcl program counter alu<16> 16 24 24 24 24 x data bus ir i 2 c? an6/sck1/int0/ocfa/rb6 emud2/an7/oc2/ic2/int2/rb7 pcu 12-bit adc timers input capture module output compare module emuc1/sosco/t1ck/u1arx/cn0/rc14 emud1/sosci/t2ck/u1atx/cn1/rc13 portb portd 16 16 16 16 x 16 w reg array divide unit engine dsp decode rom latch 16 y data bus effective address x ragu x wagu y agu emud3/an0/v ref +/cn2/rb0 emuc3/an1/v ref -/cn3/rb1 an2/ss1 /lvdin/cn4/rb2 an3/cn5/rb3 osc2/clko/rc15 av dd , av ss 16 16 16 16 16 portc 16 16 16 16 8 interrupt controller psv & table data access control block stack control logic loop control logic data latch data latch y data (1 kbytes) ram x data (1 kbytes) ram address latch address latch emuc2/oc1/ic1/int1/rd0 16 spi1 address latch program memory (24 kbytes) data latch 16 data eeprom (1 kbytes) ? 2005 microchip technology inc. preliminary ds70139c-page 13 dspic30f2011/2012/3012/3013 figure 1-4: DSPIC30F3013 block diagram an8/oc1/rb8 an9/oc2/rb9 power-up timer oscillator start-up timer por/bor reset watchdog timer instruction decode & control osc1/clki mclr v dd , v ss an4/cn6/rb4 low voltage detect uart1, timing generation an5/cn7/rb5 16 pch pcl program counter alu<16> 16 24 24 24 24 x data bus ir i 2 c an6/ocfa/rb6 emud2/an7/rb7 pcu 12-bit adc timers ut2x/cn18/rf5 sck1/int0/rf6 input capture module output compare module emuc1/sosco/t1ck/u1arx/cn0/rc14 emud1/sosci/t2ck/u1atx/cn1/rc13 emud3/an0/v ref +/cn2/rb0 portb pgc/emuc/u1rx/sdi1/sda/rf2 pgd/emud/u1tx/sdo1/scl/rf3 portd 16 16 16 16 x 16 w reg array divide unit engine dsp decode rom latch 16 y data bus effective address x ragu x wagu y agu an2/ss1 /lvdin/cn4/rb2 an3/cn5/rb3 osc2/clko/rc15 u2rx/cn17/rf4 av dd , av ss uart2 16 16 16 16 16 portc portf 16 16 16 16 8 interrupt controller psv & table data access control block stack control logic loop control logic data latch data latch y data (1 kbytes) ram x data ram address latch address latch emuc2/ic1/int1/rd8 ic2/int2/rd9 16 emuc3/an1/v ref -/cn3/rb1 spi1 16 (1 kbytes) address latch program memory (24 kbytes) data latch data eeprom (1 kbytes) dspic30f2011/2012/3012/3013 ds70139c-page 14 preliminary ? 2005 microchip technology inc. table 1-1 provides a brief description of device i/o pinouts and the functions that may be multiplexed to a port pin. multiple function s may exist on one port pin. when multiplexing occurs , the peripheral module?s functional requirements ma y force an override of the data direction of the port pin. table 1-1: pinout i/o descriptions pin name pin type buffer type description an0-an9 i analog analog input channels. av dd p p positive supply for analog module. av ss p p ground reference for analog module. clki clko i o st/cmos ? external clock source input. al ways associated with osc1 pin function. oscillator crystal output. connects to crystal or resonator in crystal oscillator mode. optiona lly functions as clko in rc and ec modes. always associated with osc2 pin function. cn0-cn7 i st input change notification inputs. can be software programmed for internal weak pull-ups on all inputs. emud emuc emud1 emuc1 emud2 emuc2 emud3 emuc3 i/o i/o i/o i/o i/o i/o i/o i/o st st st st st st st st icd primary communication c hannel data input/output pin. icd primary communication c hannel clock input/output pin. icd secondary communication ch annel data input/output pin. icd secondary communication ch annel clock input/output pin. icd tertiary communication channel data input/output pin. icd tertiary communication c hannel clock i nput/output pin. icd quaternary communication c hannel data input/output pin. icd quaternary communication c hannel clock input/output pin. ic1-ic2 i st capture inputs 1 through 2. int0 int1 int2 i i i st st st external interrupt 0. external interrupt 1. external interrupt 2. lvdin i analog low voltage detect reference voltage input pin. mclr i/p st master clear (reset) input or programming voltage input. this pin is an active low reset to the device. oc1-oc2 ocfa o i ? st compare outputs 1 through 2. compare fault a input. osc1 osc2 i i/o st/cmos ? oscillator crystal input. st buffe r when configured in rc mode; cmos otherwise. oscillator crystal output. connects to crystal or resonator in crystal oscillator mode. optiona lly functions as clko in rc and ec modes. pgd pgc i/o i st st in-circuit serial progra mming data input/output pin. in-circuit serial prog ramming clock input pin. rb0-rb9 i/o st portb is a bidirectional i/o port. rc13-rc15 i/o st portc is a bidirectional i/o port. rd0, rd8-rd9 i/o st portd is a bidirectional i/o port. rf2-rf5 i/o st portf is a bidirectional i/o port. sck1 sdi1 sdo1 ss 1 i/o i o i st st ? st synchronous serial clock input/output for spi1. spi1 data in. spi1 data out. spi1 slave synchronization. legend: cmos = cmos compatible input or output analog= analog input st = schmitt trigger input with cmos levelso= output i = input p = power ? 2005 microchip technology inc. preliminary ds70139c-page 15 dspic30f2011/2012/3012/3013 scl sda i/o i/o st st synchronous serial clock input/output for i 2 c. synchronous serial data input/output for i 2 c. sosco sosci o i ? st/cmos 32 khz low power oscillator crystal output. 32 khz low power oscillator crystal input. st buffer when configured in rc mode; cmos otherwise. t1ck t2ck i i st st timer1 external clock input. timer2 external clock input. u1rx u1tx u1arx u1atx u2rx u2tx i o i o i o st ? st ? st ? uart1 receive. uart1 transmit. uart1 alternate receive. uart1 alternate transmit. uart2 receive. uart2 transmit. v dd p ? positive supply for logic and i/o pins. v ss p ? ground reference for logic and i/o pins. v ref + i analog analog voltage reference (high) input. v ref - i analog analog voltage reference (low) input. table 1-1: pinout i/o descriptions (continued) pin name pin type buffer type description legend: cmos = cmos compatible input or output analog= analog input st = schmitt trigger input with cmos levelso= output i = input p = power dspic30f2011/2012/3012/3013 ds70139c-page 16 preliminary ? 2005 microchip technology inc. notes: ? 2005 microchip technology inc. preliminary ds70139c-page 17 dspic30f2011/2012/3012/3013 2.0 cpu architecture overview this section is an overview of the cpu architecture of the dspic30f. the core has a 24-bit instruction word. the program counter (pc) is 23-bits wide with the least significant (ls) bit always clear (see section 3.1). the most significant (ms) bit is ignored during normal program execution, except for certain specialized instructions. thus, the pc can address up to 4m instruction words of user program space. an instruction pre-fetch mechanism helps maintain throughput. program loop cons tructs, free from loop count management overhead, are supported using the do and repeat instructions, both of which are inter- ruptible at any point. 2.1 core overview the working register array cons ists of 16 x 16-bit regis- ters, each of which can act as data, address or offset registers. one working register (w15) operates as a software stack pointer for interrupts and calls. the data space is 64 kbytes (32k words) and is split into two blocks, referred to as x and y data memory. each block has its own independent address genera- tion unit (agu). most in structions operate solely through the x memory, ag u, which provides the appearance of a single unified data space. the multiply-accumulate ( mac ) class of dual source dsp instructions operate thro ugh both the x and y agus, splitting the data address space into two parts (see section 3.2). the x and y data space boundary is device specific and cannot be altered by the user. each data word consists of 2 bytes, and most instructions can address data either as words or bytes. two ways to access data in program memory are: ? the upper 32 kbytes of data space memory can be mapped into the lower half (user space) of program space at any 16k program word bound- ary, defined by the 8-bi t program space visibility page (psvpag) register. thus any instruction can access program space as if it were data space, with a limitation that the access requires an additional cycle. only the lower 16 bits of each instruction word can be accessed using this method. ? linear indirect access of 32k word pages within program space is also po ssible using any working register, via table read and write instructions. table read and write instructions can be used to access all 24 bits of an instruction word. overhead-free circular buff ers (modulo addressing) are supported in both x and y address spaces. this is primarily intended to remove the loop overhead for dsp algorithms. the x agu also supports bit-reversed addressing on destination effective addresses to greatly simplify input or output data reordering for radix-2 fft algorithms. refer to section 4.0 for details on modulo and bit-reversed addressing. the core supports inheren t (no operand), relative, literal, memory direct, register direct, register indirect, register offset and literal offset addressing modes. instructions are associated with predefined addressing modes, depend ing upon their functional requirements. for most instructions, the core is capable of executing a data (or program data) memory read, a working reg- ister (data) read, a data me mory write and a program (instruction) memory read pe r instruction cycle. as a result, 3-operand instructi ons are supported, allowing c = a+b operations to be executed in a single cycle. a dsp engine has been included to significantly enhance the core arithmetic capability and throughput. it features a high speed 17- bit by 17-bit multiplier, a 40-bit alu, two 40-bit saturating accumulators and a 40-bit bidirectional barrel shif ter. data in the accumula- tor or any working register can be shifted up to 15 bits right, or 16 bits left in a single cycle. the dsp instruc- tions operate seamlessly with all other instructions and have been designed for opti mal real-time performance. the mac class of instructions can concurrently fetch two data operands from memory while multiplying two w registers. to enable this concurrent fetching of data operands, the data space has been split for these instructions and linear fo r all others. this has been achieved in a transparent and flexible manner, by ded- icating certain working regist ers to each address space for the mac class of instructions. note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descr iptions and general device functionality, refer to the dspic30f family reference manual (ds70046). for more information on the device instruction set and programming, refer to the dspic30f programmer?s reference manual (ds70030). dspic30f2011/2012/3012/3013 ds70139c-page 18 preliminary ? 2005 microchip technology inc. the core does not support a multi-stage instruction pipeline. however, a single stage instruction pre-fetch mechanism is used, whic h accesses and partially decodes instructions a cycl e ahead of execution, in order to maximize avail able execution time. most instructions execute in a single cycle with certain exceptions. the core features a vect ored exception processing structure for traps and inte rrupts, with 62 independent vectors. the exceptions consist of up to 8 traps (of which 4 are reserved) and 54 interrupts. each interrupt is prioritized based on a us er assigned priority between 1 and 7 (1 being the lowest priority and 7 being the highest), in conjunction wi th a predetermined ?natural order?. traps have fixed priori ties ranging from 8 to 15. 2.2 programmer?s model the programmer?s model is shown in figure 2-1 and consists of 16 x 16-bit work ing registers (w0 through w15), 2 x 40-bit accumu lators (acca and accb), status register (sr), data table page register (tblpag), program space visibility page register (psvpag), do and repeat registers (dostart, doend, dcount and rcount) and program counter (pc). the working r egisters can act as data, address or offset registers. all registers are memory mapped. w0 acts as the w register for file register addressing. some of these registers have a shadow register asso- ciated with each of them, as shown in figure 2-1. the shadow register is used as a temporary holding register and can transfer its contents to or from its host register upon the occurrence of an event. none of the shadow registers are accessible directly. the following rules apply for transfer of regist ers into and out of shadows. ? push.s and pop.s w0, w1, w2, w3, sr (dc, n, ov, z and c bits only) are transferred. ? do instruction dostart, doend, dcount shadows are pushed on loop start, and popped on loop end. when a byte operation is performed on a working reg- ister, only the least significant byte of the target regis- ter is affected. however, a benefit of memory mapped working registers is that both the least and most sig- nificant bytes can be manipulated through byte wide data memory space accesses. 2.2.1 software stack pointer/ frame pointer the dspic ? devices contain a software stack. w15 is the dedicated software stack pointer (sp), and will be automatically modified by exception processing and subroutine calls and returns. however, w15 can be ref- erenced by any instruction in the same manner as all other w registers. this simp lifies the reading, writing and manipulation of the stac k pointer (e.g., creating stack frames). w15 is initialized to 0x08 00 during a reset. the user may reprogram the sp duri ng initialization to any location within data space. w14 has been dedicated as a stack frame pointer as defined by the lnk and ulnk instructions. however, w14 can be referenced by any instruction in the same manner as all other w registers. 2.2.2 status register the dspic core has a 16-bit status register (sr), the ls byte of which is refe rred to as the sr low byte (srl) and the ms byte as the sr high byte (srh). see figure 2-1 for sr layout. srl contains all the mcu al u operation status flags (including the z bit), as well as the cpu interrupt prior- ity level status bits, ipl<2:0> and the repeat active status bit, ra. during exception processing, srl is concatenated with the ms by te of the pc to form a complete word value which is then stacked. the upper byte of the stat us register contains the dsp adder/subtracter status bits, the do loop active bit (da) and the digit carry (dc) status bit. 2.2.3 program counter the program counter is 23-b its wide; bit 0 is always clear. therefore, the pc can address up to 4m instruction words. note: in order to protect against misaligned stack accesses, w15<0> is always clear. ? 2005 microchip technology inc. preliminary ds70139c-page 19 dspic30f2011/2012/3012/3013 figure 2-1: programmer?s model tabpag pc22 pc0 7 0 d0 d15 program counter data table page address status register working registers dsp operand registers w1 w2 w3 w4 w5 w6 w7 w8 w9 w10 w11 w12/dsp offset w13/dsp write back w14/frame pointer w15/stack pointer dsp address registers ad39 ad0 ad31 dsp accumulators acca accb psvpag 7 0 program space visibility page address z 0 oa ob sa sb rcount 15 0 repeat loop counter dcount 15 0 do loop counter dostart 22 0 do loop start address ipl2 ipl1 splim stack pointer limit register ad15 srl push.s shadow do shadow oab sab 15 0 core configuration register legend corcon da dc ra n tblpag psvpag ipl0 ov w0/wreg srh do loop end address doend 22 c dspic30f2011/2012/3012/3013 ds70139c-page 20 preliminary ? 2005 microchip technology inc. 2.3 divide support the dspic devices feature a 16/16-bit signed fractional divide operation, as well as 32/16-bit and 16/16-bit signed and unsigned integer divide operations, in the form of single instruction it erative divides. the following instructions and data sizes are supported: 1. divf - 16/16 signed fractional divide 2. div.sd - 32/16 signed divide 3. div.ud - 32/16 unsigned divide 4. div.sw - 16/16 signed divide 5. div.uw - 16/16 unsigned divide the 16/16 divides are similar to the 32/16 (same number of iterations), but the dividend is either zero-extended or sign-extended during the first iteration. the divide instructions must be executed within a repeat loop. any other form of execution (e.g., a series of discrete divide in structions) will not function correctly because the instruction flow depends on rcount. the divide instruction does not automatically set up the rcount value and it must, therefore, be explicitly and correctly specified in the repeat instruc- tion as shown in table 2-1 ( repeat will execute the tar- get instruction {operand value+1} times). the repeat loop count must be setup for 18 iterations of the div/ divf instruction. thus, a complete divide operation requires 19 cycles. table 2-1: divide instructions note: the divide flow is interruptible. however, the user needs to save the context as appropriate. instruction function divf signed fractional divide: wm/wn w0; rem w1 div.sd signed divide: (wm+1:wm)/wn w0; rem w1 div.sw or div.s signed divide: wm/wn w0; rem w1 div.ud unsigned divide: (wm+1:wm)/wn w0; rem w1 div.uw or div.u unsigned divide: wm/wn w0; rem w1 ? 2005 microchip technology inc. preliminary ds70139c-page 21 dspic30f2011/2012/3012/3013 2.4 dsp engine the dsp engine consists of a high speed 17-bit x 17-bit multiplier, a barrel shifter and a 40-bit adder/ subtracter (with two target accumulators, round and saturation logic). the dsp engine also has the capability to perform inherent accumulator-to-accumulator operations, which require no additional data. these instructions are add, sub and neg . the dspic30f is a single-c ycle instruction flow archi- tecture, threfore, concurrent operation of the dsp engine with mcu instruction flow is not possible. however, some mcu alu and dsp engine resources may be used concurrently by the same instruction (e.g., ed, edac). the dsp engine has various options selected through various bits in the cpu co re configuration register (corcon), as listed below: 1. fractional or integer dsp multiply (if). 2. signed or unsigned dsp multiply (us). 3. conventional or convergent rounding (rnd). 4. automatic saturation on/off for acca (sata). 5. automatic saturation on/off for accb (satb). 6. automatic saturation on/off for writes to data memory (satdw). 7. accumulator saturation mode selection (accsat). a block diagram of the dsp engine is shown in figure 2-2. note: for corcon layout, see table 3-3. table 2-2: dsp instruction summary instruction algebraic operation acc wb? clr a = 0 yes ed a = (x ? y) 2 no edac a = a + (x ? y) 2 no mac a = a + (x * y) yes mac a = a + x 2 no movsac no change in a yes mpy a = x * y no mpy.n a = ? x * y no msc a = a ? x * y yes dspic30f2011/2012/3012/3013 ds70139c-page 22 preliminary ? 2005 microchip technology inc. figure 2-2: dsp engine block diagram zero backfill sign-extend barrel shifter 40-bit accumulator a 40-bit accumulator b round logic x data bus to/from w array adder saturate negate 32 32 33 16 16 16 16 40 40 40 40 s a t u r a t e y data bus 40 carry/borrow out carry/borrow in 16 40 multiplier/scaler 17-bit ? 2005 microchip technology inc. preliminary ds70139c-page 23 dspic30f2011/2012/3012/3013 2.4.1 multiplier the 17 x 17-bit multiplier is capable of signed or unsigned operation and can mu ltiplex its output using a scaler to support either 1.31 fractional (q31) or 32-bit integer results. unsigned operands are zero-extended into the 17th bit of the multiplier input value. signed operands are sign-extended in to the 17th bit of the mul- tiplier input value. the outpu t of the 17 x 17-bit multi- plier/scaler is a 33-bit valu e which is sign-extended to 40 bits. integer data is inherently represented as a signed two?s complement value, where the msb is defined as a sign bit. gene rally speaking, the range of an n-bit two?s complement integer is -2 n-1 to 2 n-1 ? 1. for a 16-bit integer, the da ta range is -32768 (0x8000) to 32767 (0x7fff) including ? 0 ?. for a 32-bit integer, the data range is -2,1 47,483,648 (0x8000 0000) to 2,147,483,645 (0x7fff ffff). when the multiplier is config ured for fractional multipli- cation, the data is represented as a two?s complement fraction, where the msb is de fined as a sign bit and the radix point is implied to lie just after the sign bit (qx for- mat). the range of an n-bit two?s complement fraction with this implied radix po int is -1.0 to (1 ? 2 1-n ). for a 16-bit fraction, the q15 data range is -1.0 (0x8000) to 0.999969482 (0x7fff) including ? 0 ? and has a preci- sion of 3.01518x10 -5 . in fractional mode, the 16x16 multiply operation generates a 1.31 product which has a precision of 4.65661 x 10 -10 . the same multiplier is used to support the mcu multi- ply instructions which include integer 16-bit signed, unsigned and mixed sign multiplies. the mul instruction may be directed to use byte or word sized operands. byte oper ands will direct a 16-bit result, and word operands will direct a 32-bit result to the specified register(s) in the w array. 2.4.2 data accumulators and adder/subtracter the data accumulator consists of a 40-bit adder/ subtracter with automatic si gn extension logic. it can select one of two accumulators (a or b) as its pre- accumulation source and post-accumulation destina- tion. for the add and lac instructions, the data to be accumulated or loaded can be optionally scaled via the barrel shifter, prior to accumulation. 2.4.2.1 adder/subtracter, overflow and saturation the adder/subtracter is a 40-b it adder with an optional zero input into one side an d either true, or complement data into the other input. in the case of addition, the carry/borrow input is active high and the other input is true data (not complemented), whereas in the case of subtraction, the carry/borrow input is active low and the other input is complemented. the adder/subtracter generates overflow status bits sa/sb and oa/ob, which are latched and reflecte d in the status register: ? overflow from bit 39: this is a catastrophic overflow in which the sign of the accumulator is destroyed. ? overflow into guard bits 32 through 39: this is a recoverable overflow. this bit is set whenever all the guard bits bits are not identical to each other. the adder has an addition al saturation block which controls accumulator data saturation, if selected. it uses the result of the adde r, the overflow status bits described above, and the sata/b (corcon<7:6>) and accsat (corcon<4>) mode control bits to determine when and to what value to saturate. six status register bits hav e been provided to support saturation and overflow; they are: 1. oa: acca overflowed into guard bits 2. ob: accb overflowed into guard bits 3. sa: acca saturated (bit 31 overflow and saturation) or acca overflowed into guard bits and saturated (bit 39 overflow and saturation) 4. sb: accb saturated (bit 31 overflow and saturation) or accb overflowed into guard bits and saturated (bit 39 overflow and saturation) 5. oab: logical or of oa and ob 6. sab: logical or of sa and sb the oa and ob bits are modified each time data passes through the adder/s ubtracter. when set, they indicate that the most rece nt operation has overflowed into the accumulator guard bits (bits 32 through 39). the oa and ob bits can al so optionally generate an arithmetic warning trap when set and the correspond- ing overflow trap flag ena ble bit (ovaten, ovbten) in the intcon1 register (refer to section 8.0) is set. this allows the user to take i mmediate action, for example, to correct system gain. dspic30f2011/2012/3012/3013 ds70139c-page 24 preliminary ? 2005 microchip technology inc. the sa and sb bits are modified each time data passes through the adder/subtracter but can only be cleared by the user. when se t, they indicate that the accumulator has overflowed its maximum range (bit 31 for 32-bit saturation, or bit 39 for 40-bit saturation) and will be saturated (if satura tion is enabled). when satu- ration is not enabled, sa and sb default to bit 39 over- flow and thus indicate that a catastrophic overflow has occurred. if the covte bit in the intcon1 register is set, sa and sb bits will gene rate an arithmetic warning trap when saturation is disabled. the overflow and saturation status bits can optionally be viewed in the status re gister (sr) as the logical or of oa and ob (in bit oa b) and the logical or of sa and sb (in bit sab). this a llows programmers to check one bit in the status regist er to determine if either accumulator has overflowed, or one bit to determine if either accumulator has satura ted. this would be useful for complex number arithmetic which typically uses both the accumulators. the device supports three saturation and overflow modes: 1. bit 39 overflow and saturation: when bit 39 overflow and saturation occurs, the saturation logic loads the maximally positive 9.31 (0x7fffffffff), or maximally negative 9.31 value (0x8000000000) into the target accumula- tor. the sa or sb bit is set and remains set until cleared by the user. this is referred to as ?super saturation? and provides protection against erro- neous data, or unexpected algorithm problems (e.g., gain calculations). 2. bit 31 overflow and saturation: when bit 31 overflow and saturation occurs, the saturation logic then loads the maximally posi- tive 1.31 value (0x007fffffff), or maximally negative 1.31 value (0 x0080000000) into the target accumulator. the sa or sb bit is set and remains set until cleared by the user. when this saturation mode is in ef fect, the guard bits are not used (so the oa, ob or oab bits are never set). 3. bit 39 catastrophic overflow: the bit 39 overflow status bit from the adder is used to set the sa or sb bit which remain set until cleared by the user. no saturation operation is performed and the accumulator is allowed to overflow (destroying its si gn). if the covte bit in the intcon1 register is set, a catastrophic overflow can initiate a trap exception. 2.4.2.2 accumulator ?write back? the mac class of instructions (with the exception of mpy, mpy.n, ed and edac ) can optionally write a rounded version of the high word (bits 31 through 16) of the accumulator that is not targeted by the instruction into data space memory. the write is performed across the x bus into combined x and y address space. the following addressing modes are supported: 1. w13, register direct: the rounded contents of the non-target accumulator are written into w13 as a 1.15 fraction. 2. [w13]+=2, register indirect with post-increment: the rounded contents of the non-target accumu- lator are written into th e address pointed to by w13 as a 1.15 fraction. w13 is then incremented by 2 (for a word write). 2.4.2.3 round logic the round logic is a combinational block which per- forms a conventional (bias ed) or convergent (unbi- ased) round function during an accumulator write (store). the round mode is determined by the state of the rnd bit in the corcon register. it generates a 16- bit, 1.15 data value which is passed to the data space write saturation logic. if rou nding is not indicated by the instruction, a truncated 1.15 data value is stored and the ls word is simply discarded. conventional rounding takes bit 15 of the accumulator, zero-extends it and adds it to the accxh word (bits 16 through 31 of the accumulator). if the accxl word (bits 0 through 15 of the accumulator) is between 0x8000 and 0xffff (0x8000 included), accxh is incremented. if accxl is between 0x0000 and 0x7fff, accxh is left unchanged. a consequence of this algo- rithm is that over a succession of random rounding operations, the value will te nd to be biased slightly positive. convergent (or unbiased) r ounding operates in the same manner as conventio nal rounding, except when accxl equals 0x8000. if this is the case, the ls bit (bit 16 of the accumulator) of accxh is examined. if it is ? 1 ?, accxh is incremented. if it is ? 0 ?, accxh is not modified. assuming that bit 16 is effectively random in nature, this scheme will remove any rounding bias that may accumulate. the sac and sac.r instructions store either a trun- cated ( sac ) or rounded ( sac.r ) version of the contents of the target accumulator to data memory via the x bus (subject to data saturation, see section 2.4.2.4). note that for the mac class of instructions, the accumulator write back operation will function in the same manner, addressing combined mcu (x and y) data space though the x bus. for this class of instructions, the data is always subject to rounding. ? 2005 microchip technology inc. preliminary ds70139c-page 25 dspic30f2011/2012/3012/3013 2.4.2.4 data space write saturation in addition to adder/subtracte r saturation, writes to data space may also be saturate d but without affecting the contents of the source ac cumulator. the data space write saturation logic block accepts a 16-bit, 1.15 frac- tional value from the round logic block as its input, together with overflow stat us from the original source (accumulator) and the 16-bit round adder. these are combined and used to sele ct the appropriate 1.15 fractional value as output to write to data space memory. if the satdw bit in the corcon register is set, data (after rounding or truncation) is tested for overflow and adjusted accordingly, for input data greater than 0x007fff, data written to memory is forced to the max- imum positive 1.15 value, 0x7fff. for input data less than 0xff8000, data written to memory is forced to the maximum negative 1.15 val ue, 0x8000. the ms bit of the source (bit 39) is used to determine the sign of the operand being tested. if the satdw bit in the corcon register is not set, the input data is always passed through unmodified under all conditions. 2.4.3 barrel shifter the barrel shifter is capabl e of performing up to 16-bit arithmetic or logic right shifts, or up to 16-bit left shifts in a single cycle. the source can be either of the two dsp accumulators, or the x bus (to support multi-bit shifts of register or memory data). the shifter requires a signed binary value to determine both the magnitude (number of bits) and direction of the shift operation. a positive value will shift the operand right. a negative value will shift the operand left. a value of ? 0 ? will not modify the operand. the barrel shifter is 40-bits wide, thereby obtaining a 40-bit result for dsp shift ope rations and a 16-bit result for mcu shift operations. data from the x bus is pre- sented to the barrel shifter between bit positions 16 to 31 for right shifts, and bit positio ns 0 to 16 for left shifts. dspic30f2011/2012/3012/3013 ds70139c-page 26 preliminary ? 2005 microchip technology inc. notes: ? 2005 microchip technology inc. preliminary ds70139c-page 27 dspic30f2011/2012/3012/3013 3.0 memory organization 3.1 program address space the program address space is 4m instruction words. the program space memory map for the dspi30f2011/ 2012 is shown in figure 3-1. the program space memory map for the dspi 30f3012/3013 is shown in figure 3-2. program memory is addressa ble by a 24-bit value from either the 23-bit pc, table instruction effective address (ea), or data space ea, when program space is mapped into data space as defined by table 3-1. note that the program space addr ess is incremented by two between successive program words in order to provide compatibility with data space addressing. user program space access is restricted to the lower 4m instruction word add ress range (0x000000 to 0x7ffffe) for all accesses other than tblrd/tblwt , which use tblpag<7> to dete rmine user or configura- tion space access. in table 3-1, program space address construction, bit 23 allows access to the device id, the user id and the configuration bits. otherwise, bit 23 is always clear. note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descr iptions and general device functionality, refer to the dspic30f family reference manual (ds70046). for more information on the device instruction set and programming, refer to the dspic30f programmer?s reference manual (ds70030). dspic30f2011/2012/3012/3013 ds70139c-page 28 preliminary ? 2005 microchip technology inc. figure 3-1: dspic30f2011/2012 program space memory map figure 3-2: dspic30f3012/3013 program space memory map reset - target address user memory space 000000 00007e 000002 000080 device configuration user flash program memory 002000 001ffe configuration memory space (4k instructions) 800000 f80000 registers f8000e f80010 devid (2) fefffe ff0000 fffffe reserved f7fffe reserved (read ? 0 ?s) 8005fe 800600 unitid (32 instr.) vector tables 8005be 8005c0 reset - goto instruction 000004 reserved 7ffffe reserved 000100 0000fe 000084 alternate vector table reserved interrupt vector table reset - target address user memory space 000000 00007e 000002 000080 device configuration user flash program memory 004000 003ffe configuration memory space data eeprom (8k instructions) (1 kbyte) 800000 f80000 registers f8000e f80010 devid (2) fefffe ff0000 fffffe reserved f7fffe reserved 7ffc00 7ffbfe (read ? 0 ?s) 8005fe 800600 unitid (32 instr.) vector tables 8005be 8005c0 reset - goto instruction 000004 reserved 7ffffe reserved 000100 0000fe 000084 alternate vector table reserved interrupt vector table ? 2005 microchip technology inc. preliminary ds70139c-page 29 dspic30f2011/2012/3012/3013 table 3-1: program space address construction figure 3-3: data access from program space address generation access type access space program space address <23> <22:16> <15> <14:1> <0> instruction access user 0 pc<22:1> 0 tblrd/tblwt user (tblpag<7> = 0 ) tblpag<7:0> data ea<15:0> tblrd/tblwt configuration (tblpag<7> = 1 ) tblpag<7:0> data ea<15:0> program space visibility user 0 psvpag<7:0> data ea<14:0> 0 program counter 23 bits 1 psvpag reg 8 bits ea 15 bits program using select tblpag reg 8 bits ea 16 bits using byte 24-bit ea 0 0 1/0 select user/ configuration table instruction program space counter using space select visibility note: program space visibility cannot be used to access bits <23:16> of a word in program memory. dspic30f2011/2012/3012/3013 ds70139c-page 30 preliminary ? 2005 microchip technology inc. 3.1.1 data access from program memory using table instructions this architecture fetches 24-bit wide program memory. consequently, instructions are always aligned. however, as the architecture is modified harvard, data can also be present in program space. there are two methods by which program space can be accessed: via special tabl e instructions, or through the remapping of a 16k word program space page into the upper half of data sp ace (see section 3.1.2). the tblrdl and tblwtl instructions offer a direct method of reading or writing the ls word of any address within program space, without going through data space. the tblrdh and tblwth instructions are the only method whereby the upper 8 bits of a program space word can be accessed as data. the pc is incremented by two for each successive 24-bit program word. this allows program memory addresses to directly map to data space addresses. program memory can thus be regarded as two 16-bit word wide address spaces, re siding side by side, each with the same address range. tblrdl and tblwtl access the space which contains the ls data word, and tblrdh and tblwth access the space which contains the ms data byte. figure 3-3 shows how the ea is created for table oper- ations and data space accesses (psv = 1 ). here, p<23:0> refers to a program space word, whereas d<15:0> refers to a data space word. a set of table instructions are provided to move byte or word sized data to and from program space. 1. tblrdl: table read low word: read the ls word of the program address; p<15:0> maps to d<15:0>. byte: read one of the ls bytes of the program address; p<7:0> maps to the destination byte when byte select = 0 ; p<15:8> maps to the destination byte when byte select = 1 . 2. tblwtl: table write low (refer to section 5.0 for details on flash programming) 3. tblrdh: table read high word: read the ms word of the program address; p<23:16> maps to d<7:0>; d<15:8> will always be = 0 . byte: read one of the ms bytes of the program address; p<23:16> maps to the destination byte when byte select = 0 ; the destination byte will always be = 0 when byte select = 1 . 4. tblwth: table write high (refer to section 5.0 for details on flash programming) figure 3-4: program data table access (ls word) 0 8 16 pc address 0x000000 0x000002 0x000004 0x000006 23 00000000 00000000 00000000 00000000 program memory ?phantom? byte (read as ? 0 ?) tblrdl.w tblrdl.b (wn<0> = 1) tblrdl.b (wn<0> = 0) ? 2005 microchip technology inc. preliminary ds70139c-page 31 dspic30f2011/2012/3012/3013 figure 3-5: program data table access (ms byte) 3.1.2 data access from program memory using program space visibility the upper 32 kbytes of data space may optionally be mapped into any 16k word program space page. this provides transparent access of stored constant data from x data space without the need to use special instructions (i.e., tblrdl/h , tblwtl/h instructions). program space access through the data space occurs if the ms bit of the data sp ace ea is set and program space visibility is enabled by setting the psv bit in the core control register (corcon). the functions of corcon are discussed in section 2.4, dsp engine. data accesses to this area add an additional cycle to the instruction being executed, since two program memory fetches are required. note that the upper half of addressable data space is always part of the x data space. therefore, when a dsp operation uses program space mapping to access this memory region, y data space should typically con- tain state (variable) data for dsp operations, whereas x data space should typically contain coefficient (constant) data. although each data space address, 0x8000 and higher, maps directly into a co rresponding program memory address (see figure 3-6), only the lower 16 bits of the 24-bit program word are used to contain the data. the upper 8 bits should be pr ogrammed to force an illegal instruction to maintain machine robustness. refer to the programmer?s referenc e manual (ds70030) for details on instruction encoding. note that by incrementi ng the pc by 2 for each program memory word, the ls 15 bits of data space addresses directly map to th e ls 15 bits in the corre- sponding program space a ddresses. the remaining bits are provided by the pr ogram space visibility page register, psvpag<7:0>, as shown in figure 3-6. for instructions that us e psv which are executed outside a repeat loop: ? the following instruct ions will require one instruction cycle in addition to the specified execution time: - mac class of instructions with data operand pre-fetch - mov instructions - mov.d instructions ? all other instructions wi ll require two instruction cycles in addition to the specified execution time of the instruction. for instructions that us e psv which are executed inside a repeat loop: ? the following instances wi ll require two instruction cycles in addition to the specified execution time of the instruction: - execution in the first iteration - execution in the last iteration - execution prior to exiting the loop due to an interrupt - execution upon re-entering the loop after an interrupt is serviced ? any other iteration of th e repeat loop will allow the instruction accessing data, using psv, to execute in a single cycle. 0 8 16 pc address 0x000000 0x000002 0x000004 0x000006 23 00000000 00000000 00000000 00000000 program memory ?phantom? byte (read as ? 0 ?) tblrdh.w tblrdh.b (wn<0> = 1) tblrdh.b (wn<0> = 0) note: psv access is temporarily disabled during table reads/writes. dspic30f2011/2012/3012/3013 ds70139c-page 32 preliminary ? 2005 microchip technology inc. figure 3-6: data space window into program space operation 23 15 0 psvpag (1) 15 15 ea<15> = 0 ea<15> = 1 16 data space ea data space program space 8 15 23 0x0000 0x8000 0xffff 0x00 0x001fff data read upper half of data space is mapped into program space 0x001200 address concatenation bset corcon,#2 ; set psv bit mov #0x0, w0 ; set psvpag register mov w0, psvpag mov 0x9200, w0 ; access program memory location ; using a data space access note: psvpag is an 8-bit register, containing bi ts <22:15> of the program space address. 0x000000 ? 2005 microchip technology inc. preliminary ds70139c-page 33 dspic30f2011/2012/3012/3013 3.2 data address space the core has two data spaces. the data spaces can be considered either separate (for some dsp instruc- tions), or as one unified li near address range (for mcu instructions). the data spaces are accessed using two address generation units (agus) and separate data paths. 3.2.1 data space memory map the data space memory is split into two blocks, x and y data space. a key element of this architecture is that y space is a subset of x sp ace, and is fully contained within x space. in order to provide an apparent linear addressing space, x and y spaces have contiguous addresses. when executing any instructio n other than one of the mac class of instructions, the x block consists of the 64- kbyte data address space (i ncluding all y addresses). when executing one of the mac class of instructions, the x block consists of t he 64-kbyte data address space excluding the y address block (for data reads only). in other words, all ot her instructions regard the entire data memory as one composite address space. the mac class instructions extract the y address space from data space and address it using eas sourced from w10 and w11. the remaining x data space is addressed using w8 and w9. both address spaces are concurrently accessed only with the mac class instructions. the data space memory map for the dspic30f2011 and dspic30f2012 is shown in figure 3-7. the data space memory map for the dspic30f3012 and DSPIC30F3013 is sh own in figure 3-8. figure 3-7: dspic30f2011/2012 data space memory map 0x0000 0x07fe 0x09fe 0xfffe ls byte address 16 bits lsb msb ms byte address 0x0001 0x07ff 0x09ff 0xffff 0x8001 0x8000 optionally mapped into program memory 0x0bff 0x0bfe 0x0c00 0x0c01 0x0801 0x0800 0x0a01 0x0a00 near data 0x1ffe 0x1fff 2 kbyte sfr space 1 kbyte sram space 8 kbyte space x data unimplemented (x) sfr space x data ram (x) y data ram (y) dspic30f2011/2012/3012/3013 ds70139c-page 34 preliminary ? 2005 microchip technology inc. figure 3-8: dspic30f3012/3013 data space memory map 0x0000 0x07fe 0x0bfe 0xfffe ls byte address 16 bits lsb msb ms byte address 0x0001 0x07ff 0x0bff 0xffff 0x8001 0x8000 optionally mapped into program memory 0x0fff 0x0ffe 0x1000 0x1001 0x0801 0x0800 0x0c01 0x0c00 near data 0x1ffe 0x1fff 2 kbyte sfr space 2 kbyte sram space 8 kbyte space x data unimplemented (x) sfr space x data ram (x) y data ram (y) ? 2005 microchip technology inc. preliminary ds70139c-page 35 dspic30f2011/2012/3012/3013 figure 3-9: data space for mcu and dsp ( mac class) instructions example sfr space (y space) x space sfr space unused x space x space y space unused unused non- mac class ops (read/write) mac class ops (read) indirect ea using any w indirect ea usin g w8, w9 indirect ea using w10, w11 mac class ops (write) dspic30f2011/2012/3012/3013 ds70139c-page 36 preliminary ? 2005 microchip technology inc. 3.2.2 data spaces the x data space is used by all instructions and sup- ports all addressing modes. there are separate read and write data buses. the x read data bus is the return data path for all instructions that view data space as combined x and y address sp ace. it is also the x address space data path for the dual operand read instructions ( mac class). the x write data bus is the only write path to data space for all instructions. the x data space also supp orts modulo addressing for all instructions, subject to addressing mode restric- tions. bit-reversed addressing is only supported for writes to x data space. the y data space is used in concert with the x data space by the mac class of instructions ( clr, ed, edac, mac, movsac, mpy, mpy.n and msc ) to provide two concurrent data read paths. no writes occur across the y bus. this class of instructions dedi- cates two w register pointers, w10 and w11, to always address y data space, independent of x data space, whereas w8 and w9 always address x data space. note that during accumulator write back, the data address space is considered a combination of x and y data spaces, so the write occurs across the x bus. consequently, the write can be to any address in the entire data space. the y data space can only be used for the data pre- fetch operation associated with the mac class of instructions. it also suppor ts modulo addressing for automated circular buffers. of course, all other instruc- tions can access the y data address space through the x data path as part of the composite linear space. the boundary between the x and y data spaces is defined as shown in figure 3-8 and is not user pro- grammable. should an ea po int to data outside its own assigned address space, or to a location outside phys- ical memory, an all zero word/byte will be returned. for example, although y addres s space is visible by all non- mac instructions using any addressing mode, an attempt by a mac instruction to fetch data from that space using w8 or w9 (x sp ace pointers) will return 0x0000. table 3-2: effect of invalid memory accesses all effective addresses are 16 bits wide and point to bytes within the data space. therefore, the data space address range is 64 kbytes or 32k words. 3.2.3 data space width the core data width is 16 bi ts. all internal registers are organized as 16-bit wide word s. data space memory is organized in byte addressa ble, 16-bit wide blocks. 3.2.4 data alignment to help maintain backward compatibility with picmicro ? devices and improve data space memory usage efficiency, the dspic30f instruction set supports both word and byte operations. data is aligned in data memory and registers as word s, but all data space eas resolve to bytes. data byte reads will read the complete word which contains the byte, using the ls bit of any ea to determine which byte to select. the selected byte is placed onto the ls byte of the x data path (no byte accesses are possible from the y data path as the mac class of instruction can only fetch words). that is, data memory and registers are organized as two parallel byte wide entities with shared (word) address decode but separate write lines. data byte writes only write to the corresponding side of t he array or register which matches the byte address. as a consequence of this byte accessibility, all effective address calculations (includi ng those generated by the dsp operations which are restricted to word sized data) are internally scaled to step through word aligned memory. for example, the core would recognize that post-modified register indirect addressing mode [ws++] will result in a value of ws+1 for byte operations and ws+2 for word operations. all word accesses must be al igned to an even address. misaligned word data fetches are not supported so care must be taken when mi xing byte and word opera- tions, or translating from 8-bit mcu code. should a mis- aligned read or write be a ttempted, an address error trap will be generated. if the error occurred on a read, the instruction underway is completed, whereas if it occurred on a write, the instruction will be executed but the write will not occur. in either case, a trap will then be executed, allowing the syst em and/or user to exam- ine the machine state prior to execution of the address fault. figure 3-10: data alignment attempted operation data returned ea = an unimplemented address 0x0000 w8 or w9 used to access y data space in a mac instruction 0x0000 w10 or w11 used to access x data space in a mac instruction 0x0000 15 8 7 0 0001 0003 0005 0000 0002 0004 byte1 byte 0 byte3 byte 2 byte5 byte 4 ls byte ms byte ? 2005 microchip technology inc. preliminary ds70139c-page 37 dspic30f2011/2012/3012/3013 all byte loads into any w re gister are loaded into the ls byte. the msb is not modified. a sign-extend ( se ) instruction is provided to allow users to translate 8-bit si gned data to 16-bit signed values. alternatively, for 16-bit unsigned data, users can clear the msb of any w register by executing a zero-extend ( ze ) instruction on the appropriate address. although most instructions are capable of operating on word or byte data sizes, it should be noted that some instructions, including t he dsp instructions, operate only on words. 3.2.5 near data space an 8-kbyte ?near? data spac e is reserved in x address memory space between 0x0000 and 0x1fff, which is directly addressable via a 13-b it absolute address field within all memory direct in structions. the remaining x address space and all of the y address space is addressable indirectly. additionally, the whole of x data space is addressable using mov instructions, which support memory direct addressing with a 16-bit address field. 3.2.6 software stack the dspic devices contain a software stack. w15 is used as the stack pointer. the stack pointer always points to the first available free word and grows from lower addresses towards higher addresses. it pre-decrements for stack pops and post-increments for stack pushes as shown in figure 3-11. note that for a pc push during any call instruction, the msb of the pc is zero-extended before the push, ensuring that the msb is always clear. there is a stack pointer limi t register (splim) associ- ated with the stack pointer. splim is uninitialized at reset. as is the case for the stack pointer, splim<0> is forced to ? 0 ? because all stack operations must be word aligned. whenever an effective address (ea) is generated using w15 as a source or destination pointer, the address thus generated is compared with the value in splim. if the contents of the stack pointer (w15) and the splim regist er are equal and a push operation is performed, a stack error trap will not occur. the stack error trap will occur on a subsequent push operation. thus, for exam ple, if it is desirable to cause a stack error trap when the stack grows beyond address 0x2000 in ram, init ialize the splim with the value, 0x1ffe. similarly, a stack pointer underflow (stack error) trap is generated when the stack po inter address is found to be less than 0x0800, thus preventing the stack from interfering with the specia l function register (sfr) space. a write to the splim register should not be immediately followed by an indirect read operation using w15. figure 3-11: call stack frame note: a pc push during exception processing will concatenate the srl register to the msb of the pc prior to the push. dspic30f2011/2012/3012/3013 ds70139c-page 38 preliminary ? 2005 microchip technology inc. table 3-3: core register map sfr name address (home) bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 b it 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state w0 0000 w0/wreg 0000 0000 0000 0000 w1 0002 w1 0000 0000 0000 0000 w2 0004 w2 0000 0000 0000 0000 w3 0006 w3 0000 0000 0000 0000 w4 0008 w4 0000 0000 0000 0000 w5 000a w5 0000 0000 0000 0000 w6 000c w6 0000 0000 0000 0000 w7 000e w7 0000 0000 0000 0000 w8 0010 w8 0000 0000 0000 0000 w9 0012 w9 0000 0000 0000 0000 w10 0014 w10 0000 0000 0000 0000 w11 0016 w11 0000 0000 0000 0000 w12 0018 w12 0000 0000 0000 0000 w13 001a w13 0000 0000 0000 0000 w14 001c w14 0000 0000 0000 0000 w15 001e w15 0000 1000 0000 0000 splim 0020 splim 0000 0000 0000 0000 accal 0022 accal 0000 0000 0000 0000 accah 0024 accah 0000 0000 0000 0000 accau 0026 sign-extens ion (acca<39>) accau 0000 0000 0000 0000 accbl 0028 accbl 0000 0000 0000 0000 accbh 002a accbh 0000 0000 0000 0000 accbu 002c sign-extension (accb<39>) accbu 0000 0000 0000 0000 pcl 002e pcl 0000 0000 0000 0000 pch 0030 ? ? ? ? ? ? ? ? ?pch 0000 0000 0000 0000 tblpag 0032 ? ? ? ? ? ? ? ?tblpag 0000 0000 0000 0000 psvpag 0034 ? ? ? ? ? ? ? ?psvpag 0000 0000 0000 0000 rcount 0036 rcount uuuu uuuu uuuu uuuu dcount 0038 dcount uuuu uuuu uuuu uuuu dostartl 003a dostartl 0 uuuu uuuu uuuu uuu0 dostarth 003c ? ? ? ? ? ? ? ? ?dostarth 0000 0000 0uuu uuuu doendl 003e doendl 0 uuuu uuuu uuuu uuu0 doendh 0040 ? ? ? ? ? ? ? ? ?doendh 0000 0000 0uuu uuuu sr 0042 oa ob sa sb oab sab da dc ipl2 ipl1 ipl0 ra n ov z c 0000 0000 0000 0000 legend: u = uninitialized bit ? 2005 microchip technology inc. preliminary ds70139c-page 39 dspic30f2011/2012/3012/3013 note: refer to dspic30f family reference manua l (ds70046) for descriptions of register bit fields. corcon 0044 ? ? ? us edt dl2 dl1 dl0 sata satb satdw accsat ipl3 psv rnd if 0000 0000 0010 0000 modcon 0046 xmoden ymoden ? ? bwm<3:0> ywm<3:0> xwm<3:0> 0000 0000 0000 0000 xmodsrt 0048 xs<15:1> 0 uuuu uuuu uuuu uuu0 xmodend 004a xe<15:1> 1 uuuu uuuu uuuu uuu1 ymodsrt 004c ys<15:1> 0 uuuu uuuu uuuu uuu0 ymodend 004e ye<15:1> 1 uuuu uuuu uuuu uuu1 xbrev 0050 bren xb<14:0> uuuu uuuu uuuu uuuu disicnt 0052 ? ? disicnt<13:0> 0000 0000 0000 0000 table 3-3: core register map (continued) sfr name address (home) bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 b it 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state legend: u = uninitialized bit dspic30f2011/2012/3012/3013 ds70139c-page 40 preliminary ? 2005 microchip technology inc. notes: ? 2005 microchip technology inc. preliminary ds70139c-page 41 dspic30f2011/2012/3012/3013 4.0 address generator units the dspic core contains two independent address generator units: the x ag u and y agu. the y agu supports word sized data reads for the dsp mac class of instructions only. the dspic agus support three types of data addressing: ? linear addressing ? modulo (circular) addressing ? bit-reversed addressing linear and modulo data addressing modes can be applied to data space or program space. bit-reversed addressing is only applicab le to data space addresses. 4.1 instruction addressing modes the addressing modes in table 4-1 form the basis of the addressing modes optimiz ed to support the specific features of individual in structions. the addressing modes provided in the mac class of instructions are somewhat different from thos e in the other instruction types. 4.1.1 file register instructions most file register instructions use a 13-bit address field (f) to directly address data present in the first 8192 bytes of data memory (near data space). most file register instructions empl oy a working register w0, which is denoted as wreg in these instructions. the destination is typically either the same file register, or wreg (with the exception of the mul instruction), which writes the result to a r egister or register pair. the mov instruction allows additi onal flexibility and can access the entire data space during file register operation. 4.1.2 mcu instructions the three-operand mcu instructions are of the form: operand 3 = operand 1 dspic30f2011/2012/3012/3013 ds70139c-page 42 preliminary ? 2005 microchip technology inc. 4.1.3 move and accumulator instructions move instructions and t he dsp accumulator class of instructions provide a great er degree of addressing flexibility than other instru ctions. in addition to the addressing modes supported by most mcu instruc- tions, move and accumulator instructions also support register indirect with re gister offset addressing mode, also referred to as register indexed mode. in summary, the followin g addressing modes are supported by move and ac cumulator instructions: ? register direct ? register indirect ? register indirect post-modified ? register indirect pre-modified ? register indirect with register offset (indexed) ? register indirect with literal offset ? 8-bit literal ? 16-bit literal 4.1.4 mac instructions the dual source operan d dsp instructions ( clr, ed, edac, mac, mpy, mpy.n, movsac and msc ), also referred to as mac instructions, utilize a simplified set of addressing modes to allow the user to effectively manipulate the data pointers through register indirect tables. the 2 source operand pre-fetch registers must be a member of the set {w8, w9, w10, w11}. for data reads, w8 and w9 will al ways be directed to the x ragu and w10 and w11 will al ways be directed to the y agu. the effective addresses generated (before and after modification) must, ther efore, be valid addresses within x data space for w8 and w9 and y data space for w10 and w11. in summary, the following addressing modes are supported by the mac class of instructions: ? register indirect ? register indirect post-modified by 2 ? register indirect post-modified by 4 ? register indirect post-modified by 6 ? register indirect with register offset (indexed) 4.1.5 other instructions besides the various address ing modes outlined above, some instructions use litera l constants of various sizes. for example, bra (branch) instructions use 16-bit signed literals to s pecify the branch destination directly, whereas the disi instruction uses a 14-bit unsigned literal field. in some instructions, such as add acc , the source of an operand or resu lt is implied by the opcode itself. certain operations, such as nop , do not have any operands. 4.2 modulo addressing modulo addressing is a me thod of providing an auto- mated means to support circ ular data buffers using hardware. the objective is to remove the need for soft- ware to perform data address boundary checks when executing tightly looped code, as is typical in many dsp algorithms. modulo addressing can operate in either data or pro- gram space (since the data pointer mechanism is essentially the same for both). one circular buffer can be supported in each of the x (which also provides the pointers into program space) and y data spaces. mod- ulo addressing can operate on any w register pointer. however, it is not advisable to use w14 or w15 for mod- ulo addressing since these two registers are used as the stack frame pointer and stack pointer, respectively. in general, any particular ci rcular buffer can only be configured to operate in one direction, as there are cer- tain restrictions on the buffer start address (for incre- menting buffers), or end address (for decrementing buffers) based upon the direction of the buffer. the only exception to the usage restrictions is for buff- ers which have a power-of-2 length. as these buffers satisfy the start and end add ress criteria, they may operate in a bidirectional mode (i.e., address boundary checks will be performed on both the lower and upper address boundaries). note: for the mov instructions, the addressing mode specified in the instruction can differ for the source and destination ea. however, the 4-bit wb (register offset) field is shared betw een both source and destination (but typically only used by one). note: not all instructions support all the address- ing modes given ab ove. individual instructions may support different subsets of these addressing modes. note: register indirect with register offset addressing is only avai lable for w9 (in x space) and w11 (in y space). ? 2005 microchip technology inc. preliminary ds70139c-page 43 dspic30f2011/2012/3012/3013 4.2.1 start and end address the modulo addressing scheme requires that a starting and an ending address be specified and loaded into the 16-bit modulo buffer address registers: xmodsrt, xmodend, ymodsrt and ymodend (see table 3-3). the length of a circular buffer is not directly specified. it is determined by the difference between the corre- sponding start and end addr esses. the maximum pos- sible length of the circular buffer is 32k words (64 kbytes). 4.2.2 w address register selection the modulo and bit-reversed addressing control reg- ister modcon<15:0> contains enable flags as well as a w register field to spec ify the w address registers. the xwm and ywm fields select which registers will operate with modulo addressing. if xwm = 15 , x ragu and x wagu modulo addressing is disabled. similarly, if ywm = 15 , y agu modulo addressing is disabled. the x address space pointer w register (xwm), to which modulo addressing is to be applied, is stored in modcon<3:0> (see table 3-3). modulo addressing is enabled for x data space when xwm is set to any value other than ? 15 ? and the xmoden bit is set at modcon<15>. the y address space pointer w register (ywm), to which modulo addressing is to be applied, is stored in modcon<7:4>. modulo addre ssing is enabled for y data space when ywm is set to any value other than ? 15 ? and the ymoden bit is set at modcon<14>. figure 4-1: modulo addressing operation example note: y space modulo addressing ea calcula- tions assume word sized data (ls bit of every ea is always clear). 0x1100 0x1163 start addr = 0x1100 end addr = 0x1163 length = 0x0032 words byte address mov #0x1100,w0 mov w0,xmodsrt ;set mod ulo start address mov #0x1163,w0 mov w0,modend ;set mod ulo end address mov #0x8001,w0 mov w0,modcon ;enable w1, x agu for modulo mov #0x0000,w0 ;w0 hold s buffer fill value mov #0x1110,w1 ;point w1 to buffer do again,#0x31 ;fill t he 50 buffer locations mov w0,[w1++] ;fill th e next location again: inc w0,w0 ;inc rement the fill value dspic30f2011/2012/3012/3013 ds70139c-page 44 preliminary ? 2005 microchip technology inc. 4.2.3 modulo addressing applicability modulo addressing can be ap plied to the effective address (ea) calculation as sociated with any w regis- ter. it is important to re alize that the address bound- aries check for addresses less than, or greater than the upper (for incrementing buffers), and lower (for decre- menting buffers) boundary ad dresses (not just equal to). address changes may, therefore, jump beyond boundaries and still be adjusted correctly. 4.3 bit-reversed addressing bit-reversed addressing is in tended to simplify data re- ordering for radix-2 fft algor ithms. it is supported by the x agu for data writes only. the modifier, which may be a constant value or register contents, is regarded as having its bit order reversed. the address source and destination are kept in normal order. thus, the only operand requiring reversal is the modifier. 4.3.1 bit-reversed addressing implementation bit-reversed addressing is enabled when: 1. bwm (w register selection) in the modcon register is any value other than ? 15 ? (the stack cannot be accessed using bit-reversed addressing) and 2. the bren bit is set in the xbrev register and 3. the addressing mode used is register indirect with pre-increment or post-increment. if the length of a bit-reversed buffer is m = 2 n bytes, then the last ?n? bits of th e data buffer start address must be zeros. xb<14:0> is the bit-reversed address modifier or ?pivot point? which is typically a co nstant. in the case of an fft computation, its value is equal to half of the fft data buffer size. when enabled, bit-reversed addressing will only be executed for register indi rect with pre-increment or post-increment addressing and word sized data writes. it will not function for any ot her addressing mode or for byte sized data, and normal addresses will be gener- ated instead. when bit-reve rsed addressing is active, the w address pointer will always be added to the address modifier (xb) and the offset associated with the register indirect addres sing mode will be ignored. in addition, as word sized data is a requirement, the ls bit of the ea is ignored (and always clear). if bit-reversed addressing has already been enabled by setting the bren (xbrev<15>) bit, then a write to the xbrev register should not be immediately followed by an indirect read operation using the w register that has been designated as th e bit-reversed pointer. note: the modulo corrected effective address is written back to the register only when pre- modify or post-modify addressing mode is used to compute the effective address. when an address offset (e.g., [w7+w2]) is used, modulo address correction is per- formed but the contents of the register remain unchanged. note: all bit-reversed ea calculations assume word sized data (ls bit of every ea is always clear). the xb value is scaled accordingly to generate compatible (byte) addresses. note: modulo addressing and bit-reversed addressing should not be enabled together. in the event that the user attempts to do this, bit-reversed addressing will assume priority when active for the x wagu, and x wagu modulo addressing will be disabled. however, modulo addressing will continue to function in the x ragu. ? 2005 microchip technology inc. preliminary ds70139c-page 45 dspic30f2011/2012/3012/3013 figure 4-2: bit-reversed address example table 4-2: bit-reversed address sequence (16-entry) table 4-3: bit-reversed address modifier values for xbrev register normal address bit-reversed address a3 a2 a1 a0 decimal a3 a2 a1 a0 decimal 0000 0 0000 0 0001 1 1000 8 0010 2 0100 4 0011 3 1100 12 0100 4 0010 2 0101 5 1010 10 0110 6 0110 6 0111 7 1110 14 1000 8 0001 1 1001 9 1001 9 1010 10 0101 5 1011 11 1101 13 1100 12 0011 3 1101 13 1011 11 1110 14 0111 7 1111 15 1111 15 buffer size (words) xb<14:0> bit-reversed address modifier value 1024 0x0200 512 0x0100 256 0x0080 128 0x0040 64 0x0020 32 0x0010 16 0x0008 8 0x0004 4 0x0002 2 0x0001 b3 b2 b1 0 b2 b3 b4 0 bit locations swapped left-to-right around center of binary value bit-reversed address xb = 0x0008 for a 16-word bit-reversed buffer b7 b6 b5 b1 b7 b6 b5 b4 b11 b10 b9 b8 b11 b10 b9 b8 b15 b14 b13 b12 b15 b14 b13 b12 sequential address pivot point dspic30f2011/2012/3012/3013 ds70139c-page 46 preliminary ? 2005 microchip technology inc. notes: ? 2005 microchip technology inc. preliminary ds70139c-page 47 dspic30f2011/2012/3012/3013 5.0 flash program memory the dspic30f family of devic es contains internal pro- gram flash memory for exec uting user code. there are two methods by which th e user can program this memory: 1. run-time self-programming (rtsp) 2. in-circuit serial programming? (icsp?) 5.1 in-circuit serial programming (icsp) dspic30f devices can be se rially programmed while in the end application circuit. th is is simply done with two lines for programming clock and programming data (which are named pgc and pgd respectively), and three other lines for power (v dd ), ground (v ss ) and master clear (mclr ). this allows cu stomers to manu- facture boards with unpr ogrammed devices, and then program the microcontroller just before shipping the product. this also allows the most recent firmware or a custom firmware to be programmed. 5.2 run-time self-programming (rtsp) rtsp is accomplished using tblrd (table read) and tblwt (table write) instructions. with rtsp, the user may erase program memory, 32 instructions (96 bytes) at a time and can write program memory data, 32 instructions (96 bytes) at a time. 5.3 table instruction operation summary the tblrdl and the tblwtl instructions are used to read or write to bits<15:0> of program memory. tblrdl and tblwtl can access program memory in word or byte mode. the tblrdh and tblwth instructions are used to read or write to bits<23:16 > of program memory. tblrdh and tblwth can access program memory in word or byte mode. a 24-bit program memory address is formed using bits<7:0> of the tblpag register and the effective address (ea) from a w regist er specified in the table instruction, as shown in figure 5-1. figure 5-1: addressing for table and nvm registers note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descr iptions and general device functionality, refer to the dspic30f family reference manual (ds70046). for more information on the device instruction set and programming, refer to the dspic30f programmer?s reference manual (ds70030). 0 program counter 24 bits nvmadru reg 8 bits 16 bits program using tblpag reg 8 bits working reg ea 16 bits using byte 24-bit ea 1/0 0 1/0 select table instruction nvmadr addressing counter using nvmadr reg ea user/configuration space select dspic30f2011/2012/3012/3013 ds70139c-page 48 preliminary ? 2005 microchip technology inc. 5.4 rtsp operation the dspic30f flash program memory is organized into rows and panels. each row consists of 32 instruc- tions, or 96 bytes. each pa nel consists of 128 rows, or 4k x 24 instructions. rtsp al lows the user to erase one row (32 instructions) at a time and to program four instructions at one time. rtsp may be used to program multiple program memory panels, but the table pointer must be changed at ea ch panel boundary. each panel of program memory contains write latches that hold 32 instructions of programming data. prior to the actual programming oper ation, the write data must be loaded into the panel wr ite latches. the data to be programmed into the panel is loaded in sequential order into the write latches; instruction 0 , instruction 1 , etc. the instruction words loaded must always be from a group of 32 boundary. the basic sequence for rtsp programming is to set up a table pointer, then do a series of tblwt instructions to load the write latches. programming is performed by setting the special bits in the nvmcon register. 32 tblwtl and four tblwth instructions are required to load the 32 instructions. if multiple panel programming is required, the table pointe r needs to be changed and the next set of multiple write latches written. all of the table write operat ions are single word writes (2 instruction cycles), because only the table latches are written. a programming cycle is required for programming each row. the flash program memory is readable, writable and erasable during normal operation over the entire v dd range. 5.5 control registers the four sfrs used to read and write the program flash memory are: ?nvmcon ?nvmadr ? nvmadru ?nvmkey 5.5.1 nvmcon register the nvmcon register controls which blocks are to be erased, which memory type is to be programmed, and start of the programming cycle. 5.5.2 nvmadr register the nvmadr register is used to hold the lower two bytes of the effective ad dress. the nvmadr register captures the ea<15:0> of th e last table instruction that has been executed and selects the row to write. 5.5.3 nvmadru register the nvmadru register is used to hold the upper byte of the effective address. the nvmadru register cap- tures the ea<23:16> of the last table instruction that has been executed. 5.5.4 nvmkey register nvmkey is a write-only regist er that is used for write protection. to start a programming or an erase sequence, the user must co nsecutively write 0x55 and 0xaa to the nvmkey register. refer to section 5.6 for further details. note: the user can also directly write to the nvmadr and nvmadru registers to specify a program memory address for erasing or programming. ? 2005 microchip technology inc. preliminary ds70139c-page 49 dspic30f2011/2012/3012/3013 5.6 programming operations a complete programming s equence is necessary for programming or erasing the internal flash in rtsp mode. a programming operatio n is nominally 2 msec in duration and the processor stalls (waits) until the oper- ation is finished. setting the wr bit (nvmcon<15>) starts the operation, and the wr bit is automatically cleared when the operation is finished. 5.6.1 programming algorithm for program flash the user can erase or program one row of program flash memory at a time. the general process is: 1. read one row of program flash (32 instruction words) and store into data ram as a data ?image?. 2. update the data image with the desired new data. 3. erase program flash row. a) setup nvmcon register for multi-word, program flash, erase, and set wren bit. b) write address of row to be erased into nvmadru/nvmdr. c) write ?55? to nvmkey. d) write ?aa? to nvmkey. e) set the wr bit. this will begin erase cycle. f) cpu will stall for the duration of the erase cycle. g) the wr bit is cleared when erase cycle ends. 4. write 32 instruction words of data from data ram ?image? into the program flash write latches. 5. program 32 instruction words into program flash. a) setup nvmcon register for multi-word, program flash, program, and set wren bit. b) write ?55? to nvmkey. c) write ?aa? to nvmkey. d) set the wr bit. this will begin program cycle. e) cpu will stall for duration of the program cycle. f) the wr bit is cleared by the hardware when program cycle ends. 6. repeat steps 1 through 5 as needed to program desired amount of pr ogram flash memory. 5.6.2 erasing a row of program memory example 5-1 shows a code sequence that can be used to erase a row (32 instruct ions) of program memory. example 5-1: erasing a row of program memory ; setup nvmcon for erase operation, multi word write ; program memory selected, and writes enabled mov #0x4041,w0 ; mov w0 , nvmcon ; init nvmcon sfr ; init pointer to ro w to be erased mov #tblpage(prog_addr),w0 ; mov w0 , nvmadru ; initialize pm page boundary sfr mov #tbloffset(prog_addr),w0 ; in tialize in-page ea[15:0] pointer mov w0, nvmadr ; initialize nvmadr sfr disi #5 ; block all inter rupts with priority <7 for ; next 5 instructions mov #0x55,w0 mov w0 , nvmkey ; write the 0x55 key mov #0xaa,w1 ; mov w1 , nvmkey ; write the 0xaa key bset nvmcon,#wr ; start the erase sequence nop ; insert two n ops after the erase nop ; command is asserted dspic30f2011/2012/3012/3013 ds70139c-page 50 preliminary ? 2005 microchip technology inc. 5.6.3 loading write latches example 5-2 shows a sequence of instructions that can be used to load the 96 bytes of write latches. 32 tblwtl and 32 tblwth instructions are needed to load the write latches select ed by the table pointer. 5.6.4 initiating the programming sequence for protection, the write initiate sequence for nvmkey must be used to allow any erase or program operation to proceed. after the programming command has been executed, the user must wa it for the programming time until programming is complete. the two instructions fol- lowing the start of the pr ogramming sequence should be nop s. example 5-2: loading write latches example 5-3: initiating a programming sequence ; set up a pointer to the first program memory locat ion to be written ; program memory selec ted, and writes enabled mov #0x0000,w0 ; mov w0 , tblpag ; initialize pm page boundary sfr mov #0x6000,w0 ; an example program memory address ; perform the tblwt instructions to write the latches ; 0th_program_word mov #low_word_0,w2 ; mov #high_byte_0,w3 ; tblwtl w2 , [w0] ; write pm low wor d into program latch tblwth w3 , [w0++] ; write pm high by te into program latch ; 1st_program_word mov #low_word_1,w2 ; mov #high_byte_1,w3 ; tblwtl w2 , [w0] ; write pm low wor d into program latch tblwth w3 , [w0++] ; write pm high by te into program latch ; 2nd_program_word mov #low_word_2,w2 ; mov #high_byte_2,w3 ; tblwtl w2 , [w0] ; write pm low wor d into program latch tblwth w3 , [w0++] ; write pm high by te into program latch ? ? ? ; 31st_program_word mov #low_word_31,w2 ; mov #high_byte_31,w3 ; tblwtl w2 , [w0] ; write pm low wor d into program latch tblwth w3 , [w0++] ; write pm high by te into program latch note: in example 5-2, the contents of th e upper byte of w3 has no effect. disi #5 ; block all interru pts with priority <7 for ; next 5 instructions mov #0x55,w0 ; mov w0 , nvmkey ; write the 0x55 key mov #0xaa,w1 ; mov w1 , nvmkey ; write the 0xaa key bset nvmcon,#wr ; start the erase sequence nop ; insert two nop s after the erase nop ; command is asserted ? 2005 microchip technology inc. preliminary ds70139c-page 51 dspic30f2011/2012/3012/3013 table 5-1: nvm register map note: refer to dspic30f family reference manua l (ds70046) for descriptions of register bit fields. file name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 all resets nvmcon 0760 wr wren wrerr ? ? ? ?twri ? progop<6:0> 0000 0000 0000 0000 nvmadr 0762 nvmadr<15:0> uuuu uuuu uuuu uuuu nvmadru 0764 ? ? ? ? ? ? ? ? nvmadr<23:16> 0000 0000 uuuu uuuu nvmkey 0766 ? ? ? ? ? ? ? ?key<7:0> 0000 0000 0000 0000 legend: u = uninitialized bit dspic30f2011/2012/3012/3013 ds70139c-page 52 preliminary ? 2005 microchip technology inc. notes: ? 2005 microchip technology inc. ds70139c-page 53 dspic30f2011/2012/3012/3013 6.0 data eeprom memory the data eeprom memory is readable and writable during normal operation over the entire v dd range. the data eeprom memory is directly mapped in the program memory address space. the four sfrs used to read and write the program flash memory are used to access data eeprom memory, as well. as described in section 6.5, these registers are: ?nvmcon ?nvmadr ? nvmadru ?nvmkey the eeprom data memory allows read and write of single words and 16-word blocks. when interfacing to data memory, nvmadr in conjunction with the nvmadru register are used to address the eeprom location being accessed. tblrdl and tblwtl instructions are used to read and write data eeprom. the dspic30f devices have up to 8 kbytes (4k words) of data eeprom wi th an address range from 0x7ff000 to 0x7ffffe. a word write operation should be preceded by an erase of the corresponding memory location(s). the write typ- ically requires 2 ms to comp lete but the write time will vary with voltage and temperature. a program or erase operation on the data eeprom does not stop the instructi on flow. the user is respon- sible for waiting for the app ropriate duration of time before initiating another data eeprom write/erase operation. attempting to re ad the data eeprom while a programming or erase operat ion is in progress results in unspecified data. control bit wr initiates writ e operations similar to pro- gram flash writes. this bit cannot be cleared, only set, in software. they are clea red in hardware at the com- pletion of the write operation. the inability to clear the wr bit in software prevents the accidental or premature termination of a write operation. the wren bit, when set, will allow a write operation. on power-up, the wren bit is clear. the wrerr bit is set when a write operation is interrupted by a mclr reset or a wdt time-out reset during normal opera- tion. in these situations, following reset, the user can check the wrerr bit and re write the location. the address register nvma dr remains unchanged. 6.1 reading the data eeprom a tblrd instruction reads a word at the current pro- gram word address. this example uses w0 as a pointer to data eeprom. the result is placed in register w4 as shown in example 6-1. example 6-1: data eeprom read note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descr iptions and general device functionality, refer to the dspic30f family reference manual (ds70046). for more information on the device instruction set and programming, refer to the dspic30f programmer?s reference manual (ds70030). note: interrupt flag bit nvmif in the ifs0 regis- ter is set when write is complete. it must be cleared in software. mov #low_addr_word,w 0 ; init pointer mov #high_addr_word,w1 mov w1 , tblpag tblrdl [ w0 ], w4 ; read data eeprom dspic30f2011/2012/3012/3013 ds70139c-page 54 preliminary ? 2005 microchip technology inc. 6.2 erasing data eeprom 6.2.1 erasing a block of data eeprom in order to erase a block of data eeprom, the nvmadru and nvmadr register s must initially point to the block of memory to be erased. configure nvmcon for erasing a block of data eeprom, and set the erase and wren bits in the nvmcon register. setting the wr bit initiates the erase as shown in example 6-2. example 6-2: data eeprom block erase 6.2.2 erasing a word of data eeprom the nvmadru and nvmadr registers must point to the block. select erase a bl ock of data flash, and set the erase and wren bits in the nvmcon register. setting the wr bit initiates the erase as shown in example 6-3. example 6-3: data eeprom word erase ; select data eeprom blo ck, erase, wren bits mov #0x4045,w0 mov w0 , nvmcon ; init ialize nvmcon sfr ; start erase cycle by setting wr after writing key sequence disi #5 ; block all interru pts with priority <7 for ; next 5 instructions mov #0x55,w0 ; mov w0 , nvmkey ; write the 0x55 key mov #0xaa,w1 ; mov w1 , nvmkey ; write the 0xaa key bset nvmcon,#wr ; init iate erase sequence nop nop ; erase cycle will complete in 2ms. cpu is not stalled for the data erase cycle ; user can poll wr bi t, use nvmif or timer irq to determine erasure complete ; select data eeprom word, erase, wren bits mov #0x4044,w0 mov w0 , nvmcon ; start erase cycle by setting wr after writing key sequence disi #5 ; block all interrupt s with priority <7 for ; next 5 instructions mov #0x55,w0 ; mov w0 , nvmkey ; write the 0x55 key mov #0xaa,w1 ; mov w1 , nvmkey ; write the 0xaa key bset nvmcon,#wr ; initiate erase sequence nop nop ; erase cycle will complete in 2ms. cpu is not stalled for the data erase cycle ; user can poll wr bit, use nvmif or timer irq to determine erasure complete ? 2005 microchip technology inc. ds70139c-page 55 dspic30f2011/2012/3012/3013 6.3 writing to the data eeprom to write an eeprom data location, the following sequence must be followed: 1. erase data eeprom word. a) select word, data eeprom erase, and set wren bit in nvmcon register. b) write address of word to be erased into nvmadr. c) enable nvm interrupt (optional). d) write ?55? to nvmkey. e) write ?aa? to nvmkey. f) set the wr bit. this will begin erase cycle. g) either poll nvmif bit or wait for nvmif interrupt. h) the wr bit is cleared when the erase cycle ends. 2. write data word into data eeprom write latches. 3. program 1 data word into data eeprom. a) select word, data eeprom program, and set wren bit in nvmcon register. b) enable nvm write done interrupt (optional). c) write ?55? to nvmkey. d) write ?aa? to nvmkey. e) set the wr bit. this will begin program cycle. f) either poll nvmif bit or wait for nvm interrupt. g) the wr bit is cleare d when the write cycle ends. the write will not initiate if the above sequence is not exactly followed (write 0x55 to nvmkey, write 0xaa to nvmcon, then set wr bit) fo r each word. it is strongly recommended that interrupt s be disabled during this code segment. additionally, the wren bit in nvmcon must be set to enable writes. this mechan ism prevents accidental writes to data eeprom due to unexpected code exe- cution. the wren bit should be kept clear at all times except when updating the eeprom. the wren bit is not cleared by hardware. after a write sequence has been initiated, clearing the wren bit will not affect the current write cycle. the wr bit will be inhibited from bei ng set unless the wren bit is set. the wren bit must be set on a previous instruc- tion. both wr and wren cannot be set with the same instruction. at the completion of the write cycle, the wr bit is cleared in hardware and the non-volatile memory write complete interrupt fl ag bit (nvmif) is set. the user may either enable this interrupt or poll this bit. nvmif must be cleared by software. 6.3.1 writing a word of data eeprom once the user has erased t he word to be programmed, then a table write instruction is used to write one write latch, as shown in example 6-4. 6.3.2 writing a block of data eeprom to write a block of data eeprom, write to all sixteen latches first, then set th e nvmcon register and program the block. example 6-4: data eeprom word write ; point to data memory mov #low_addr_word,w0 ; init pointer mov #high_addr_word,w1 mov w1 , tblpag mov #low(word),w2 ; get data tblwtl w2 , [ w0] ; write data ; the nvmadr captures last table access address ; select data eep rom for 1 word op mov #0x4004,w0 mov w0 , nvmcon ; operate key to all ow write operation disi #5 ; block all interru pts with priority <7 for ; next 5 instructions mov #0x55,w0 mov w0 , nvmkey ; write the 0x55 key mov #0xaa,w1 mov w1 , nvmkey ; write the 0xaa key bset nvmcon,#wr ; init iate program sequence nop nop ; write cycle will complete in 2ms. cpu is not stalle d for the data write cycle ; user can poll wr bit, use nvmif or timer irq to determine write complete dspic30f2011/2012/3012/3013 ds70139c-page 56 preliminary ? 2005 microchip technology inc. example 6-5: data eeprom block write 6.4 write verify depending on the applic ation, good programming practice may dictate that th e value written to the mem- ory should be verified agains t the original value. this should be used in applicati ons where excessive writes can stress bits near the specification limit. 6.5 protection against spurious write there are conditions when the device may not want to write to the data eeprom memory. to protect against spurious eeprom writes, various mechanisms have been built-in. on power-up, the wren bit is cleared; also, the power-up timer prevents eeprom write. the write initiate sequence and the wren bit together help prevent an accidental write during brown-out, power glitch, or software malfunction. mov #low_addr_wor d,w0 ; init pointer mov #high_addr_word,w1 mov w1 , tblpag mov #data1,w2 ; get 1st data tblwtl w2 , [ w0]++ ; write data mov #data2,w2 ; get 2nd data tblwtl w2 , [ w0]++ ; write data mov #data3,w2 ; get 3rd data tblwtl w2 , [ w0]++ ; write data mov #data4,w2 ; get 4th data tblwtl w2 , [ w0]++ ; write data mov #data5,w2 ; get 5th data tblwtl w2 , [ w0]++ ; write data mov #data6,w2 ; get 6th data tblwtl w2 , [ w0]++ ; write data mov #data7,w2 ; get 7th data tblwtl w2 , [ w0]++ ; write data mov #data8,w2 ; get 8th data tblwtl w2 , [ w0]++ ; write data mov #data9,w2 ; get 9th data tblwtl w2 , [ w0]++ ; write data mov #data10,w 2 ; get 10th data tblwtl w2 , [ w0]++ ; write data mov #data11,w 2 ; get 11th data tblwtl w2 , [ w0]++ ; write data mov #data12,w 2 ; get 12th data tblwtl w2 , [ w0]++ ; write data mov #data13,w 2 ; get 13th data tblwtl w2 , [ w0]++ ; write data mov #data14,w 2 ; get 14th data tblwtl w2 , [ w0]++ ; write data mov #data15,w 2 ; get 15th data tblwtl w2 , [ w0]++ ; write data mov #data16,w 2 ; get 16th data tblwtl w2 , [ w0]++ ; write data. the nvmadr captures last table access address. mov #0x400a,w0 ; select data eeprom f or multi word op mov w0 , nvmcon ; operate key to allow program operation disi #5 ; block all interrupts with priority <7 for ; next 5 instructions mov #0x55,w0 mov w0 , nvmkey ; write the 0x55 key mov #0xaa,w1 mov w1 , nvmkey ; write the 0xaa key bset nvmcon,#wr ; start write cycle nop nop ? 2005 microchip technology inc. preliminary ds70139c-page 57 dspic30f2011/2012/3012/3013 7.0 i/o ports all of the device pins (except v dd , v ss , mclr and osc1/clki) are shared between the peripherals and the parallel i/o ports. all i/o input ports feature schmitt trigger inputs for improved noise immunity. 7.1 parallel i/o (pio) ports when a peripheral is en abled and the peripheral is actively driving an associat ed pin, the use of the pin as a general purpose output pi n is disabled. the i/o pin may be read but the output driver for the parallel port bit will be disabled. if a peripheral is enabled but the peripheral is not actively dr iving a pin, that pin may be driven by a port. all port pins have three registers directly associated with the operation of the po rt pin. the data direction register (trisx) determines whether the pin is an input or an output. if the data direction bit is a ? 1 ?, then the pin is an input. all port pins ar e defined as inputs after a reset. reads from the latc h (latx), read the latch. writes to the latch, write the latch (latx). reads from the port (portx), read the port pins and writes to the port pins, write the latch (latx). any bit and its associated data and control registers that are not valid for a part icular device will be dis- abled. that means the corr esponding latx and trisx registers and the port pin will read as zeros. when a pin is shared with an other peripheral or func- tion that is defined as an input only, it is nevertheless regarded as a dedicated port because there is no other competing source of outputs. a parallel i/o (pio) port that shares a pin with a periph- eral is, in general, subservi ent to the peripheral. the peripheral?s output buffer da ta and control signals are provided to a pair of multiplexers. the multiplexers select whether the peripheral or the associated port has ownership of the output data and control signals of the i/o pad cell. figure 7-1 shows how ports are shared with other peripherals and the associated i/o cell (pad) to which they are connected. the format of the registers for the shared ports, (portb, portc, portd and portf) are shown in table 7-1 through table 7-6. figure 7-1: block diagram of a shared port structure note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descr iptions and general device functionality, refer to the dspic30f family reference manual (ds70046). note: the actual bits in use vary between devices. q d ck wr lat + tris latch i/o pad wr port data bus q d ck data latch read lat read port read tris 1 0 1 0 wr tris peripheral output data output enable peripheral input data i/o cell peripheral module peripheral output enable pio module output multiplexers output data input data peripheral module enable dspic30f2011/2012/3012/3013 ds70139c-page 58 preliminary ? 2005 microchip technology inc. 7.2 configuring analog port pins the use of the adpcfg and tris registers control the operation of the a/d port pins . the port pins that are desired as analog inputs mu st have their correspond- ing tris bit set (input). if the tris bit is cleared (output), the digital output level (v oh or v ol ) will be converted. when reading the port register, all pins configured as analog input channels will read as cleared (a low level). pins configured as digital inpu ts will not convert an ana- log input. analog levels on any pin that is defined as a digital input (including the anx pins) may cause the input buffer to consume cu rrent that exceeds the device specifications. 7.2.1 i/o port write/read timing one instruction cycle is required between a port direction change or port write operation and a read operation of the same port. typically this instruction would be a nop . example 7-1: port write/read example mov #0xf0, w0; configure portb<7:4> ; as inputs mov w0, trisb; and portb<3:0> as outputs nop ; additional instruction cycle btss portb, #7; bit test rb7 and skip if set ? 2005 microchip technology inc. preliminary ds70139c-page 59 dspic30f2011/2012/3012/3013 table 7-1: portb register map for dspic30f2011/3012 table 7-2: portb register map for dspic30f2012/3013 table 7-3: portc register map for dspic30f2011/2012/3012/3013 table 7-4: portd register map for dspic30f2011/3012 sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state trisb 02c6 ? ? ? ? ? ? ? ? trisb7 trisb6 trisb5 trisb4 t risb3 trisb2 trisb1 trisb0 0000 0000 1111 1111 portb 02c8 ? ? ? ? ? ? ? ? rb7 rb6 rb5 rb4 rb3 rb2 rb1 rb0 0000 0000 0000 0000 latb 02cb ? ? ? ? ? ? ? ? latb7 latb6 latb5 latb4 latb3 latb2 latb1 latb0 0000 0000 0000 0000 sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state trisb 02c6 ? ? ? ? ? ? trisb9 trisb8 trisb7 trisb6 trisb5 trisb4 trisb3 trisb2 trisb1 trisb0 0000 0011 1111 1111 portb 02c8 ? ? ? ? ? ? rb9 rb8 rb7 rb6 rb5 rb4 rb3 rb2 rb1 rb0 0000 0000 0000 0000 latb 02cb ? ? ? ? ? ? latb9 latb8 latb7 latb6 latb5 latb4 latb3 latb2 latb1 latb0 0000 0000 0000 0000 sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state trisc 02cc trisc15 trisc14 trisc13 ? ? ? ? ? ? ? ? ? ? ? ? ? 1110 0000 0000 0000 portc 02ce rc15 rc14 rc13 ? ? ? ? ? ? ? ? ? ? ? ? ? 0000 0000 0000 0000 latc 02d0 latc15 latc14 latc13 ? ? ? ? ? ? ? ? ? ? ? ? ? 0000 0000 0000 0000 sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state trisd 02d2 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ?trisd0 0000 0000 0000 0001 portd 02d4 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? rd0 0000 0000 0000 0000 latd 02d6 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ?latd0 0000 0000 0000 0000 dspic30f2011/2012/3012/3013 ds70139c-page 60 preliminary ? 2005 microchip technology inc. table 7-5: portd register map for dspic30f2012/3013 table 7-6: portf register map for dspic30f2012/3013 sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state trisd 02d2 ? ? ? ? ? ? trisd9 trisd8 ? ? ? ? ? ? ? ? 0000 0011 0000 0000 portd 02d4 ? ? ? ? ? ? rd9 rd8 ? ? ? ? ? ? ? ? 0000 0000 0000 0000 latd 02d6 ? ? ? ? ? ?latd9latd8 ? ? ? ? ? ? ? ? 0000 0000 0000 0000 sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state trisf 02de ? ? ? ? ? ? ? ? ? trisf6 trisf5 trisf4 trisf3 trisf2 ? ? 0000 0000 0111 1100 portf 02e0 ? ? ? ? ? ? ? ? ? rf6 rf5 rf4 rf3 rf2 ? ? 0000 0000 0000 0000 latf 02e2 ? ? ? ? ? ? ? ? ? latf6 latf5 latf4 latf3 latf2 ? ? 0000 0000 0000 0000 note: the dspic30f2011/3012 do not have trisf, portf or latf. ? 2005 microchip technology inc. preliminary ds70139c-page 61 dspic30f2011/2012/3012/3013 7.3 input change notification module the input change notificati on module provides the dspic30f devices the ability to generate interrupt requests to the processor, in response to a change of state on selected input pins. this module is capable of detecting input change of states even in sleep mode, when the clocks are disabled. there are up to 10 exter- nal signals (cn0 through cn7, cn17 and cn18) that may be selected (enabled) for generating an interrupt request on a change of state. table 7-7: input change notification regis ter map for dspic30f2011/3012 (bits 7-0) table 7-8: input change notification regis ter map for dspic30f2012/3013 (bits 7-0) note: refer to dspic30f family reference manua l (ds70046) for descriptions of register bit fields. sfr name addr. bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state cnen1 00c0 cn7ie cn6ie cn5ie cn4ie cn3ie cn2ie cn1ie cn0ie 0000 0000 0000 0000 cnen2 00c2 ? ? ? ? ? ? ? ? 0000 0000 0000 0000 cnpu1 00c4 cn7pue cn6pue cn5pue cn4pue cn3pue cn2pue cn1pue cn0pue 0000 0000 0000 0000 cnpu2 00c6 ? ? ? ? ? ? ? ? 0000 0000 0000 0000 sfr name addr. bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state cnen1 00c0 cn7ie cn6ie cn5ie cn4ie cn3ie cn2ie cn1ie cn0ie 0000 0000 0000 0000 cnen2 00c2 ? ? ? ? ? cn18ie cn17ie ? 0000 0000 0000 0000 cnpu1 00c4 cn7pue cn6pue cn5pue cn4pue cn3pue cn2pue cn1pue cn0pue 0000 0000 0000 0000 cnpu2 00c6 ? ? ? ? ? cn18pue cn17pue ? 0000 0000 0000 0000 dspic30f2011/2012/3012/3013 ds70139c-page 62 preliminary ? 2005 microchip technology inc. notes: ? 2005 microchip technology inc. preliminary ds70139c-page 63 dspic30f2011/2012/3012/3013 8.0 interrupts the dspic30f sensor family has up to 21 interrupt sources and 4 processor exce ptions (traps) which must be arbitrated based on a priority scheme. the cpu is responsible for reading the interrupt vector table (ivt) and transferri ng the address contained in the interrupt vector to the program counter. the inter- rupt vector is transferred from the program data bus into the program counter via a 24-bit wide multiplexer on the input of the program counter. the interrupt vector table (ivt) and alternate interrupt vector table (aivt) are pl aced near the beginning of program memory (0x000004). the ivt and aivt are shown in figure 8-1. the interrupt controller is responsible for pre- processing the interrupts and processor exceptions before they are presented to the processor core. the peripheral interrupts and traps are enabled, prioritized and controlled using centralized special function reg- isters: ? ifs0<15:0>, ifs1<15:0>, ifs2<15:0> all interrupt request flags are maintained in these three registers. the flags are set by their respec- tive peripherals or external signals, and they are cleared via software. ? iec0<15:0>, iec1<15:0>, iec2<15:0> all interrupt enable contro l bits are maintained in these three registers. these control bits are used to individually enable interrupts from the peripherals or external signals. ? ipc0<15:0>... ipc10<7:0> the user assignable priority level associated with each of these 41 interrupts is held centrally in these twelve registers. ? ipl<3:0> the current cpu priority le vel is explicitly stored in the ipl bits. ipl<3> is present in the corcon register, whereas ipl<2:0> are present in the status register (sr) in the processor core. ? intcon1<15:0>, intcon2<15:0> global interrupt control functions are derived from these two registers. intcon1 contains the con- trol and status flags for the processor exceptions. the intcon2 register controls the external interrupt request signal behavior and the use of the alternate vector table. all interrupt sources can be user assigned to one of 7 priority levels, 1 through 7, via the ipcx registers. each interrupt source is associated with an interrupt vector, as shown in table 8-1. leve ls 7 and 1 represent the highest and lowest maskable priorities, respectively. if the nstdis bit (intcon1<15>) is set, nesting of interrupts is prevented. thus, if an interrupt is currently being serviced, processing of a new interrupt is pre- vented even if the new interrupt is of higher priority than the one currently being serviced. certain interrupts have specia lized control bits for fea- tures like edge or level trig gered interrupts, interrupt- on-change, etc. control of these features remains within the peripheral mo dule which generates the interrupt. the disi instruction can be used to disable the processing of interrupts of priorities 6 and lower for a certain number of instructions , during which the disi bit (intcon2<14>) remains set. when an interrupt is serviced, the pc is loaded with the address stored in the vector location in program mem- ory that corresponds to the interrupt. there are 63 dif- ferent vectors within the ivt (refer to table 8-1). these vectors are contained in locations 0x000004 through 0x0000fe of program memory (refer to table 8-1). these locations contain 24-bi t addresses and in order to preserve robustness, an address error trap will take place should the pc attempt to fetch any of these words during normal execut ion. this prevents execu- tion of random data as a re sult of accidentally decre- menting a pc into vector sp ace, accidentally mapping a data space address into vect or space, or the pc roll- ing over to 0x000000 after reaching the end of imple- mented program memory space. execution of a goto instruction to this vector space will also generate an address error trap. note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descr iptions and general device functionality, refer to the dspic30f family reference manual (ds70046). for more information on the device instruction set and programming, refer to the dspic30f programmer?s reference manual (ds70030). note: interrupt flag bits get set when an interrupt condition occurs, regardless of the state of its corresponding enable bit. user soft- ware should ensure t he appropriate inter- rupt flag bits are clear prior to enabling an interrupt. note: assigning a priority level of ? 0 ? to an inter- rupt source is equiva lent to disabling that interrupt. note: the ipl bits become read only whenever the nstdis bit has been set to ? 1 ?. dspic30f2011/2012/3012/3013 ds70139c-page 64 preliminary ? 2005 microchip technology inc. 8.1 interrupt priority the user assignable interrupt priority (ip<2:0>) bits for each individual interrupt so urce are located in the ls 3 bits of each nibble within the ipcx register(s). bit 3 of each nibble is not us ed and is read as a ? 0 ?. these bits define the priority level assi gned to a particular interrupt by the user. natural order priority is de termined by the position of an interrupt in the vector table, and only affects interrupt operation when mult iple interrupts with the same user-assigned priority become pending at the same time. table 8-1 lists the interrupt numbers and interrupt sources for the dspic30f2011/2012/3012/3013 devices and their associated vector numbers. the ability for the user to assign every interrupt to one of seven priority levels implies that the user can assign a very high overall priority level to an interrupt with a low natural order priority. for example, the plvd (low voltage detect) can be given a priority of 7. the int0 (external interrupt 0) may be assigned to priority level 1, thus giving it a very low effective priority. table 8-1: interrupt vector table note: the user selectable priority levels start at 0 as the lowest priori ty and level 7 as the highest priority. note 1: the natural order prio rity scheme has 0 as the highest priority and 53 as the lowest priority. 2: the natural order priority number is the same as the int number. int number vector number interrupt source highest natural order priority 0 8 int0 - external interrupt 0 1 9 ic1 - input capture 1 2 10 oc1 - output compare 1 311t1 - timer 1 4 12 ic2 - input capture 2 5 13 oc2 - output compare 2 614t2 - timer 2 715t3 - timer 3 8 16 spi1 9 17 u1rx - uart1 receiver 10 18 u1tx - uart1 transmitter 11 19 adc - adc convert done 12 20 nvm - nvm write complete 13 21 si2c - i 2 c slave interrupt 14 22 mi2c - i 2 c master interrupt 15 23 input change interrupt 16 24 int1 - external interrupt 1 17-22 25-30 reserved 23 31 int2 - external interrupt 2 24 32 * u2rx - uart2 receiver 25 33 * u2tx - uart2 transmitter 26-41 34-49 reserved 42 50 lvd - low voltage detect 43-53 51-61 reserved lowest natural order priority * only the DSPIC30F3013 has uart2 and the u2rx, u2tx interrupts. these locations are reserved for the dspic30f2011/2012/3012. ? 2005 microchip technology inc. preliminary ds70139c-page 65 dspic30f2011/2012/3012/3013 8.2 reset sequence a reset is not a true except ion, because the interrupt controller is not involved in the reset process. the pro- cessor initializes its regist ers in response to a reset which forces the pc to ze ro. the processor then begins program execution at location 0x000000. a goto instruction is stored in t he first program memory loca- tion immediately followed by the address target for the goto instruction. the processor executes the goto to the specified address and th en begins operation at the specified target (start) address. 8.2.1 reset sources in addition to external reset and power-on reset (por), there are 6 sources of error conditions which ?trap? to the reset vector. ? watchdog time-out: the watchdog has timed out, indicating that the processor is no longer executing the correct flow of code. ? uninitialized w register trap: an attempt to use an uninitialized w register as an address pointer will cause a reset. ? illegal instruction trap: attempted execution of any unused opcodes will result in an illegal instruction trap. note that a fetch of an illegal instruction does not result in an illegal instruction trap if that instruction is flushed prior to execution due to a flow change. ? brown-out reset (bor): a momentary dip in the power supply to the device has been detected which may result in malfunction. ? trap lockout: occurrence of multiple trap conditions simultaneously will cause a reset. 8.3 traps traps can be considered as non-maskable interrupts indicating a software or hardware error, which adhere to a predefined priority as shown in figure 8-1. they are intended to provide the user a means to correct erroneous operation during debug and when operating within the application. note that many of these trap conditions can only be detected when they occur. consequently, the question- able instruction is allowed to complete prior to trap exception processing. if the user chooses to recover from the error, the result of the erroneous action that caused the trap may have to be corrected. there are 8 fixed priority levels for traps: level 8 through level 15, which implie s that the ipl3 is always set during processing of a trap. if the user is not currently executing a trap, and he sets the ipl<3:0> bits to a value of ? 0111 ? (level 7), then all interrupts are disabled, but traps can still be processed. 8.3.1 trap sources the following traps are provided with increasing prior- ity. however, since all traps can be nested, priority has little effect. math error trap: the math error trap executes under the following three circumstances: 1. should an attempt be made to divide by zero, the divide operation will be aborted on a cycle boundary and the trap taken. 2. if enabled, a math error trap will be taken when an arithmetic operation on either accumulator a or b causes an overflow from bit 31 and the accumulator guard bits are not utilized. 3. if enabled, a math error trap will be taken when an arithmetic operation on either accumulator a or b causes a catastrophic overflow from bit 39 and all saturation is disabled. 4. if the shift amount specified in a shift instruction is greater than the maximum allowed shift amount, a trap will occur. note: if the user does not intend to take correc- tive action in the event of a trap error condition, these vectors must be loaded with the address of a default handler that simply contains the reset instruction. if, on the other hand, one of the vectors containing an invalid address is called, an address error trap is generated. dspic30f2011/2012/3012/3013 ds70139c-page 66 preliminary ? 2005 microchip technology inc. address error trap: this trap is initiated when any of the following circumstances occurs: 1. a misaligned data word access is attempted. 2. a data fetch from our unimplemented data memory location is attempted. 3. a data access of an unimplemented program memory location is attempted. 4. an instruction fetch from vector space is attempted. 5. execution of a ? bra #litera l? instruction or a ? goto #literal ? instruction, where literal is an unimplemented pr ogram memory address. 6. executing instructions after modifying the pc to point to unimplemented program memory addresses. the pc may be modified by loading a value into the stack and executing a return instruction. stack error trap: this trap is initiated under the following conditions: 1. the stack pointer is load ed with a value which is greater than the (user pr ogrammable) limit value written into the splim re gister (stack overflow). 2. the stack pointer is load ed with a value which is less than 0x0800 (simple stack underflow). oscillator fail trap: this trap is initiated if the external oscillator fails and operation becomes reliant on an internal rc backup. 8.3.2 hard and soft traps it is possible that multiple traps can become active within the same cycle (e.g., a misaligned word stack write to an overflowed address). in such a case, the fixed priority shown in figure 8-2 is implemented, which may require the user to check if other traps are pending, in order to comp letely correct the fault. ?soft? traps include exceptions of priority level 8 through level 11, inclusive. the arithm etic error trap (level 11) falls into this category of traps. ?hard? traps include exceptions of priority level 12 through level 15, inclusive. the address error (level 12), stack error (level 13) and oscillator error (level 14) traps fall into this category. each hard trap that occurs must be acknowledged before code execution of any type may continue. if a lower priority hard trap oc curs while a higher priority trap is pending, acknowl edged, or is being processed, a hard trap conflict will occur. the device is automatically re set in a hard trap conflict condition. the trapr status bit (rcon<15>) is set when the reset occurs, so that the condition may be detected in software. note: in the mac class of instructions, wherein the data space is split into x and y data space, unimplemented x space includes all of y space, and unimplemented y space includes all of x space. ? 2005 microchip technology inc. preliminary ds70139c-page 67 dspic30f2011/2012/3012/3013 figure 8-1: trap vectors 8.4 interrupt sequence all interrupt event flags are sampled in the beginning of each instruction cycle by t he ifsx registers. a pending interrupt request (irq) is indicated by the flag bit being equal to a ? 1 ? in an ifsx register. the irq will cause an interrupt to occur if the corr esponding bit in the interrupt enable (iecx) register is set. for the remainder of the instruction cycle, the prioriti es of all pending interrupt requests are evaluated. if there is a pending irq with a priority level greater than the current processor prio rity level in the ipl bits, the processor will be interrupted. the processor then stacks the current program counter and the low byte of the processor status register (srl), as shown in figure 8-2. the low byte of the status register contains the processor priority level at the time prior to the beginni ng of the interrupt cycle. the processor then loads the pr iority level for this inter- rupt into the status register. this action will disable all lower priority interrupts until the completion of the interrupt service routine. figure 8-2: interrupt stack frame the retfie (return from interrupt) instruction will unstack the program counter and status registers to return the processor to its state prior to the interrupt sequence. 8.5 alternate vector table in program memory, the interrupt vector table (ivt) is followed by the alternate in terrupt vector table (aivt), as shown in figure 8-1. acce ss to the alternate vector table is provided by the altivt bit in the intcon2 reg- ister. if the altivt bit is se t, all interrupt and exception processes will use the altern ate vectors instead of the default vectors. the alternat e vectors are organized in the same manner as the defa ult vectors. the aivt sup- ports emulation and debugging efforts by providing a means to switch between an application and a support environment without requirin g the interrupt vectors to be reprogrammed. this featur e also enables switching between applications for evaluation of different software algorithms at run time. if the aivt is not required, the program memory allo- cated to the aivt may be used for other purposes. aivt is not a protected section and may be freely programmed by the user. address error trap vector oscillator fail trap vector stack error trap vector reserved vector math error trap vector reserved oscillator fail trap vector address error trap vector reserved vector reserved vector interrupt 0 vector interrupt 1 vector ? ? ? interrupt 52 vector interrupt 53 vector math error trap vector decreasing priority 0x000000 0x000014 reserved stack error trap vector reserved vector reserved vector interrupt 0 vector interrupt 1 vector ? ? ? interrupt 52 vector interrupt 53 vector ivt aivt 0x000080 0x00007e 0x0000fe reserved 0x000094 reset - goto instruction reset - goto address 0x000002 reserved 0x000082 0x000084 0x000004 reserved vector note 1: the user can always lower the priority level by writing a new value into sr. the interrupt service rout ine must clear the interrupt flag bits in the ifsx register before lowering the processor interrupt priority, in order to avoid recursive interrupts. 2: the ipl3 bit (corcon<3>) is always clear when interrupts are being pro- cessed. it is set only during execution of traps. dspic30f2011/2012/3012/3013 ds70139c-page 68 preliminary ? 2005 microchip technology inc. 8.6 fast context saving a context saving option is available using shadow reg- isters. shadow registers are provided for the dc, n, ov, z and c bits in sr, an d the registers w0 through w3. the shadows are only one level deep. the shadow registers are accessible using the push.s and pop.s instructions only. when the processor vector s to an interrupt, the push.s instruction can be us ed to store the current value of the aforementioned registers into their respective shadow registers. if an isr of a certain priority uses the push.s and pop.s instructions for fast context saving, then a higher priority isr should not include the same instruc- tions. users must save the key registers in software during a lower priority interr upt if the higher priority isr uses fast context saving. 8.7 external interrupt requests the interrupt controller sup ports three external inter- rupt request signals, int0-i nt2. these inputs are edge sensitive; they require a lo w-to-high or a high-to-low transition to generate an interrupt request. the intcon2 register has three bits, int0ep-int2ep, that select the polarity of t he edge detection circuitry. 8.8 wake-up from sleep and idle the interrupt controller may be used to wake-up the processor from either sleep or idle modes, if sleep or idle mode is active when t he interrupt is generated. if an enabled interrupt request of sufficient priority is received by the interrupt co ntroller, then the standard interrupt request is presented to the processor. at the same time, the processor will wake-up from sleep or idle and begin execution of the interrupt service routine (isr) needed to process the interrupt request. ? 2005 microchip technology inc. preliminary ds70139c-page 69 dspic30f2011/2012/3012/3013 table 8-2: dspic30f2011/2012/3012 inte rrupt controller register map note: refer to dspic30f family reference manua l (ds70046) for descriptions of register bit fields. sfr name adr bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 b it 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state intcon1 0080 nstdis ? ? ? ? ovate ovbte covte ? ? ? matherr addrerr stkerr oscfail ? 0000 0000 0000 0000 intcon2 0082 altivt disi ? ? ? ? ? ? ? ? ? ? ? int2ep int1ep int0ep 0000 0000 0000 0000 ifs0 0084 cnif mi2cif si2cif nvmif adif u1txif u1rxif s pi1if t3if t2if oc2if ic2if t1if oc1if ic1if int0if 0000 0000 0000 0000 ifs1 0086 ? ? ? ? ? ? ? ?int2if ? ? ? ? ? ? int1if 0000 0000 0000 0000 ifs2 0088 ? ? ? ? ?lvdif ? ? ? ? ? ? ? ? ? 0000 0000 0000 0000 iec0 008c cnie mi2cie si2cie nvmie adie u1txie u1rxie s pi1ie t3ie t2ie oc2ie ic2ie t1ie oc1ie ic1ie int0ie 0000 0000 0000 0000 iec1 008e ? ? ? ? ? ? ? ?int2ie ? ? ? ? ? ? int1ie 0000 0000 0000 0000 iec2 0090 ? ? ? ? ?lvdie ? ? ? ? ? ? ? ? ? ? 0000 0000 0000 0000 ipc0 0094 ? t1ip<2:0> ?oc1ip<2:0> ? ic1ip<2:0> ? int0ip<2:0> 0100 0100 0100 0100 ipc1 0096 ? t31p<2:0> ? t2ip<2:0> ?oc2ip<2:0> ? ic2ip<2:0> 0100 0100 0100 0100 ipc2 0098 ? adip<2:0> ? u1txip<2:0> ? u1rxip<2:0> ? spi1ip<2:0> 0100 0100 0100 0100 ipc3 009a ? cnip<2:0> ? mi2cip<2:0> ? si2cip<2:0> ?nvmip<2:0> 0100 0100 0100 0100 ipc4 009c ? ? ? ? ? ? ? ? ? ? ? ? ? int1ip<2:0> 0000 0000 0000 0100 ipc5 009e ? int2ip<2:0> ? ? ? ? ? ? ? ? ? ? ? ? 0100 0000 0000 0000 ipc6 00a0 ? ? ? ? ? ? ? ? ?10 0 ?100 0000 0000 0100 0100 ipc7 00a2 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? 0000 0000 0000 0000 ipc8 00a4 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? 0000 0000 0000 0000 ipc9 00a6 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? 0000 0000 0000 0000 ipc10 00a8 ? ? ? ? ? lvdip<2:0> ? ? ? ? ? ? ? ? 0000 0100 0000 0000 legend: u = uninitialized bit dspic30f2011/2012/3012/3013 ds70139c-page 70 preliminary ? 2005 microchip technology inc. table 8-3: DSPIC30F3013 interrupt controller register map note: refer to dspic30f family reference manua l (ds70046) for descriptions of register bit fields. sfr name adr bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 b it 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state intcon1 0080 nstdis ? ? ? ? ovate ovbte covte ? ? ? matherr addrerr stkerr oscfail ? 0000 0000 0000 0000 intcon2 0082 altivt disi ? ? ? ? ? ? ? ? ? ? ? int2ep int1ep int0ep 0000 0000 0000 0000 ifs0 0084 cnif mi2cif si2cif nvmif adif u1txif u1rxif s pi1if t3if t2if oc2if ic2if t1if oc1if ic1if int0if 0000 0000 0000 0000 ifs1 0086 ? ? ? ? ? ? u2txif u2rxif int2if ? ? ? ? ? ? int1if 0000 0000 0000 0000 ifs2 0088 ? ? ? ? ?lvdif ? ? ? ? ? ? ? ? ? ? 0000 0000 0000 0000 iec0 008c cnie mi2cie si2cie nvmie adie u1txie u1rxie s pi1ie t3ie t2ie oc2ie ic2ie t1ie oc1ie ic1ie int0ie 0000 0000 0000 0000 iec1 008e ? ? ? ? ? u2txie u2rxie int2ie ? ? ? ? ? ? int1ie 0000 0000 0000 0000 iec2 0090 ? ? ? ? ?lvdie ? ? ? ? ? ? ? ? ? ? 0000 0000 0000 0000 ipc0 0094 ? t1ip<2:0> ?oc1ip<2:0> ? ic1ip<2:0> ? int0ip<2:0> 0100 0100 0100 0100 ipc1 0096 ? t31p<2:0> ? t2ip<2:0> ?oc2ip<2:0> ? ic2ip<2:0> 0100 0100 0100 0100 ipc2 0098 ? adip<2:0> ? u1txip<2:0> ? u1rxip<2:0> ? spi1ip<2:0> 0100 0100 0100 0100 ipc3 009a ? cnip<2:0> ? mi2cip<2:0> ? si2cip<2:0> ?nvmip<2:0> 0100 0100 0100 0100 ipc4 009c ? ? ? ? ? ? ? ? ? ? ? ? ? int1ip<2:0> 0000 0000 0000 0100 ipc5 009e ? int2ip<2:0> ? ? ? ? ? ? ? ? ? 0100 0000 0000 0000 ipc6 00a0 ? ? ? ? ? ? ? ? ? u2txip<2:0> ? u2rxip<2:0> 0000 0000 0100 0100 ipc7 00a2 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? 0000 0000 0000 0000 ipc8 00a4 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? 0000 0000 0000 0000 ipc9 00a6 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? 0000 0000 0000 0000 ipc10 00a8 ? ? ? ? ? lvdip<2:0> ? ? ? ? ? ? ? ? 0000 0100 0000 0000 legend: u = uninitialized bit ? 2005 microchip technology inc. preliminary ds70139c-page 71 dspic30f2011/2012/3012/3013 9.0 timer1 module this section describes th e 16-bit general purpose (gp) timer1 module and associated operational modes. figure 9-1 depicts t he simplified block diagram of the 16-bit timer1 module. the following sections provide detailed descriptio ns including setup and con- trol registers, along with associated block diagrams for the operational modes of the timers. the timer1 module is a 16-bit timer that serves as the time counter for the real-tim e clock or operates as a free-running interval timer/counter. the 16-bit timer has the following modes: ? 16-bit timer ? 16-bit synchronous counter ? 16-bit asynchronous counter these operational characteristics are supported: ? timer gate operation ? selectable prescaler settings ? timer operation during cpu idle and sleep modes ? interrupt on 16-bit period register match or falling edge of external gate signal these operating modes are determined by setting the appropriate bit(s) in the 16-bit sfr, t1con. figure 9-1 presents a block diagram of the 16-bit timer module. 16-bit timer mode: in the 16-bit timer mode, the timer increments on every instruction cycle up to a match value preloaded into the period register pr1, then resets to ? 0 ? and continues to count. when the cpu goes into the idle mode, the timer stops incrementing unless the tsidl (t1con<13>) bit = 0 . if tsidl = 1 , the timer module logic resumes the incre- menting sequence on terminat ion of cpu idle mode. 16-bit synchronous counter mode: in the 16-bit synchronous counter mode, the timer increments on the rising edge of the appl ied external clock signal which is synchronized with the internal phase clocks. the timer counts up to a ma tch value preloaded in pr1, then resets to ? 0 ? and continues. when the cpu goes into the idle mode, the timer will stop incrementing unless the respective tsidl bit = 0 . if tsidl = 1 , the timer module logic will resume the incrementing sequence upon termination of the cpu idle mode. 16-bit asynchronous counter mode: in the 16-bit asynchronous counter mode, the timer increments on every rising edge of the a pplied external clock signal. the timer counts up to a ma tch value preloaded in pr1, then resets to ? 0 ? and continues. when the timer is configur ed for the asynchronous mode of operation and t he cpu goes into the idle mode, the timer will stop incrementing if tsidl = 1 . figure 9-1: 16-bit timer1 module block diagram note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descr iptions and general device functionality, refer to the dspic30f family reference manual (ds70046). ton sync sosci sosco/ pr1 t1if equal comparator x 16 tmr1 reset lposcen event flag 1 0 tsync q q d ck tgate tckps<1:0> prescaler 1, 8, 64, 256 2 tgate t cy 1 0 t1ck tcs 1 x 0 1 tgate 0 0 gate sync dspic30f2011/2012/3012/3013 ds70139c-page 72 preliminary ? 2005 microchip technology inc. 9.1 timer gate operation the 16-bit timer can be plac ed in the gated time accu- mulation mode. this mode allows the internal t cy to increment the respective time r when the gate input sig- nal (t1ck pin) is asserted high. control bit tgate (t1con<6>) must be set to enable this mode. the timer must be enabled (ton = 1 ) and the timer clock source set to internal (tcs = 0 ). when the cpu goes into the idle mode, the timer will stop incrementing unless tsidl = 0 . if tsidl = 1 , the timer will resume the incrementing sequence upon termination of the cpu idle mode. 9.2 timer prescaler the input clock (f osc /4 or external clock) to the 16-bit timer has a prescale option of 1:1, 1:8, 1:64 and 1:256, selected by control bits tckps<1:0> (t1con<5:4>). the prescaler counter is cleared when any of the following occurs: ? a write to the tmr1 register ? a write to the t1con register ? device reset, such as por and bor however, if the timer is disabled (ton = 0 ), then the timer prescaler cannot be re set since the prescaler clock is halted. tmr1 is not cleared when t1con is written. it is cleared by writing to the tmr1 register. 9.3 timer operation during sleep mode during cpu sleep mode, the timer will operate if: ? the timer module is enabled (ton = 1 ) and ? the timer clock source is selected as external (tcs = 1 ) and ? the tsync bit (t1con<2>) is asserted to a logic ? 0 ? which defines the external clock source as asynchronous. when all three conditions ar e true, the timer will con- tinue to count up to the pe riod register and be reset to 0x0000. when a match between the ti mer and the period regis- ter occurs, an interrupt can be generated if the respective timer interrup t enable bit is asserted. 9.4 timer interrupt the 16-bit timer has the ability to generate an interrupt on period match. when the timer count matches the period register, the t1if bit is as serted and an interrupt will be generated if enabled. the t1if bit must be cleared in software. the timer interrupt fl ag, t1if, is located in the ifs0 control register in the interrupt controller. when the gated time accu mulation mode is enabled, an interrupt will also be g enerated on the falling edge of the gate signal (at the end of the accumulation cycle). enabling an interrupt is accomplished via the respec- tive timer interrupt enable bit, t1ie. the timer interrupt enable bit is located in the ie c0 control register in the interrupt controller. 9.5 real-time clock timer1, when operating in real-time clock (rtc) mode, provides time of day and event time-stamping capabilities. key operational features of the rtc are: ? operation from 32 khz lp oscillator ? 8-bit prescaler ?low power ? real-time clock interrupts these operating modes are de termined by setting the appropriate bit(s) in the t1con control register. figure 9-2: recommended components for timer1 lp oscillator rtc sosci sosco r c1 c2 dspic30fxxxx 32.768 khz xtal c1 = c2 = 18 pf; r = 100k ? 2005 microchip technology inc. preliminary ds70139c-page 73 dspic30f2011/2012/3012/3013 9.5.1 rtc oscillator operation when the ton = 1 , tcs = 1 and tgate = 0 , the timer increments on the rising edg e of the 32 khz lp oscilla- tor output signal, up to the va lue specified in the period register and is then reset to ? 0 ?. the tsync bit must be asserted to a logic ? 0 ? (asynchronous mode) for correct operation. enabling lposcen (osccon<1>) will disable the normal timer and counter modes and enable a timer carry-out wake-up event. when the cpu enters sleep mode, the rtc will con- tinue to operate provided the 32 khz external crystal oscillator is active and t he control bits have not been changed. the tsidl bit should be cleared to ? 0 ? in order for rtc to continue operation in idle mode. 9.5.2 rtc interrupts when an interrupt event occu rs, the respective interrupt flag, t1if, is asserted and an interrupt will be generated if enabled. the t1if bit must be cleared in software. the respective timer interrupt flag, t1if, is located in the ifs0 status register in the interrupt controller. enabling an interrupt is ac complished via the respec- tive timer interrupt enable bi t, t1ie. the timer interrupt enable bit is located in the ie c0 control register in the interrupt controller. dspic30f2011/2012/3012/3013 ds70139c-page 74 preliminary ? 2005 microchip technology inc. table 9-1: timer1 register map note: refer to dspic30f family reference manua l (ds70046) for descriptions of register bit fields. sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state tmr1 0100 timer1 register uuuu uuuu uuuu uuuu pr1 0102 period register 1 1111 1111 1111 1111 t1con 0104 ton ?tsidl ? ? ? ? ? ? tgate tckps1 tckps0 ?tsynctcs ? 0000 0000 0000 0000 legend: u = uninitialized bit ? 2005 microchip technology inc. preliminary ds70139c-page 75 dspic30f2011/2012/3012/3013 10.0 timer2/3 module this section describes th e 32-bit general purpose (gp) timer module (timer2/3) and associated opera- tional modes. figure 10-1 de picts the simplified block diagram of the 32-bit ti mer2/3 module. figure 10-2 and figure 10-3 show timer2/3 configured as two independent 16-bit timers, timer2 and timer3, respectively. the timer2/3 module is a 32-bit timer (which can be configured as two 16-bit timers) with selectable operating modes. these time rs are utilized by other peripheral modules, such as: ? input capture ? output compare/simple pwm the following sections prov ide a detailed description, including setup and control re gisters, along with asso- ciated block diagrams for the operational modes of the timers. the 32-bit timer has the following modes: ? two independent 16-bit timers (timer2 and timer3) with all 16-bit operating modes (except asynchronous counter mode) ? single 32-bit timer operation ? single 32-bit synchronous counter further, the following operational characteristics are supported: ? adc event trigger ? timer gate operation ? selectable prescaler settings ? timer operation during idle and sleep modes ? interrupt on a 32-bit period register match these operating modes are de termined by setting the appropriate bit(s) in the 16-bit t2con and t3con sfrs. for 32-bit timer/counter oper ation, timer2 is the ls word and timer3 is the ms word of the 32-bit timer. 16-bit timer mode: in the 16-bit mode, timer2 and timer3 can be configured as two independent 16-bit timers. each timer can be se t up in either 16-bit timer mode or 16-bit synchr onous counter mode. see section 9.0, timer1 module for details on these two operating modes. the only functional differ ence between timer2 and timer3 is that timer2 prov ides synchronization of the clock prescaler out put. this is useful for high frequency external clock inputs. 32-bit timer mode: in the 32-bit timer mode, the timer increments on every instruction cycle, up to a match value preloaded into th e combined 32-bit period register pr3/pr2, then resets to ? 0 ? and continues to count. for synchronous 32-bit reads of the timer2/timer3 pair, reading the ls word (tmr2 register) will cause the ms word to be read and latched into a 16-bit holding register, termed tmr3hld. for synchronous 32-bit writes, the holding register (tmr3hld) must first be written to. when followed by a write to the tmr2 register, the contents of tmr3hld will be transferred and latc hed into the msb of the 32-bit timer (tmr3). 32-bit synchronous counter mode: in the 32-bit synchronous counter mode, the timer increments on the rising edge of the appl ied external clock signal which is synchronized with the internal phase clocks. the timer counts up to a ma tch value preloaded in the combined 32-bit period regist er pr3/pr2, then resets to ? 0 ? and continues. when the timer is config ured for the synchronous counter mode of operation and the cpu goes into the idle mode, the timer will stop incrementing unless the tsidl (t2con<13>) bit = 0 . if tsidl = 1 , the timer module logic will resume the incrementing sequence upon termination of the cpu idle mode. note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descr iptions and general device functionality, refer to the dspic30f family reference manual (ds70046). note: for 32-bit timer operation, t3con control bits are ignored. only t2con control bits are used for setup and control. timer2 clock and gate inputs are utilized for the 32-bit timer module bu t an interrupt is gen- erated with the timer3 interrupt flag (t3if) and the interrupt is enabled with the timer3 interrupt enable bit (t3ie). dspic30f2011/2012/3012/3013 ds70139c-page 76 preliminary ? 2005 microchip technology inc. figure 10-1: 32-bit timer2/3 block diagram tmr3 tmr2 t3if equal comparator x 32 pr3 pr2 reset lsb msb event flag note: timer configuration bit t32 (t2con<3>) must be set to ? 1 ? for a 32-bit timer/counter operation. all control bits are respective to the t2con register. data bus<15:0> read tmr2 write tmr2 16 16 16 q q d ck tgate (t2con<6>) (t2con<6>) tgate 0 1 ton tckps<1:0> 2 t cy tcs 1 x 0 1 tgate 0 0 gate t2ck sync adc event trigger sync tmr3hld prescaler 1, 8, 64, 256 ? 2005 microchip technology inc. preliminary ds70139c-page 77 dspic30f2011/2012/3012/3013 figure 10-2: 16-bit timer2 block diagram figure 10-3: 16-bit timer3 block diagram ton sync pr2 t2if equal comparator x 16 tmr2 reset event flag tgate tckps<1:0> 2 tgate t cy 1 0 tcs 1 x 0 1 tgate 0 0 gate t2ck sync prescaler 1, 8, 64, 256 q q d ck ton pr3 t3if equal comparator x 16 tmr3 reset event flag tgate tckps<1:0> 2 tgate t cy 1 0 tcs 1 x 0 1 tgate 0 0 t3ck adc event trigger sync q q d ck prescaler 1, 8, 64, 256 dspic30f2011/2012/3012/3013 ds70139c-page 78 preliminary ? 2005 microchip technology inc. 10.1 timer gate operation the 32-bit timer can be plac ed in the gated time accu- mulation mode. this mode allows the internal t cy to increment the respective time r when the gate input sig- nal (t2ck pin) is asserted high. control bit tgate (t2con<6>) must be set to enable this mode. when in this mode, timer2 is the or iginating clock source. the tgate setting is ignored fo r timer3. the timer must be enabled (ton = 1 ) and the timer clock source set to internal (tcs = 0 ). the falling edge of the extern al signal terminates the count operation but does not reset the timer. the user must reset the timer in order to start counting from zero. 10.2 adc event trigger when a match occurs betw een the 32-bit timer (tmr3/ tmr2) and the 32-bit combined period register (pr3/ pr2), or between the 16-bit timer tmr3 and the 16-bit period register pr3, a spec ial adc trigger event signal is generated by timer3. 10.3 timer prescaler the input clock (f osc /4 or external clock) to the timer has a prescale option of 1:1, 1:8, 1:64, and 1:256, selected by control bits tckps<1:0> (t2con<5:4> and t3con<5:4>). for the 32 -bit timer operation, the originating clock source is timer2. the prescaler oper- ation for timer3 is not appl icable in this mode. the prescaler counter is cleared when any of the following occurs: ? a write to the tmr2/tmr3 register ? a write to the t2con/t3con register ? device reset, such as por and bor however, if the timer is disabled (ton = 0 ), then the timer 2 prescaler cannot be reset since the prescaler clock is halted. tmr2/tmr3 is not cleared when t2con/t3con is written. 10.4 timer operation during sleep mode during cpu sleep mode, the timer will not operate because the internal clocks are disabled. 10.5 timer interrupt the 32-bit timer module can generate an interrupt on period match or on the falli ng edge of the external gate signal. when the 32-bit timer count matches the respective 32-bit period regi ster, or the falling edge of the external ?gate? signal is detected, the t3if bit (ifs0<7>) is asserted and an interrupt will be gener- ated if enabled. in this mo de, the t3if interrupt flag is used as the source of the interrupt. the t3if bit must be cleared in software. enabling an interrupt is accomplished via the respective timer interrupt enable bit, t3ie (iec0<7>). ? 2005 microchip technology inc. preliminary ds70139c-page 79 dspic30f2011/2012/3012/3013 table 10-1: timer2/3 register map note: refer to dspic30f family reference manua l (ds70046) for descriptions of register bit fields. sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state tmr2 0106 timer2 register uuuu uuuu uuuu uuuu tmr3hld 0108 timer3 holding register (for 32-bit timer operations only) uuuu uuuu uuuu uuuu tmr3 010a timer3 register uuuu uuuu uuuu uuuu pr2 010c period register 2 1111 1111 1111 1111 pr3 010e period register 3 1111 1111 1111 1111 t2con 0110 ton ?tsidl ? ? ? ? ? ? tgate tckps1 tckps0 t32 ?tcs ? 0000 0000 0000 0000 t3con 0112 ton ?tsidl ? ? ? ? ? ? tgate tckps1 tckps0 ? ?tcs ? 0000 0000 0000 0000 legend: u = uninitialized bit dspic30f2011/2012/3012/3013 ds70139c-page 80 preliminary ? 2005 microchip technology inc. notes: ? 2005 microchip technology inc. preliminary ds70139c-page 81 dspic30f2011/2012/3012/3013 11.0 input capture module this section describes the input capture module and associated operational modes. the features provided by this module are useful in applications requiring fre- quency (period) an d pulse measurement. figure 11-1 depicts a block diagram of the input cap- ture module. input capture is useful for such modes as: ? frequency/period/pulse measurements ? additional sources of external interrupts important operational featur es of the input capture module are its ? simple capture event mode ? timer2 and timer3 mode selection ? interrupt on input capture event these operating modes are determined by setting the appropriate bits in the ic 1con and ic2con registers. the dspic30f2011/2012/3012/3013 devices have two capture channels. 11.1 simple capture event mode the simple capture events in the dspic30f product family are: ? capture every falling edge ? capture every rising edge ? capture every 4th rising edge ? capture every 16th rising edge ? capture every rising and falling edge these simple input captur e modes are configured by setting the appropriate bits icm<2:0> (icxcon<2:0>). 11.1.1 capture prescaler there are four input captur e prescaler settings speci- fied by bits icm<2:0> (icxcon<2:0>). whenever the capture channel is turned off, the prescaler counter will be cleared. in addition, an y reset will clear the prescaler counter. figure 11-1: input capture mode block diagram note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descr iptions and general device functionality, refer to the dspic30f family reference manual (ds70046). icxbuf prescaler icx pin icm<2:0> mode select 3 note: where ?x? is shown, reference is made to the register s or bits associated to the respective input capture channel (1 or 2). 10 set flag icxif ictmr t2_cnt t3_cnt edge detection logic clock synchronizer 1, 4, 16 from gp timer module 16 16 fifo r/w logic ici<1:0> icbne, icov icxcon interrupt logic set flag icxif data bus dspic30f2011/2012/3012/3013 ds70139c-page 82 preliminary ? 2005 microchip technology inc. 11.1.2 capture buffer operation each capture channel has an associated fifo buffer which is four 16-bit words deep. there are two status flags which provide status on the fifo buffer: ? icbfne - input capture buffer not empty ? icov - input capture overflow the icbfne will be set on the first input capture event and remain set until all capt ure events have been read from the fifo. as each word is read from the fifo, the remaining words are advanced by one position within the buffer. in the event that the fifo is full with four capture events and a fifth capture ev ent occurs prior to a read of the fifo, an overflow c ondition will occur and the icov bit will be set to a logic ? 1 ?. the fifth capture event is lost and is not stored in the fifo. no additional events will be captured unti l all four events have been read from the buffer. if a fifo read is performed after the last read and no new capture event has be en received, the read will yield indeterminate results. 11.1.3 timer2 and timer3 selection mode the input capture module consis ts of up to 8 input cap- ture channels. each channe l can select between one of two timers for the time base, timer2 or timer3. selection of the timer resource is accomplished through sfr bit, ictmr (icxcon<7>). timer3 is the default timer resource available for the input capture module. 11.1.4 hall sensor mode when the input capture modu le is set for capture on every edge, rising and falling, icm<2:0> = 001 , the fol- lowing operations are performed by the input capture logic: ? the input capture interrupt flag is set on every edge, rising and falling. ? the interrupt on capture mode setting bits, ici<1:0>, is ignored since every capture generates an interrupt. ? a capture overflow condition is not generated in this mode. 11.2 input capture operation during sleep and idle modes an input capture event will generate a device wake-up or interrupt, if enabled, if the device is in cpu idle or sleep mode. independent of the timer bei ng enabled, the input cap- ture module will wake-up from the cpu sleep or idle mode when a capture event occurs if icm<2:0> = 111 and the interrupt enable bit is asserted. the same wake- up can generate an interrupt if the conditions for pro- cessing the interrupt have been satisfied. the wake-up feature is useful as a method of adding extra external pin interrupts. 11.2.1 input capture in cpu sleep mode cpu sleep mode allows i nput capture module opera- tion with reduced functional ity. in the cpu sleep mode, the ici<1:0> bits are not a pplicable and the input cap- ture module can only function as an external interrupt source. the capture module must be configured for interrupt only on rising edge (icm<2:0> = 111 ) in order for the input capture module to be used while the device is in sleep mode. the prescale se ttings of 4:1 or 16:1 are not applicable in this mode. 11.2.2 input capture in cpu idle mode cpu idle mode allows input capture module operation with full functionality. in the cpu idle mode, the inter- rupt mode selected by the ic i<1:0> bits is applicable, as well as the 4:1 and 16: 1 capture prescale settings which are defined by control bits icm<2:0>. this mode requires the selected time r to be enabled. moreover, the icsidl bit must be asserted to a logic ? 0 ?. if the input capture module is defined as icm<2:0> = 111 in cpu idle mode, the input capture pin will serve only as an external interrupt pin. 11.3 input capture interrupts the input capture channels hav e the ability to generate an interrupt based upon t he selected number of cap- ture events. the selection number is set by control bits ici<1:0> (icxcon<6:5>). each channel provides an interrupt flag (icxif) bit. the respective capture channel in terrupt flag is located in the corresponding ifsx status register. enabling an interrupt is accomplished via the respec- tive capture channel interr upt enable (icxie) bit. the capture interrupt enable bit is located in the corresponding iec control register. ? 2005 microchip technology inc. preliminary ds70139c-page 83 dspic30f2011/2012/3012/3013 table 11-1: input capture register map note: refer to dspic30f family reference manua l (ds70046) for descriptions of register bit fields. sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 b it 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state ic1buf 0140 input 1 capture register uuuu uuuu uuuu uuuu ic1con 0142 ? ?icsidl ? ? ? ? ? ictmr ici<1:0> icov icbne icm<2:0> 0000 0000 0000 0000 ic2buf 0144 input 2 capture register uuuu uuuu uuuu uuuu ic2con 0146 ? ?icsidl ? ? ? ? ? ictmr ici<1:0> icov icbne icm<2:0> 0000 0000 0000 0000 legend: u = uninitialized bit dspic30f2011/2012/3012/3013 ds70139c-page 84 preliminary ? 2005 microchip technology inc. notes: ? 2005 microchip technology inc. preliminary ds70139c-page 85 dspic30f2011/2012/3012/3013 12.0 output compare module this section describes the output compare module and associated operational modes. the features provided by this module are useful in applications requiring operational modes, such as: ? generation of variable width output pulses ? power factor correction figure 12-1 depicts a bloc k diagram of the output compare module. the key operational features of the output compare module include: ? timer2 and timer3 selection mode ? simple output compare match mode ? dual output compare match mode ? simple pwm mode ? output compare during sleep and idle modes ? interrupt on output compare/pwm event these operating modes are determined by setting the appropriate bits in the 16-bit oc1con and oc2con registers. the dspic30f20 11/2012/3012/3013 devices have 2 compare channels. ocxrs and ocxr in figure 12-1 represent the dual compare registers. in the dual compare mode, the ocxr register is used for the first compare and ocxrs is used for the second compare. figure 12-1: output compare mode block diagram note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descr iptions and general device functionality, refer to the dspic30f family reference manual (ds70046). ocxr comparator output logic q s r ocm<2:0> output ocx set flag bit ocxif ocxrs mode select 3 note: where ?x? is shown, reference is made to the regist ers associated with the respective output compare channel (1 or 2). ocfa octsel 01 t2p2_match tmr2<15:0 tmr3<15:0> t3p3_match from gp (for x = 1, 2, 3 or 4) 01 timer module enable dspic30f2011/2012/3012/3013 ds70139c-page 86 preliminary ? 2005 microchip technology inc. 12.1 timer2 and timer3 selection mode each output compare channel can select between one of two 16-bit timers, timer2 or timer3. the selection of the timers is controlled by the octsel bit (ocxcon<3>). timer2 is the default timer resource for the output compare module. 12.2 simple output compare match mode when control bits ocm<2:0> (ocxcon<2:0>) = 001 , 010 or 011 , the selected output compare channel is configured for one of thre e simple output compare match modes: ? compare forces i/o pin low ? compare forces i/o pin high ? compare toggles i/o pin the ocxr register is used in these modes. the ocxr register is loaded with a va lue and is compared to the selected incrementing timer count. when a compare occurs, one of these compare match modes occurs. if the counter resets to zero before reaching the value in ocxr, the state of the ocx pin remains unchanged. 12.3 dual output compare match mode when control bits ocm<2:0> (ocxcon<2:0>) = 100 or 101 , the selected output comp are channel is config- ured for one of two dual output compare modes, which are: ? single output pulse mode ? continuous output pulse mode 12.3.1 single pulse mode for the user to configure the module for the generation of a single output pulse, the following steps are required (assuming timer is off): ? determine instruction cycle time t cy . ? calculate desired pulse width value based on t cy . ? calculate time to start pulse from timer start value of 0x0000. ? write pulse width start and stop times into ocxr and ocxrs compare registers (x denotes channel 1, 2, ...,n). ? set timer period register to value equal to, or greater than value in ocxrs compare register. ? set ocm<2:0> = 100 . ? enable timer, ton (txcon<15>) = 1 . to initiate another single pulse, issue another write to set ocm<2:0> = 100 . 12.3.2 continuous pulse mode for the user to configure t he module for the generation of a continuous stream of output pulses, the following steps are required: ? determine instruction cycle time t cy . ? calculate desired pul se value based on t cy . ? calculate timer to start pulse width from timer start value of 0x0000. ? write pulse width start and stop times into ocxr and ocxrs (x denotes channel 1, 2, ...,n) compare registers, respectively. ? set timer period register to value equal to, or greater than value in ocxrs compare register. ? set ocm<2:0> = 101 . ? enable timer, ton (txcon<15>) = 1 . 12.4 simple pwm mode when control bits ocm<2:0> (ocxcon<2:0>) = 110 or 111 , the selected output compare channel is config- ured for the pwm mode of operation. when configured for the pwm mode of operation , ocxr is the main latch (read only) and ocxrs is the secondary latch. this enables glitchless pwm transitions. the user must perform the following steps in order to configure the output compare module for pwm operation: 1. set the pwm period by writing to the appropriate period register. 2. set the pwm duty cycle by writing to the ocxrs register. 3. configure the output compare module for pwm operation. 4. set the tmrx prescale value and enable the timer, ton (txcon<15>) = 1 . 12.4.1 input pin fault protection for pwm when control bits ocm<2:0> (ocxcon<2:0>) = 111 , the selected output compare channel is again config- ured for the pwm mode of op eration with the additional feature of input fault protection. while in this mode, if a logic ? 0 ? is detected on the ocfa/b pin, the respec- tive pwm output pin is pl aced in the high impedance input state. the ocflt bit (ocxcon<4>) indicates whether a fault condition has occurred. this state will be maintained until both of the following events have occurred: ? the external fault condition has been removed. ? the pwm mode has been re-enabled by writing to the appropriate control bits. ? 2005 microchip technology inc. preliminary ds70139c-page 87 dspic30f2011/2012/3012/3013 12.4.2 pwm period the pwm period is specified by writing to the prx register. the pwm period can be calculated using equation 12-1. equation 12-1: pwm frequency is defined as 1 / [pwm period]. when the selected tmrx is equal to its respective period register, prx, the foll owing four events occur on the next increment cycle: ? tmrx is cleared. ? the ocx pin is set. - exception 1: if pwm duty cycle is 0x0000, the ocx pin will remain low. - exception 2: if duty cycl e is greater than prx, the pin will remain high. ? the pwm duty cycle is latched from ocxrs into ocxr. ? the corresponding timer interrupt flag is set. see figure 12-2 for key pwm period comparisons. timer3 is referred to in figure 12-2 for clarity. figure 12-2: pwm output timing 12.5 output compare operation during cpu sleep mode when the cpu enters sleep mode, all internal clocks are stopped. therefore, when the cpu enters the sleep state, the output comp are channel will drive the pin to the active state t hat was observed prior to entering the cpu sleep state. for example, if the pin was high when the cpu entered the sleep state, the pin will remain high. likewise, if the pin was low when the cpu en tered the sleep state, the pin will remain low. in eit her case, the output compare module will resume operat ion when the device wakes up. 12.6 output compare operation during cpu idle mode when the cpu enters the idle mode, the output compare module can operate with full functionality. the output compare channel will operate during the cpu idle mode if the ocsi dl bit (ocxcon<13>) is at logic ? 0 ? and the selected time base (timer2 or timer3) is enabled and the tsidl bit of the selected timer is set to logic ? 0 ?. 12.7 output compare interrupts the output compare channels have the ability to gener- ate an interrupt on a comp are match, for whichever match mode has been selected. for all modes except the pwm mode, when a compare event occurs, the respective interrupt flag (ocxif) is asserted and an interrupt will be generated if enabled. the ocxif bit is located in the corresponding ifs status register and must be cleared in software. the interrupt is enabled via the respective compare inter- rupt enable (ocxie) bit lo cated in the corresponding iec control register. for the pwm mode, when an event occurs, the respec- tive timer interrupt flag (t 2if or t3if) is asserted and an interrupt will be generated if enabled. the if bit is located in the ifs0 status register and must be cleared in software. the interrupt is enabled via the respective timer interrupt enable bit (t 2ie or t3ie) located in the iec0 control register. the output compare interrupt flag is never set during the pwm mode of operation. pwm period = [(prx) + 1] ? 4 ? t osc ? (tmrx prescale value) period duty cycle tmr3 = duty cycle tmr3 = duty cycle tmr3 = pr3 t3if = 1 (interrupt flag) ocxr = ocxrs tmr3 = pr3 (interrupt flag) ocxr = ocxrs t3if = 1 (ocxr) (ocxr) dspic30f2011/2012/3012/3013 ds70139c-page 88 preliminary ? 2005 microchip technology inc. table 12-1: output compare register map note: refer to dspic30f family reference manua l (ds70046) for descriptions of register bit fields. sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 b it 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state oc1rs 0180 output compare 1 secondary register 0000 0000 0000 0000 oc1r 0182 output compare 1 main register 0000 0000 0000 0000 oc1con 0184 ? ?ocsidl ? ? ? ? ? ? ? ? ocflt octsel ocm<2:0> 0000 0000 0000 0000 oc2rs 0186 output compare 2 secondary register 0000 0000 0000 0000 oc2r 0188 output compare 2 main register 0000 0000 0000 0000 oc2con 018a ? ?ocsidl ? ? ? ? ? ? ? ? ocflt octse ocm<2:0> 0000 0000 0000 0000 legend: u = uninitialized bit ? 2005 microchip technology inc. preliminary ds70139c-page 89 dspic30f2011/2012/3012/3013 13.0 spi module the serial peripheral interf ace (spi) module is a syn- chronous serial interface. it is useful for communicating with other peripheral devices, such as eeproms, shift registers, display drivers and a/d converters, or other microcontrollers. it is compatible with motorola's spi and siop interfaces. the dspic30f2011/2012/3012/ 3013 devices feature one spi module, spi1. 13.1 operating function description figure 13-1 is a simplified block diagram of the spi module, which consists of a 16-bit shift register, spi1sr , used for shifting da ta in and out, and a buffer register, spi1buf. control register spi1con (not shown) configures the module. additionally, status reg- ister spi1stat (not shown) indicates various status conditions. four i/o pins comprise the serial interface: ? sdi1 (serial data input) ? sdo1 (serial data output) ? sck1 (shift clock input or output) ? ss1 (active low slave select). in master mode operation, sck1 is a clock output. in slave mode, it is a clock input. a series of eight (8) or sixt een (16) clock pulses shift out bits from the spi1sr to sdo1 pin and simulta- neously shift in data from sdi1 pin. an interrupt is generated when the transfer is complete and the interrupt flag bit (spi1if) is set. this interrupt can be disabled through the interrupt enable bit spi1ie. the receive operation is d ouble-buffered. when a com- plete byte is received, it is transferred from spi1sr to spi1buf. if the receive buffer is full when new data is being trans- ferred from spi1sr to spi1buf, the module will set the spirov bit indicating an ov erflow condition. the trans- fer of the data from spi1sr to spi1buf will not be completed and the new data will be lost. the module will not respond to scl trans itions while spirov is ? 1 ?, effectively disabling the mo dule until spi1buf is read by user software. transmit writes are also double-buffered. the user writes to spi1buf. when the master or slave transfer is completed, the contents of the shift register (spi1sr) are moved to the receive buffer. if any trans- mit data has been written to the buffer register, the con- tents of the transmit buffer are moved to spi1sr. the received data is thus placed in spi1buf and the trans- mit data in spi1sr is ready for the next transfer. figure 13-1: spi block diagram note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descr iptions and general device functionality, refer to the dspic30f family reference manual (ds70046). note: see dspic30f family reference manual (ds70046) for detailed information on the control and status registers. note: both the transmit buffer (spi1txb) and the receive buffer (spi1rxb) are mapped to the same register address, spi1buf. read write internal data bus sdi1 sdo1 ss 1 sck1 spi1sr spixbuf bit 0 shift clock edge select f cy primary 1, 4, 16, 64 enable master clock prescaler secondary prescaler 1:1 ? 1:8 ss & fsync control clock control transmit spixbuf receive dspic30f2011/2012/3012/3013 ds70139c-page 90 preliminary ? 2005 microchip technology inc. figure 13-2 depicts the a master/slave connection between two processors. in master mode, the clock is generated by prescaling th e system clock. data is transmitted as soon as a va lue is written to spi1buf. the interrupt is generated at the middle of the transfer of the last bit. in slave mode, data is tr ansmitted and received as external clock pulses appear on sck. again, the inter- rupt is generated when t he last bit is latched. if ss 1 control is enabled, then tr ansmission and reception are enabled only when ss 1 = low. the sdo1 output will be disabled in ss 1 mode with ss 1 high. the clock provided to the module is (f osc /4). this clock is then prescaled by the primary (ppre<1:0>) and the secondary (spre<2:0> ) prescale factors. the cke bit determines whether transmit occurs on transi- tion from active clock state to idle clock state, or vice versa. the ckp bit selects the idle state (high or low) for the clock. 13.1.1 word and byte communication a control bit, mode16 (spi1con<10>), allows the module to communicate in eit her 16-bit or 8-bit mode. 16-bit operation is identica l to 8-bit operation except that the number of bits trans mitted is 16 instead of 8. the user software must disable the module prior to changing the mode16 bit. the spi module is reset when the mode16 bit is changed by the user. a basic difference between 8-bit and 16-bit operation is that the data is transmitted out of bit 7 of the spi1sr for 8-bit operation, and data is transmitted out of bit15 of the spi1sr for 16-bit ope ration. in both modes, data is shifted into bit 0 of the spi1sr. 13.1.2 sdo1 disable a control bit, dissdo, is pr ovided to the spi1con reg- ister to allow the sdo1 outp ut to be disabled. this will allow the spi module to be connected in an input only configuration. sdo1 can also be used for general purpose i/o. 13.2 framed spi support the module supports a basic framed spi protocol in master or slave mode. the control bit frmen enables framed spi support and causes the ss1 pin to perform the frame synchronization pulse (fsync) function. the control bit spifsd determines whether the ss1 pin is an input or an outp ut (i.e., whether the module receives or generates the frame synchronization pulse). the frame pulse is an active high pulse for a single spi clock cycle. when frame synchronization is enabled, the data transmission starts only on the subsequent transmit edge of the spi clock. figure 13-2: spi master/slave connection serial input buffer (spi1buf) shift register (spi1sr) msb lsb sdo1 sdi1 processor 1 sck1 spi? master serial input buffer (spi1buf) shift register (spi1sr) lsb msb sdi1 sdo1 processor 2 sck1 spi? slave serial clock ? 2005 microchip technology inc. preliminary ds70139c-page 91 dspic30f2011/2012/3012/3013 13.3 slave select synchronization the ss 1 pin allows a synchronous slave mode. the spi must be configured in spi slave mode with ss 1 pin control enabled (ssen = 1 ). when the ss 1 pin is low, transmission and rec eption are enabled and the sdox pin is driven. when ss 1 pin goes high, the sdox pin is no longer dr iven. also, the spi module is re-synchronized, and all c ounters/control circuitry are reset. therefore, when the ss 1 pin is asserted low again, transmission/reception will begin at the ms bit even if ss 1 had been de-asserted in the middle of a transmit/receive. 13.4 spi operation during cpu sleep mode during sleep mode, the spi module is shutdown. if the cpu enters sleep mode while an spi transaction is in progress, then the transmission and reception is aborted. the transmitter and receiver will stop in sleep mode. however, register contents are not affected by entering or exiting sleep mode. 13.5 spi operation during cpu idle mode when the device enters idle mode, all clock sources remain functional. the spisidl bit (spi1stat<13>) selects if the spi module will stop or continue on idle. if spisidl = 0 , the module will cont inue to operate when the cpu enters idle mode. if spisidl = 1 , the module will stop when the cpu enters idle mode. dspic30f2011/2012/3012/3013 ds70139c-page 92 preliminary ? 2005 microchip technology inc. table 13-1: spi1 register map note: refer to dspic30f family reference manua l (ds70046) for descriptions of register bit fields. sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state spi1stat 0220 spien ? spisidl ? ? ? ? ? ?spirov ? ? ? ? spitbf spirbf 0000 0000 0000 0000 spi1con 0222 ? frmen spifsd ? dissdo mode16 smp cke ssen ckp msten spre2 spre1 spre0 ppre1 ppre0 0000 0000 0000 0000 spi1buf 0224 transmit and receive buffer 0000 0000 0000 0000 ? 2005 microchip technology inc. preliminary ds70139c-page 93 dspic30f2011/2012/3012/3013 14.0 i 2 c module the inter-integrated circuit (i 2 c tm ) module provides complete hardware support for both slave and multi- master modes of the i 2 c serial communication standard, with a 16-bit interface. this module offers the following key features: ?i 2 c interface supporting both master and slave operation. ?i 2 c slave mode supports 7 and 10-bit address. ?i 2 c master mode supports 7 and 10-bit address. ?i 2 c port allows bidirect ional transfers between master and slaves. ? serial clock synchronization for i 2 c port can be used as a handshake mech anism to suspend and resume serial transfer (sclrel control). ?i 2 c supports multi-master operation; detects bus collision and will arbitrate accordingly. 14.1 operating function description the hardware fully implements all the master and slave functions of the i 2 c standard and fast mode specifications, as well as 7 and 10-bit addressing. thus, the i 2 c module can operate either as a slave or a master on an i 2 c bus. 14.1.1 various i 2 c modes the following types of i 2 c operation are supported: ?i 2 c slave operation with 7-bit address ?i 2 c slave operation with 10-bit address ?i 2 c master operation with 7 or 10-bit address see the i 2 c programmer?s model (figure 14-1). 14.1.2 pin configuration in i 2 c mode i 2 c has a 2-pin interface: t he scl pin is clock and the sda pin is data. 14.1.3 i 2 c registers i2ccon and i2cstat are control and status registers, respectively. the i2ccon regist er is readable and writ- able. the lower 6 bits of i2cstat are read only. the remaining bits of the i2cstat are read/write. i2crsr is the shift register used for shifting data, whereas i2crcv is the buffer register to which data bytes are written, or from which data bytes are read. i2crcv is the receive buffer as shown in figure 14-1. i2ctrn is the transmit register to which bytes are written during a transmit operation, as shown in figure 14-2. the i2cadd register holds t he slave address. a status bit, add10, indicates 10-bit address mode. the i2cbrg acts as the baud ra te generator reload value. in receive operations, i2crsr and i2crcv together form a double-buffered receiver. when i2crsr receives a complete byte, it is transferred to i2crcv and an interrupt pulse is generated. during transmission, the i2ctrn is not double-buffered. figure 14-1: programmer?s model note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descr iptions and general device functionality, refer to the dspic30f family reference manual (ds70046). note: following a restart condition in 10-bit mode, the user only needs to match the first 7-bit address. bit 7 bit 0 i2crcv (8 bits) bit 7 bit 0 i2ctrn (8 bits) bit 8 bit 0 i2cbrg (9 bits) bit 15 bit 0 i2ccon (16 bits) bit 15 bit 0 i2cstat (16 bits) bit 9 bit 0 i2cadd (10 bits) dspic30f2011/2012/3012/3013 ds70139c-page 94 preliminary ? 2005 microchip technology inc. figure 14-2: i 2 c block diagram i2crsr i2crcv internal data bus scl sda shift match detect i2cadd start and stop bit detect clock addr_match clock stretching i2ctrn lsb shift clock write read brg down i2cbrg reload control f cy start, restart, stop bit generate write read acknowledge generation collision detect write read write read i2ccon write read i2cstat control logic read lsb counter ? 2005 microchip technology inc. preliminary ds70139c-page 95 dspic30f2011/2012/3012/3013 14.2 i 2 c module addresses the i2cadd register contains the slave mode addresses. the register is a 10-bit register. if the a10m bit (i2ccon<10>) is ? 0 ?, the address is interpreted by the module as a 7-bit address. when an address is received, it is co mpared to the 7 ls bits of the i2cadd register. if the a10m bit is ? 1 ?, the address is assumed to be a 10-bit address. when an addres s is received, it will be compared with the binary value ? 11110 a9 a8 ? (where a9 and a8 are two most significant bits of i2cadd). if that value matches, the ne xt address will be compared with the least significant 8 bits of i2cadd, as specified in the 10-bit addressing protocol. the 7-bit i 2 c slave addresses supported by the dspic30fare shown in table 14-1. table 14-1: 7-bit i 2 c slave addresses 14.3 i 2 c 7-bit slave mode operation once enabled (i2cen = 1 ), the slave module will wait for a start bit to occur (i.e., the i 2 c module is ?idle?). fol- lowing the detection of a start bit, 8 bits are shifted into i2crsr and the address is compared against i2cadd. in 7-bit mode (a10m = 0 ), bits i2cadd<6:0> are compared against i2crsr<7:1> and i2crsr<0> is the r_w bit. all incoming bits are sampled on the ris- ing edge of scl. if an address match occurs , an acknowledgement will be sent, and the slave event interrupt flag (si2cif) is set on the falling ed ge of the ninth (ack ) bit. the address match does not affect the contents of the i2crcv buffer or the rbf bit. 14.3.1 slave transmission if the r_w bit received is a ? 1 ?, then the serial port will go into transmit mode. it will send ack on the ninth bit and then hold scl to ? 0 ? until the cpu responds by writ- ing to i2ctrn. scl is released by setting the sclrel bit, and 8 bits of data are shifted out. data bits are shifted out on the falling edge of scl, such that sda is valid during scl high. the inte rrupt pulse is sent on the falling edge of the ninth cloc k pulse, regardless of the status of the ack received from the master. 14.3.2 slave reception if the r_w bit received is a ? 0 ? during an address match, then receive mode is initiated. incoming bits are sampled on the rising edge of scl. after 8 bits are received, if i2crcv is not full or i2cov is not set, i2crsr is transferred to i2crcv. ack is sent on the ninth clock. if the rbf flag is set, indicating that i2crcv is still holding data from a previous operation (rbf = 1 ), then ack is not sent; however, th e interrupt pulse is gener- ated. in the case of an overflow, the contents of the i2crsr are not loaded into the i2crcv. 14.4 i 2 c 10-bit slave mode operation in 10-bit mode, the basic receive and transmit opera- tions are the same as in th e 7-bit mode. however, the criteria for address match is more complex. the i 2 c specification dictates that a slave must be addressed for a write operati on with two address bytes following a start bit. the a10m bit is a control bi t that signifies that the address in i2cadd is a 10-bit address rather than a 7-bit address. the address detectio n protocol for the first byte of a message address is identical for 7-bit and 10-bit messages, but the bits being compared are different. i2cadd holds the entire 10-bit address. upon receiv- ing an address following a start bit, i2crsr <7:3> is compared against a literal ? 11110 ? (the default 10-bit address) and i2crsr<2:1> are compared against i2cadd<9:8>. if a match occurs and if r_w = 0 , the interrupt pulse is sent. th e add10 bit will be cleared to indicate a partial address match. if a match fails or r_w = 1 , the add10 bit is cleared and the module returns to the idle state. the low byte of the address is then received and com- pared with i2cadd<7:0>. if an address match occurs, the interrupt pulse is gener ated and the add10 bit is set, indicating a complete 10 -bit address match. if an address match did not occur, the add10 bit is cleared and the module returns to the idle state. 0x00 general call address or start byte 0x01-0x03 reserved 0x04-0x77 valid 7-bit addresses 0x78-0x7b valid 10-bit addresses (lower 7 bits) 0x7c-0x7f reserved note: the i2crcv will be loaded if the i2cov bit = 1 and the rbf flag = 0 . in this case, a read of the i2crcv was performed but the user did not clear the state of the i2cov bit before the next receive occurred. the acknowledgement is not sent (ack = 1 ) and the i2crcv is updated. dspic30f2011/2012/3012/3013 ds70139c-page 96 preliminary ? 2005 microchip technology inc. 14.4.1 10-bit mode slave transmission once a slave is addressed in this fashion with the full 10-bit address (we will refer to this state as ?prior_addr_match?), the master can begin sending data bytes for a sl ave reception operation. 14.4.2 10-bit mode slave reception once addressed, the master can generate a repeated start, reset the high byte of the address and set the r_w bit without generating a st op bit, thus initiating a slave transmit operation. 14.5 automatic clock stretch in the slave modes, the module can synchronize buffer reads and write to the master device by clock stretching. 14.5.1 transmit clock stretching both 10-bit and 7-bit transmit modes implement clock stretching by asserting the sclrel bit after the falling edge of the ninth clock, if the tbf bit is cleared, indicat- ing the buffer is empty. in slave transmit modes, clock stretching is always performed irrespective of the stren bit. clock synchronization takes place following the ninth clock of the transmit sequence. if the device samples an ack on the falling edge of the ninth clock and if the tbf bit is still clear, then th e sclrel bit is automati- cally cleared. the sclr el being cleared to ? 0 ? will assert the scl line low. the user?s isr must set the sclrel bit before transmission is allowed to continue. by holding the scl line low, the user has time to ser- vice the isr and load the contents of the i2ctrn before the master device can initiate another transmit sequence. 14.5.2 receive clock stretching the stren bit in the i2ccon register can be used to enable clock stretching in slave receive mode. when the stren bit is set, the scl pi n will be held low at the end of each data receive sequence. 14.5.3 clock stretching during 7-bit addressing (stren = 1 ) when the stren bit is set in slave receive mode, the scl line is held low when the buffer register is full. the method for stretching the scl output is the same for both 7 and 10-bit addressing modes. clock stretching takes place following the ninth clock of the receive sequence. on the falling edge of the ninth clock at the end of the ack sequence, if the rbf bit is set, the sclrel bit is au tomatically cleared, forcing the scl output to be held low. the user?s isr must set the sclrel bit before recept ion is allowed to continue. by holding the scl line low, the user has time to ser- vice the isr and read the contents of the i 2 crcv before the master device ca n initiate another receive sequence. this will prev ent buffer overruns from occurring. 14.5.4 clock stretching during 10-bit addressing (stren = 1 ) clock stretching takes plac e automatically during the addressing sequence. because this module has a register for the entire addre ss, it is not necessary for the protocol to wait for the address to be updated. after the address phase is complete, clock stretching will occur on each data rece ive or transmit sequence as was described earlier. 14.6 software controlled clock stretching (stren = 1 ) when the stren bit is ? 1 ?, the sclrel bit may be cleared by software to allow software to control the clock stretching. the logic wi ll synchronize writes to the sclrel bit with the scl clock. clearing the sclrel bit will not assert the scl output until the module detects a falling edge on the scl output and scl is sampled low. if the sclrel bit is cleared by the user while the scl line has been sampled low, the scl out- put will be asserted (held low). the scl output will remain low until the sclrel bit is set, and all other devices on the i 2 c bus have de-asserted scl. this ensures that a write to the sclrel bit will not violate the minimum high time requirement for scl. if the stren bit is ? 0 ?, a software write to the sclrel bit will be disregarded an d have no effect on the sclrel bit. note 1: if the user loads the contents of i2ctrn, setting the tbf bit before the falling edge of the ninth clock, the sclrel bit will not be cleared and clock stretching will not occur. 2: the sclrel bit can be set in software, regardless of the state of the tbf bit. note 1: if the user reads the contents of the i2crcv, clearing the rbf bit before the falling edge of the ninth clock, the sclrel bit will not be cleared and clock stretching will not occur. 2: the sclrel bit can be set in software regardless of the state of the rbf bit. the user should be careful to clear the rbf bit in the isr before the next receive sequence in order to prevent an overflow condition. ? 2005 microchip technology inc. preliminary ds70139c-page 97 dspic30f2011/2012/3012/3013 14.7 interrupts the i 2 c module generates two interrupt flags, mi2cif (i 2 c master interrupt flag) and si2cif (i 2 c slave inter- rupt flag). the mi2cif interrupt flag is activated on completion of a master message event. the si2cif interrupt flag is activated on detection of a message directed to the slave. 14.8 slope control the i 2 c standard requires slope control on the sda and scl signals for fast mode (400 khz). the control bit, disslw, enables the user to disable slew rate con- trol if desired. it is necess ary to disable the slew rate control for 1 mhz mode. 14.9 ipmi support the control bit, ipmien, enabl es the module to support intelligent peripheral mana gement interface (ipmi). when this bit is set, the module accepts and acts upon all addresses. 14.10 general call address support the general call address can address all devices. when this address is us ed, all devices should, in theory, respond with an acknowledgement. the general call address is one of eight addresses reserved for specific purposes by the i 2 c protocol. it consists of all ? 0 ?s with r_w = 0 . the general call address is recognized when the gen- eral call enable (gcen) bit is set (i2ccon<15> = 1 ). following a start bit detection, 8 bits are shifted into i2crsr and the address is compared with i2cadd, and is also compared with the general call address which is fixed in hardware. if a general call address match occurs, the i2crsr is transferred to the i2crcv after the eighth clock, the rbf flag is set and on the fa lling edge of the ninth bit (ack bit), the master event interrupt flag (mi2cif) is set. when the interrupt is servic ed, the source for the inter- rupt can be checked by reading the contents of the i2crcv to determine if the address was device specific or a general call address. 14.11 i 2 c master support as a master device, six operations are supported: ? assert a start condition on sda and scl. ? assert a restart condition on sda and scl. ? write to the i2ctrn register initiating transmission of data/address. ? generate a stop condition on sda and scl. ? configure the i 2 c port to receive data. ? generate an ack condition at the end of a received byte of data. 14.12 i 2 c master operation the master device generate s all of the serial clock pulses and the start and stop conditions. a transfer is ended with a stop condition or with a repeated start condition. since the repeat ed start condition is also the beginning of the next serial transfer, the i 2 c bus will not be released. in master transmitter mode , serial data is output through sda, while scl outp uts the serial clock. the first byte transmitted contai ns the slave address of the receiving device (7 bits) and the data direction bit. in this case, the data direction bit (r_w) is logic ? 0 ?. serial data is transmitted 8 bits at a time. after each byte is transmitted, an ack bit is received. start and stop con- ditions are output to indica te the beginning and the end of a serial transfer. in master receive mode, the first byte transmitted con- tains the slave address of the transmitting device (7 bits) and the data direction bit. in this case, the data direction bit (r_w) is logic ? 1 ?. thus, the first byte trans- mitted is a 7-bit slave address, followed by a ? 1 ? to indi- cate receive bit. serial data is received via sda while scl outputs the serial clock. serial data is received 8 bits at a time. after each byte is received, an ack bit is transmitted. start and stop conditions indicate the beginning and end of transmission. 14.12.1 i 2 c master transmission transmission of a data byte, a 7-bit address, or the sec- ond half of a 10-bit addres s is accomplished by simply writing a value to i2ctrn register. the user should only write to i2ctrn when the module is in a wait state. this action will set the buffer full flag (tbf) and allow the baud rate generat or to begin counting and start the next transmission. each bit of address/data will be shifted out onto the sda pin after the falling edge of scl is asserted. the transmit status flag, trstat (i2cstat<14>), indicates that a master transmit is in progress. dspic30f2011/2012/3012/3013 ds70139c-page 98 preliminary ? 2005 microchip technology inc. 14.12.2 i 2 c master reception master mode reception is enabled by programming the receive enable bit, rcen (i2ccon<11>). the i 2 c module must be idle before the rcen bit is set, other- wise the rcen bit wi ll be disregarded. the baud rate generator begins counting and on each rollover, the state of the scl pin ack and data are shifted into the i2crsr on the rising edge of each clock. 14.12.3 baud rate generator in i 2 c master mode, the rel oad value for the brg is located in the i2cbrg register. when the brg is loaded with this value, the brg counts down to ? 0 ? and stops until another reload has taken place. if clock arbi- tration is taking place, for instance, the brg is reloaded when the scl pin is sampled high. as per the i 2 c standard, fsck may be 100 khz or 400 khz. however, the user can specify any baud rate up to 1 mhz. i2cbrg values of ? 0 ? or ? 1 ? are illegal. equation 14-1: serial clock rate 14.12.4 clock arbitration clock arbitration occurs wh en the master de-asserts the scl pin (scl allowed to float high) during any receive, transmit, or restart/stop condition. when the scl pin is allowed to fl oat high, the baud rate gen- erator (brg) is suspended from counting until the scl pin is actually sampled hi gh. when the scl pin is sam- pled high, the baud rate gene rator is reloaded with the contents of i2cbrg and begins counting. this ensures that the scl high time will always be at least one brg rollover count in the event that the clock is held low by an external device. 14.12.5 multi-master communication, bus collision, and bus arbitration multi-master operation suppor t is achieved by bus arbi- tration. when the master outputs address/data bits onto the sda pin, arbitration takes place when the master outputs a ? 1 ? on sda by letting sda float high while another master asserts a ? 0 ?. when the scl pin floats high, data should be stable. if the expected data on sda is a ? 1 ? and the data sampled on the sda pin = 0 , then a bus collision has taken place. the master will set the mi2cif pulse and reset the master portion of the i 2 c port to its idle state. if a transmit was in progress when the bus collision occurred, the transmission is halted, the tbf flag is cleared, the sda and scl lines are de-asserted and a value can now be written to i2ctrn. when the user services the i 2 c master event interrupt service rou- tine, if the i 2 c bus is free (i.e., the p bit is set), the user can resume communication by asserting a start condition. if a start, restart, stop or acknowledge condition was in progress when the bus collision occurred, the condition is aborted, the sda and scl lines are de- asserted, and the respective control bits in the i2ccon register are cleared to ? 0 ?. when the user services the bus collision interrupt service routine, and if the i 2 c bus is free, the user can resume communication by asserting a start condition. the master will continue to monitor the sda and scl pins, and if a stop condition occurs, the mi2cif bit will be set. a write to the i2ctrn will start the transmission of data at the first data bit regardles s of where the transmitter left off when bus collision occurred. in a multi-master environm ent, the interrupt generation on the detection of start and stop conditions allows the determination of when the bu s is free. control of the i 2 c bus can be taken when the p bit is set in the i2cstat register, or the bus is idle and the s and p bits are cleared. 14.13 i 2 c module operation during cpu sleep and idle modes 14.13.1 i 2 c operation during cpu sleep mode when the device enters sle ep mode, all clock sources to the module are shutdown and stay at logic ? 0 ?. if sleep occurs in the middle of a transmission and the state machine is partially in to a transmission as the clocks stop, then the transmission is aborted. similarly, if sleep occurs in the middle of a reception, then the reception is aborted. 14.13.2 i 2 c operation during cpu idle mode for the i 2 c, the i2csidl bit selects if the module will stop on idle or continue on idle. if i2csidl = 0 , the module will continue operati on on assertion of the idle mode. if i2csidl = 1 , the module will stop on idle. i2cbrg = f cy f cy f scl 1,111,111 ? 1 ? () ? 2005 microchip technology inc. preliminary ds70139c-page 99 dspic30f2011/2012/3012/3013 table 14-2: i 2 c register map note: refer to dspic30f family reference manua l (ds70046) for descriptions of register bit fields. sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 b it 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state i2crcv 0200 ? ? ? ? ? ? ? ? receive register 0000 0000 0000 0000 i2ctrn 0202 ? ? ? ? ? ? ? ? transmit register 0000 0000 1111 1111 i2cbrg 0204 ? ? ? ? ? ? ? baud rate generator 0000 0000 0000 0000 i2ccon 0206 i2cen ? i2csidl sclrel ipmien a10m disslw smen gcen stren ackdt acken rcen pen rsen sen 0001 0000 0000 0000 i2cstat 0208 ackstat trstat ? ? ? bcl gcstat add10 iwcol i2cov d_a p s r_w rbf tbf 0000 0000 0000 0000 i2cadd 020a ? ? ? ? ? ? address register 0000 0000 0000 0000 dspic30f2011/2012/3012/3013 ds70139c-page 100 preliminary ? 2005 microchip technology inc. notes: ? 2005 microchip technology inc. preliminary ds70139c-page 101 dspic30f2011/2012/3012/3013 15.0 universal asynchronous receiver transmitter (uart) module this section describes the universal asynchronous receiver/transmitter comm unications module. the dspic30f2011/2012/3012 processors have one uart module (uart1). the ds pic30f3013 processor has two uart modules (uart1 and uart2). 15.1 uart module overview the key features of the uart module are: ? full-duplex, 8 or 9-bit data communication ? even, odd or no parity options (for 8-bit data) ? one or two stop bits ? fully integrated baud rate generator with 16-bit prescaler ? baud rates range from 38 bps to 1.875 mbps at a 30 mhz instruction rate ? 4-word deep transmit data buffer ? 4-word deep receive data buffer ? parity, framing and buffer overrun error detection ? support for interrupt only on address detect (9th bit = 1 ) ? separate transmit and receive interrupts ? loopback mode for diagnostic support ? alternate receive and transmit pins for uart1 figure 15-1: uart transmitter block diagram note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descr iptions and general device functionality, refer to the dspic30f family reference manual (ds70046). write write utx8 uxtxreg low byte load tsr transmit control ? control tsr ? control buffer ? generate flags ? generate interrupt control and status bits uxtxif data ? 0 ? (start) ? 1 ? (stop) parity parity generator transmit shift register (uxtsr) 16 divider control signals 16x baud clock from baud rate generator internal data bus utxbrk uxtx note: x = 1 or 2. dspic30f2011/2012/3012/3013 ds70139c-page 102 preliminary ? 2005 microchip technology inc. figure 15-2: uart receiver block diagram read urx8 uxrxreg low byte load rsr uxmode receive buffer control ? generate flags ? generate interrupt uxrxif uxrx start bit detect receive shift register 16 divider control signals uxsta ? shift data characters read read write write to buffer 8-9 (uxrsr) perr ferr parity check stop bit detect shift clock generation wake logic 16 internal data bus 1 0 lpback from uxtx 16x baud clock from baud rate generator ? 2005 microchip technology inc. preliminary ds70139c-page 103 dspic30f2011/2012/3012/3013 15.2 enabling and setting up uart 15.2.1 enabling the uart the uart module is enabled by setting the uarten bit in the uxmode register (where x = 1 or 2). once enabled, the uxtx and uxrx pins are configured as an output and an input respectively, overriding the tris and latch register bit se ttings for the corresponding i/o port pins. the uxtx pin is at logic ? 1 ? when no transmission is taking place. 15.2.2 disabling the uart the uart module is disabled by clearing the uarten bit in the uxmode register. this is the default state after any reset. if the uart is disabled, all i/o pins operate as port pins under the control of the latch and tris bits of the corresponding port pins. disabling the uart module resets the buffers to empty states. any data characters in the buffers are lost and the baud rate counter is reset. all error and status flags associated with the uart module are reset when the module is disabled. the urxda, oerr, ferr, perr, utxen, utxbrk and utxbf bits are cleared, whereas ridle and trmt are set. other control bits, including adden, urxisel<1:0>, utxisel, as well as the uxmode and uxbrg registers, are not affected. clearing the uarten bit while the uart is active will abort all pending transmissions and receptions and reset the module as defin ed above. re-enabling the uart will restart the uart in the same configuration. 15.2.3 alternate i/o the alternate i/o function is enabled by setting the altio bit (uxmode<10>). if altio = 1 , the uxatx and uxarx pins (alternate transmit and alternate receive pins, respectively) are used by the uart mod- ule instead of the uxtx and uxrx pins. if altio = 0 , the uxtx and uxrx pins are used by the uart module. 15.2.4 setting up data, parity and stop bit selections control bits pdsel<1:0> in the uxmode register are used to select the data length and parity used in the transmission. the data length may either be 8 bits with even, odd or no parity, or 9 bits with no parity. the stsel bit determines whether one or two stop bits will be used during data transmission. the default (power-on) setting of the uart is 8 bits, no parity and 1 stop bit (typical ly represented as 8, n, 1). 15.3 transmitting data 15.3.1 transmitting in 8-bit data mode the following steps must be performed in order to transmit 8-bit data: 1. set up the uart: first, the data length, parity and number of stop bits must be selected. then, the transmit and receive interrupt enable and priority bits are setup in the uxmode and uxsta registers. also, the appropriate baud rate value must be written to the uxbrg register. 2. enable the uart by setting the uarten bit (uxmode<15>). 3. set the utxen bit (uxsta<10>), thereby enabling a transmission. 4. write the byte to be tran smitted to the lower byte of uxtxreg. the value will be transferred to the transmit shift register (uxtsr) immediately and the serial bit stream will start shifting out during the next rising edge of the baud clock. alternatively, the data byte may be written while utxen = 0 , following which, the user may set utxen. this will cause the serial bit stream to begin immediately becaus e the baud clock will start from a cleared state. 5. a transmit interrupt wi ll be generated, depend- ing on the value of the interrupt control bit utxisel (uxsta<15>). 15.3.2 transmitting in 9-bit data mode the sequence of steps involved in the transmission of 9-bit data is similar to 8-bi t transmission, except that a 16-bit data word (of which the upper 7 bits are always clear) must be written to the uxtxreg register. 15.3.3 transmit buffer (u x txb) the transmit buffer is 9 bits wide and 4 characters deep. including the transmit shift register (uxtsr), the user effectively has a 5- deep fifo (first-in, first- out) buffer. the utxbf status bit (uxsta<9>) indicates whether the transmit buffer is full. if a user attempts to write to a full buffer, the new data will not be accepted into the fifo, and no data shift will occur within the buffer. this enables recovery from a buffer overrun condition. the fifo is reset during any device reset but is not affected when the device en ters or wakes up from a power saving mode. dspic30f2011/2012/3012/3013 ds70139c-page 104 preliminary ? 2005 microchip technology inc. 15.3.4 transmit interrupt the transmit interrupt fl ag (u1txif or u2txif) is located in the corresponding interrupt flag register. the transmitter generates an edge to set the uxtxif bit. the condition for gener ating the interrupt depends on the utxisel control bit: a) if utxisel = 0 , an interrupt is generated when a word is transferred from the transmit buffer to the transmit shift register (uxtsr). this implies that the transmit buffer has at least one empty word. b) if utxisel = 1 , an interrupt is generated when a word is transferred from the transmit buffer to the transmit shift register (uxtsr) and the transmit buffer is empty. switching between the two interrupt modes during operation is possible and sometimes offers more flexibility. 15.3.5 transmit break setting the utxbrk bit (uxsta<11>) will cause the uxtx line to be driven to logic ? 0 ?. the utxbrk bit overrides all transmission activity. therefore, the user should generally wait for the transmitter to be idle before setting utxbrk. to send a break character, the utxbrk bit must be set by software and must rema in set for a minimum of 13 baud clock cycles. the utxbrk bit is then cleared by software to generate stop bits. the user must wait for a duration of at least one or two baud clock cycles in order to ensure a valid stop bit(s) before reloading the uxtxb, or starting other transmitter activity. transmis- sion of a break character does not generate a transmit interrupt. 15.4 receiving data 15.4.1 receiving in 8-bit or 9-bit data mode the following steps must be performed while receiving 8-bit or 9-bit data: 1. set up the uart (see section 15.3.1). 2. enable the uart (see section 15.3.1). 3. a receive interrupt will be generated when one or more data words have been received, depending on the receive interrupt settings specified by the urxisel bits (uxsta<7:6>). 4. read the oerr bit to determine if an overrun error has occurred. the oerr bit must be reset in software. 5. read the received data from uxrxreg. the act of reading uxrxreg will move the next word to the top of the receive fifo, and the perr and ferr values will be updated. 15.4.2 receive buffer (u x rxb) the receive buffer is 4 wo rds deep. including the receive shift register (uxrsr), the user effectively has a 5-word deep fifo buffer. urxda (uxsta<0>) = 1 indicates that the receive buffer has data available. urxda = 0 implies that the buffer is empty. if a user attempts to read an empty buffer, the old values in th e buffer will be read and no data shift will occur within the fifo. the fifo is reset during any device reset. it is not affected when the device enters or wakes up from a power saving mode. 15.4.3 receive interrupt the receive interrupt flag (u1rxif or u2rxif) can be read from the corresponding interrupt flag register. the interrupt flag is set by an edge generated by the receiver. the condition for setting the receive interrupt flag depends on the se ttings specified by the urxisel<1:0> (uxsta<7:6>) control bits. a) if urxisel<1:0> = 00 or 01 , an interrupt is gen- erated every time a data word is transferred from the receive shift register (uxrsr) to the receive buffer. ther e may be one or more characters in the receive buffer. b) if urxisel<1:0> = 10 , an interrupt is generated when a word is transferred from the receive shift register (uxrsr) to the receive buffer, which as a result of the transfer, contains 3 characters. c) if urxisel<1:0> = 11 , an interrupt is set when a word is transferred from the receive shift reg- ister (uxrsr) to the receive buffer, which as a result of the transfer, contains 4 characters (i.e., becomes full). switching between the interrupt modes during opera- tion is possible, though g enerally not advisable during normal operation. 15.5 reception error handling 15.5.1 receive buffer overrun error (oerr bit) the oerr bit (uxsta<1>) is set if all of the following conditions occur: a) the receive buffer is full. b) the receive shift register is full, but unable to transfer the character to the receive buffer. c) the stop bit of the character in the uxrsr is detected, indicating t hat the uxrsr needs to transfer the character to the buffer. once oerr is set, no further data is shifted in uxrsr (until the oerr bit is clear ed in software or a reset occurs). the data held in uxrsr and uxrxreg remains valid. ? 2005 microchip technology inc. preliminary ds70139c-page 105 dspic30f2011/2012/3012/3013 15.5.2 framing error (ferr) the ferr bit (uxsta<2>) is set if a ? 0 ? is detected instead of a stop bit. if two stop bits are selected, both stop bits must be ? 1 ?, otherwise ferr will be set. the read only ferr bit is buffere d along with the received data. it is cleared on any reset. 15.5.3 parity error (perr) the perr bit (uxsta<3>) is set if the parity of the received word is incorrect. this error bit is applicable only if a parity mode (odd or even) is selected. the read only perr bit is buffere d along with the received data bytes. it is cleared on any reset. 15.5.4 idle status when the receiver is active (i.e., between the initial detection of the start bit and the completion of the stop bit), the ridle bit (uxsta<4>) is ? 0 ?. between the com- pletion of the stop bit and detection of the next start bit, the ridle bit is ? 1 ?, indicating that the uart is idle. 15.5.5 receive break the receiver will count and expect a certain number of bit times based on the va lues programmed in the pdsel (uxmode<2:1>) and stsel (uxmode<0>) bits. if the break is longer than 13 bit times, the reception is considered complete afte r the number of bit times specified by pdsel and stsel. the urxda bit is set, ferr is set, zeros are load ed into the receive fifo, interrupts are generated if appropriate and the ridle bit is set. when the module receives a long break signal and the receiver has detected the start bit, the data bits and the invalid stop bit (which sets the ferr), the receiver must wait for a valid stop bi t before looking for the next start bit. it cannot assume that the break condition on the line is the next start bit. break is regarded as a c haracter containing all ? 0 ?s with the ferr bit set. the break char acter is loaded into the buffer. no further reception can occur until a stop bit is received. note that ridle g oes high when the stop bit has not yet been received. 15.6 address detect mode setting the adden bit (uxsta<5>) enables this spe- cial mode in which a 9th bit (urx8) value of ? 1 ? identi- fies the received word as an address, rather than data. this mode is only applicable for 9-bit data communica- tion. the urxisel control bit does not have any impact on interrupt generat ion in this mode since an interrupt (if enabled) will be generated every time the received word has the 9th bit set. 15.7 loopback mode setting the lpback bit enables this special mode in which the uxtx pin is intern ally connected to the uxrx pin. when configured for the loopback mode, the uxrx pin is disconnected from the internal uart receive logic. however, the uxtx pin still functions as in a normal operation. to select this mode: a) configure uart for desi red mode of operation. b) set lpback = 1 to enable loopback mode. c) enable transmission as defined in section 15.3. 15.8 baud rate generator the uart has a 16-bit baud rate generator to allow maximum flexibility in baud rate generation. the baud rate generator register (uxbrg) is readable and writable. the baud rate is computed as follows: brg = 16-bit value held in uxbrg register (0 through 65535) f cy = instruction clock rate (1/t cy ) the baud rate is given by equation 15-1. equation 15-1: baud rate therefore, the maximum baud rate possible is f cy /16 (if brg = 0 ), and the minimum baud rate possible is f cy / (16* 65536). with a full 16-bit baud ra te generator at 30 mips operation, the minimum baud rate achievable is 28.5 bps. baud rate = f cy / (16*(brg+1)) dspic30f2011/2012/3012/3013 ds70139c-page 106 preliminary ? 2005 microchip technology inc. 15.9 auto baud support to allow the system to determine baud rates of received characters, the i nput can be optionally linked to a selected capture input (ic1 for uart1 and ic2 for uart2). to enable this mode, you must program the input capture module to de tect the falling and rising edges of the start bit. 15.10 uart operation during cpu sleep and idle modes 15.10.1 uart operation during cpu sleep mode when the device enters slee p mode, all clock sources to the module are shutdo wn and stay at logic ? 0 ?. if entry into sleep mode occurs wh ile a transmission is in progress, then the transmis sion is aborted. the uxtx pin is driven to logic ? 1 ?. similarly, if entry into sleep mode occurs while a receptio n is in progress, then the reception is aborted. the uxsta, uxmode, transmit and receive registers and buffers, and the uxbrg register are not affected by sleep mode. if the wake bit (uxmode<7>) is set before the device enters sleep mode, then a falling edge on the uxrx pin will generate a receive inte rrupt. the receive interrupt select mode bit (urxisel) has no effect for this func- tion. if the receive interrupt is enabled, then this will wake-up the device from sleep. the uarten bit must be set in order to generate a wake-up interrupt. 15.10.2 uart operation during cpu idle mode for the uart, the usidl bit selects if the module will stop operation when the de vice enters idle mode or whether the module will continue on idle. if usidl = 0 , the module will continue opera tion during idle mode. if usidl = 1 , the module will stop on idle. ? 2005 microchip technology inc. ds70139c-page 107 dspic30f2011/2012/3012/3013 table 15-1: uart1 register map for dspic30f2011/2012/3012/3013 table 15-2: uart2 register map for DSPIC30F3013 note: refer to dspic30f family reference manua l (ds70046) for descriptions of register bit fields. sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 b it 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state u1mode 020c uarten ?usidl ? ?altio ? ? wake lpback abaud ? ? pdsel1 pdsel0 stsel 0000 0000 0000 0000 u1sta 020e utxisel ? ? ? utxbrk utxen utxbf trmt urxisel1 urx isel0 adden ridle perr ferr oerr urxda 0000 0001 0001 0000 u1txreg 0210 ? ? ? ? ? ? ? utx8 transmit register 0000 000u uuuu uuuu u1rxreg 0212 ? ? ? ? ? ? ? urx8 receive register 0000 0000 0000 0000 u1brg 0214 baud rate generator prescaler 0000 0000 0000 0000 legend: u = uninitialized bit sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state u2mode 0216 uarten ?usidl ? ? ? ? ? wake lpback abaud ? ? pdsel1 pdsel0 stsel 0000 0000 0000 0000 u2sta 0218 utxisel ? ? ? utxbrk utxen utxbf trmt urxisel1 urxisel0 adden ridle perr ferr oerr urxda 0000 0001 0001 0000 u2txreg 021a ? ? ? ? ? ? ? utx8 transmit register 0000 000u uuuu uuuu u2rxreg 021c ? ? ? ? ? ? ? urx8 receive register 0000 0000 0000 0000 u2brg 021e baud rate generator prescaler 0000 0000 0000 0000 legend: u = uninitialized bit note 1: uart2 is not availabl e on the dspic30f2011/2012/3012 dspic30f2011/2012/3012/3013 ds70139c-page 108 preliminary ? 2005 microchip technology inc. notes: ? 2005 microchip technology inc. preliminary ds70139c-page 109 dspic30f2011/2012/3012/3013 16.0 12-bit analog-to-digital converter (a/d) module the 12-bit analog-to-digital converter (a/d) allows conversion of an analog input signal to a 12-bit digital number. this module is based on a successive approximation register (s ar) architecture and pro- vides a maximum sampling rate of 100 ksps. the a/d module has up to 10 anal og inputs which are multi- plexed into a sample and ho ld amplifier. the output of the sample and hold is t he input into the converter which generates the result. the analog reference volt- age is software selectable to either the device supply voltage (av dd /av ss ) or the voltage level on the (v ref +/v ref -) pin. the a/d converter has a unique feature of being able to op erate while the device is in sleep mode with rc oscillator selection. the a/d module has six 16-bit registers: ? a/d control register 1 (adcon1) ? a/d control register 2 (adcon2) ? a/d control register 3 (adcon3) ? a/d input select register (adchs) ? a/d port configuration register (adpcfg) ? a/d input scan select ion register (adcssl) the adcon1, adcon2 and adcon3 registers control the operation of the a/d module. the adchs register selects the input chan nels to be converted. the adpcfg register configures the port pins as analog inputs or as digital i/o. the adcssl register selects inputs for scanning. the block diagram of the 12-bit a/d module is shown in figure 16-1. figure 16-1: 12-bit a/d functional block diagram note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descr iptions and general device functionality, refer to the dspic30f family reference manual (ds70046). note: the ssrc<2:0>, asam, smpi<3:0>, bufm and alts bits, as well as the adcon3 and adcssl registers, must not be written to while adon = 1 . this would lead to indeterminate results. comparator 12-bit sar conversion logic a vdd /v ref + dac data format 16-word, 12-bit dual port buffer bus interface 0000 0101 0111 1001 0001 0010 0011 0100 0110 1000 an8 an9 an4 an5 an6 an7 an0 an1 an2 an3 ch0 a vss /v ref - sample/sequence control sample input mux control input switches s/h dspic30f2011/2012/3012/3013 ds70139c-page 110 preliminary ? 2005 microchip technology inc. 16.1 a/d result buffer the module contains a 16-word dual port read only buffer, called adcbuf0...adcbuff, to buffer the a/d results. the ram is 12 bits wide but the data obtained is represented in one of four different 16-bit data for- mats. the contents of the sixteen a/d conversion result buffer registers, adcbuf0 through adcbuff, cannot be written by user software. 16.2 conversion operation after the a/d module has b een configured, the sample acquisition is started by setting the samp bit. various sources, such as a programmable bit, timer time-outs and external events, will term inate acquisition and start a conversion. when the a/d conversion is complete, the result is loaded into adcbuf0...adcbuff, and the done bit and the a/d interrupt flag adif are set after the number of samples specified by the smpi bit. the adc module can be configur ed for different interrupt rates as described in section 16.3. the following steps should be followed for doing an a/d conversion: 1. configure the a/d module: ? configure analog pins, voltage reference and digital i/o ?select a/d input channels ?select a/d conversion clock ?select a/d conversion trigger ? turn on a/d module 2. configure a/d interrupt (if required): ? clear adif bit ? select a/d interrupt priority 3. start sampling. 4. wait the required acquisition time. 5. trigger acquisition end, start conversion: 6. wait for a/d conversion to complete, by either: ? waiting for the a/d interrupt, or ? waiting for the done bit to get set. 7. read a/d result buffer, clear adif if required. 16.3 selecting the conversion sequence several groups of control bi ts select the sequence in which the a/d connects inputs to the sample/hold channel, converts a channel, writes the buffer memory and generates interrupts. the sequence is controlled by the sampling clocks. the smpi bits select the number of acquisition/ conversion sequences that would be performed before an interrupt occurs. this can vary from 1 sample per interrupt to 16 samples per interrupt. the bufm bit will split the 16-word results buffer into two 8-word groups. writing to the 8-word buffers will be alternated on each interrupt event. use of the bufm bit will depend on how much time is available for the moving of the buffers after the interrupt. if the processor can quickly unload a full buffer within the time it takes to acqu ire and convert one channel, the bufm bit can be ? 0 ? and up to 16 conversions (cor- responding to the 16 input channels) may be done per interrupt. the processor will have one acquisition and conversion time to move the sixteen conversions. if the processor cannot unload the buffer within the acquisition and conversion time, the bufm bit should be ? 1 ?. for example, if smpi<3:0> (adcon2<5:2>) = 0111 , then eight conversions will be loaded into 1/2 of the buffer, following which an interrupt occurs. the next eight conversions will be loaded into the other 1/2 of the buffer. the processor will have the entire time between interrupts to move the eight conversions. the alts bit can be used to alternate the inputs selected during the samp ling sequence. the input multiplexer has two sets of sample inputs: mux a and mux b. if the alts bit is ? 0 ?, only the mux a inputs are selected for sampling. if the alts bit is ? 1 ? and smpi<3:0> = 0000 on the first sample/convert sequence, the mux a inputs are selected and on the next acquire/convert sequenc e, the mux b inputs are selected. the cscna bit (adcon2<10> ) will allow the multi- plexer input to be alternately scanned across a selected number of analog inputs for the mux a group. the inputs are selected by the adcssl register. if a particular bit in the adcssl register is ? 1 ?, the corre- sponding input is selected. the inputs are always scanned from lower to higher numbered inputs, starting after each interrupt. if the number of inputs selected is greater than the number of sa mples taken per interrupt, the higher numbered inputs are unused. ? 2005 microchip technology inc. preliminary ds70139c-page 111 dspic30f2011/2012/3012/3013 16.4 programming the start of conversion trigger the conversion trigger will terminate acquisition and start the requested conversions. the ssrc<2:0> bits select the source of the conver- sion trigger. the ssrc bits provide for up to 4 alternate sources of conversion trigger. when ssrc<2:0> = 000 , the conversion trigger is under software control. clearing the samp bit will cause the conversion trigger. when ssrc<2:0> = 111 (auto-start mode), the con- version trigger is under a/ d clock control. the samc bits select the number of a/d clocks between the start of acquisition and the start of conversion. this provides the fastest conversion rate s on multiple channels. samc must always be at least 1 clock cycle. other trigger sources can come from timer modules or external interrupts. 16.5 aborting a conversion clearing the adon bit during a conversion will abort the current conversion and stop the sampling sequenc- ing until the next sampling tr igger. the adcbuf will not be updated with the partially completed a/d conversion sample. that is, the adcbuf will continue to contain the value of the last completed conversion (or the last value written to the adcbuf register). if the clearing of the adon bit coincides with an auto- start, the clearing has a higher priority and a new conversion will not start. after the a/d conversi on is aborted, a 2 t ad wait is required before the next sampling may be started by setting the samp bit. 16.6 selecting the a/d conversion clock the a/d conversion requires 14 t ad . the source of the a/d conversion clock is software selected, using a six-bit counter. there are 64 possible options for t ad . equation 16-1: a/d conversion clock the internal rc oscillator is selected by setting the adrc bit. for correct a/d conversions, the a/d conversion clock (t ad ) must be selected to ensure a minimum t ad time of 667 nsec (for v dd = 5v). refer to the electrical specifications section for minimum t ad under other operating conditions. example 16-1 shows a sample calculation for the adcs<5:0> bits, assuming a device operating speed of 30 mips. example 16-1: a/d conversion clock and sampling rate calculation 16.7 a/d acquisition requirements the analog input model of th e 12-bit a/d converter is shown in figure 16-2. the to tal sampling time for the a/ d is a function of the internal amplifier settling time and the holding capacitor charge time. for the a/d converter to me et its specified accuracy, the charge holding capacitor (c hold ) must be allowed to fully charge to the volt age level on the analog input pin. the source impedance (r s ), the interconnect impedance (r ic ), and the internal sampling switch (r ss ) impedance combine to di rectly affect the time required to charge the capacitor c hold . the combined impedance of the analog so urces must therefore be small enough to fully charge the holding capacitor within the chosen sample time. to minimize the effects of pin leakage currents on the accuracy of the a/d con- verter, the maximum recommended source imped- ance, r s , is 2.5 k . after the analog input channel is selected (changed), this sampling function must be completed prior to starting the conversion. the internal holding capacitor will be in a discharged state prior to each sample operation. t ad = t cy * (0.5*(adcs<5:0> + 1)) minimum t ad = 667 nsec adcs<5:0> = 2 ? 1 t ad t cy t cy = 33 .33 nsec (30 mips) = 2 ? ? 1 667 nsec 33.33 nsec = 39 therefore, set adcs<5:0> = 39 actual t ad = (adcs<5:0> + 1) t cy 2 = (39 + 1) 33.33 nsec 2 = 667 nsec if ssrc<2:0> = ?111? and samc<4:0> = ?00001? since, sampling time = acquisition time + conversion time = 1 t ad + 14 t ad = 15 x 667 nsec therefore, sampling rate = = ~100 khz 1 (15 x 667 nsec) dspic30f2011/2012/3012/3013 ds70139c-page 112 preliminary ? 2005 microchip technology inc. figure 16-2: 12-bit a/d converter analog input model 16.8 module power-down modes the module has 2 internal power modes. when the adon bit is ? 1 ?, the module is in active mode; it is fully powered and functional. when adon is ? 0 ?, the module is in off mode. the dig- ital and analog portions of th e circuit are disabled for maximum current savings. in order to return to the active mode from off mode, the user must wait for the adc circuitry to stabilize. 16.9 a/d operation during cpu sleep and idle modes 16.9.1 a/d operation during cpu sleep mode when the device enters sleep mode, all clock sources to the module are shutdown and stay at logic ? 0 ?. if sleep occurs in the middle of a conversion, the con- version is aborted. the converter will not continue with a partially completed conver sion on exit from sleep mode. register contents are not affected by the device entering or leaving sleep mode. the a/d module can operate during sleep mode if the a/d clock source is set to rc (adrc = 1 ). when the rc clock source is selected, the a/d module waits one instruction cycle before starting the conversion. this allows the sleep instruction to be executed which elim- inates all digital switching noise from the conversion. when the conversion is complete, the conv bit will be cleared and the result loaded into the adcbuf register. if the a/d interrupt is enabled, the device will wake-up from sleep. if the a/d interrupt is not enabled, the a/ d module will then be turned off, although the adon bit will remain set. 16.9.2 a/d operation during cpu idle mode the adsidl bit selects if the module will stop on idle or continue on idle. if adsidl = 0 , the module will con- tinue operation on assertion of idle mode. if adsidl = 1 , the module will stop on idle. 16.10 effects of a reset a device reset forces all registers to their reset state. this forces the a/d module to be turned off, and any conversion and sampling seque nce is aborted. the val- ues that are in the adcbuf registers are not modified. the a/d result register will contain unknown data after a power-on reset. 16.11 output formats the a/d result is 12 bits wide. the data buffer ram is also 12 bits wide. the 12-bit data can be read in one of four different formats. the form<1:0> bits select the format. each of the output fo rmats translates to a 16-bit result on the data bus. c pin va rs anx v t = 0.6v v t = 0.6v i leakage r ic 250 sampling switch r ss c hold = dac capacitance v ss v dd = 18 pf 500 na legend: c pin v t i leakage r ic r ss c hold = input capacitance = threshold voltage = leakage current at the pin due to = interconnect resistance = sampling switch resistance = sample/hold capacitance (from dac) various junctions note: c pin value depends on device package and is not tested. effect of c pin negligible if rs 2.5 k . r ss 3 k ? 2005 microchip technology inc. preliminary ds70139c-page 113 dspic30f2011/2012/3012/3013 figure 16-3: a/d output data formats 16.12 configuring analog port pins the use of the adpcfg and tris registers control the operation of the a/d port pi ns. the port pins that are desired as analog inputs must have their correspond- ing tris bit set (input). if th e tris bit is cleared (out- put), the digital output level (v oh or v ol ) will be converted. the a/d operation is independ ent of the state of the ch0sa<3:0>/ch0sb<3:0> bits and the tris bits. when reading the port regi ster, all pins configured as analog input channels will read as cleared. pins configured as digital in puts will not convert an ana- log input. analog levels on an y pin that is defined as a digital input (including th e anx pins) may cause the input buffer to consume cu rrent that exceeds the device specifications. 16.13 connection considerations the analog inputs have diodes to v dd and v ss as esd protection. this requires that the analog input be between v dd and v ss . if the input voltage exceeds this range by greater than 0.3v (e ither direction), one of the diodes becomes forward biased and it may damage the device if the input current specification is exceeded. an external rc filter is sometimes added for anti- aliasing of the input signal. the r component should be selected to ensure that th e sampling time requirements are satisfied. any external components connected (via high impedance) to an analog input pin (capacitor, zener diode, etc.) should have very little leakage current at the pin. ram contents: d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 read to bus: signed fractional d11 d10d09d08d07d06d05d04d03d02d01d000000 fractional d11d10d09d08d07d06d05d04d03d02d01d000000 signed integer d11 d11 d11 d11 d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 integer 0 0 0 0 d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00 dspic30f2011/2012/3012/3013 ds70139c-page 114 preliminary ? 2005 microchip technology inc. table 16-1: a/d converter register map for dspic30f2011/3012 note: refer to dspic30f family reference manua l (ds70046) for descriptions of register bit fields. sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bi t 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state adcbuf0 0280 ? ? ? ? adc data buffer 0 0000 uuuu uuuu uuuu adcbuf1 0282 ? ? ? ? adc data buffer 1 0000 uuuu uuuu uuuu adcbuf2 0284 ? ? ? ? adc data buffer 2 0000 uuuu uuuu uuuu adcbuf3 0286 ? ? ? ? adc data buffer 3 0000 uuuu uuuu uuuu adcbuf4 0288 ? ? ? ? adc data buffer 4 0000 uuuu uuuu uuuu adcbuf5 028a ? ? ? ? adc data buffer 5 0000 uuuu uuuu uuuu adcbuf6 028c ? ? ? ? adc data buffer 6 0000 uuuu uuuu uuuu adcbuf7 028e ? ? ? ? adc data buffer 7 0000 uuuu uuuu uuuu adcbuf8 0290 ? ? ? ? adc data buffer 8 0000 uuuu uuuu uuuu adcbuf9 0292 ? ? ? ? adc data buffer 9 0000 uuuu uuuu uuuu adcbufa 0294 ? ? ? ? adc data buffer 10 0000 uuuu uuuu uuuu adcbufb 0296 ? ? ? ? adc data buffer 11 0000 uuuu uuuu uuuu adcbufc 0298 ? ? ? ? adc data buffer 12 0000 uuuu uuuu uuuu adcbufd 029a ? ? ? ? adc data buffer 13 0000 uuuu uuuu uuuu adcbufe 029c ? ? ? ? adc data buffer 14 0000 uuuu uuuu uuuu adcbuff 029e ? ? ? ? adc data buffer 15 0000 uuuu uuuu uuuu adcon1 02a0 adon ?adsidl ? ? ? form<1:0> ssrc<2:0> ? ? asam samp done 0000 0000 0000 0000 adcon2 02a2 vcfg<2:0> ? ? cscna ? ?bufs ? smpi<3:0> bufm alts 0000 0000 0000 0000 adcon3 02a4 ? ? ? samc<4:0> adrc ? adcs<5:0> 0000 0000 0000 0000 adchs 02a6 ? ? ? ch0nb ch0sb<3:0> ? ? ? ch0na ch0sa<3:0> 0000 0000 0000 0000 adpcfg 02a8 ? ? ? ? ? ? ? ? pcfg7 pcfg6 pcfg5 pcfg4 pcfg3 pcfg2 pcfg1 pcfg0 0000 0000 0000 0000 adcssl 02aa ? ? ? ? ? ? ? ? cssl7 cssl6 cssl5 cssl4 cssl3 cssl2 cssl1 cssl0 0000 0000 0000 0000 legend: u = uninitialized bit ? 2005 microchip technology inc. preliminary ds70139c-page 115 dspic30f2011/2012/3012/3013 table 16-2: a/d converter register map for dspic30f2012/3013 note: refer to dspic30f family reference manua l (ds70046) for descriptions of register bit fields. sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bi t 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state adcbuf0 0280 ? ? ? ? adc data buffer 0 0000 uuuu uuuu uuuu adcbuf1 0282 ? ? ? ? adc data buffer 1 0000 uuuu uuuu uuuu adcbuf2 0284 ? ? ? ? adc data buffer 2 0000 uuuu uuuu uuuu adcbuf3 0286 ? ? ? ? adc data buffer 3 0000 uuuu uuuu uuuu adcbuf4 0288 ? ? ? ? adc data buffer 4 0000 uuuu uuuu uuuu adcbuf5 028a ? ? ? ? adc data buffer 5 0000 uuuu uuuu uuuu adcbuf6 028c ? ? ? ? adc data buffer 6 0000 uuuu uuuu uuuu adcbuf7 028e ? ? ? ? adc data buffer 7 0000 uuuu uuuu uuuu adcbuf8 0290 ? ? ? ? adc data buffer 8 0000 uuuu uuuu uuuu adcbuf9 0292 ? ? ? ? adc data buffer 9 0000 uuuu uuuu uuuu adcbufa 0294 ? ? ? ? adc data buffer 10 0000 uuuu uuuu uuuu adcbufb 0296 ? ? ? ? adc data buffer 11 0000 uuuu uuuu uuuu adcbufc 0298 ? ? ? ? adc data buffer 12 0000 uuuu uuuu uuuu adcbufd 029a ? ? ? ? adc data buffer 13 0000 uuuu uuuu uuuu adcbufe 029c ? ? ? ? adc data buffer 14 0000 uuuu uuuu uuuu adcbuff 029e ? ? ? ? adc data buffer 15 0000 uuuu uuuu uuuu adcon1 02a0 adon ?adsidl ? ? ? form<1:0> ssrc<2:0> ? ? asam samp done 0000 0000 0000 0000 adcon2 02a2 vcfg<2:0> ? ? cscna ? ?bufs ? smpi<3:0> bufm alts 0000 0000 0000 0000 adcon3 02a4 ? ? ? samc<4:0> adrc ? adcs<5:0> 0000 0000 0000 0000 adchs 02a6 ? ? ? ch0nb ch0sb<3:0> ? ? ? ch0na ch0sa<3:0> 0000 0000 0000 0000 adpcfg 02a8 ? ? ? ? ? ? pcfg9 pcfg8 pcfg7 pcfg6 pcfg5 pcfg4 pcfg3 pcfg2 pcfg1 pcfg0 0000 0000 0000 0000 adcssl 02aa ? ? ? ? ? ? cssl9 cssl8 cssl7 cssl6 cssl5 cssl4 cssl3 cssl2 cssl1 cssl0 0000 0000 0000 0000 legend: u = uninitialized bit dspic30f2011/2012/3012/3013 ds70139c-page 116 preliminary ? 2005 microchip technology inc. notes: ? 2005 microchip technology inc. preliminary ds70139c-page 117 dspic30f2011/2012/3012/3013 17.0 system integration there are several features intended to maximize sys- tem reliability, minimize co st through elimination of external components, provide power saving operating modes and offer code protection: ? oscillator selection ? reset - power-on reset (por) - power-up timer (pwrt) - oscillator start-up timer (ost) - programmable brown-out reset (bor) ? watchdog timer (wdt) ? power saving modes (sleep and idle) ? code protection ? unit id locations ? in-circuit serial programming (icsp) dspic30f devices have a watchdog timer which is permanently enabled via the configuration bits or can be software controlled. it r uns off its own rc oscillator for added reliability. there are two timers that offer necessary delays on power-up. one is the oscillator start-up timer (ost), inte nded to keep the chip in reset until the crystal oscillator is stable. the other is the power-up timer (pwrt) which provides a delay on power-up only, designed to keep the part in reset while the power supply stabilizes. with these two timers on-chip, most applications need no external reset circuitry. sleep mode is designed to offer a very low current power-down mode. the user can wake-up from sleep through external reset, watchdog timer wake-up, or through an interrupt. several oscillator options are also made available to allow the part to fit a wide variety of applications. in the idle mode, the clock sources are still active but the cpu is shut-off. the rc oscillator option saves system cost while the lp crystal option saves power. 17.1 oscillator system overview the dspic30f oscillator system has the following modules and features: ? various external and intern al oscillator options as clock sources ? an on-chip pll to boost internal operating frequency ? a clock switching mechanism between various clock sources ? programmable clock postscaler for system power savings ? a fail-safe clock monitor (fscm) that detects clock failure and takes fail-safe measures ? clock control register (osccon) ? configuration bits for main oscillator selection configuration bits determine the clock source upon power-on reset (por) and brown-out reset (bor). thereafter, the clock sour ce can be changed between permissible clock sources. the osccon register con- trols the clock switching and reflects system clock related status bits. table 17-1 provides a summary of the dspic30f oscil- lator operating modes. a si mplified diagram of the oscillator system is shown in figure 17-1. note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descr iptions and general device functionality, refer to the dspic30f family reference manual (ds70046). for more information on the device instruction set and programming, refer to the dspic30f programmer?s reference manual (ds70030). dspic30f2011/2012/3012/3013 ds70139c-page 118 preliminary ? 2005 microchip technology inc. table 17-1: oscillator operating modes oscillator mode description xtl 200 khz-4 mhz crystal on osc1:osc2. xt 4 mhz-10 mhz crystal on osc1:osc2. xt w/ pll 4x 4 mhz-10 mhz crysta l on osc1:osc2, 4x pll enabled. xt w/ pll 8x 4 mhz-10 mhz crysta l on osc1:osc2, 8x pll enabled. xt w/ pll 16x 4 mhz-7.5 mhz crystal on osc1:osc2, 16x pll enabled (1) . lp 32 khz crystal on sosco:sosci (2) . hs 10 mhz-25 mhz crystal. hs/2 w/pll 4x 10 mhz -20 mhz crystal , divide by 2, 4x pll enabled. hs/2 w/ pll 8x 10 mhz-20 mhz crysta l, divide by 2, 8x pll enabled. hs/2 w/ pll 16x 10 mhz-15 mhz crys tal, divide by 2, 16x pll enabled (1) . hs/3 w/pll 4x 12 mhz-25 mhz crystal, divide by 3, 4x pll enabled. hs/3 w/ pll 8x 12 mhz-25 mhz crysta l, divide by 3, 8x pll enabled. hs/3 w/ pll 16x 12 mhz-22.5 mhz crysta l, divide by 3, 16x pll enabled (1) . ec external clock input (0-40 mhz). ecio external clock input (0-40 mhz), osc2 pin is i/o. ec w/ pll 4x external clock input (4-10 mhz), osc2 pin is i/o, 4x pll enabled. ec w/ pll 8x external clock input (4-10 mhz), osc2 pin is i/o, 8x pll enabled. ec w/ pll 16x external clock input (4-7.5 mhz), osc2 pin is i/o, 16x pll enabled (1) . erc external rc oscillator, osc2 pin is f osc /4 output (3) . ercio external rc oscillator, osc2 pin is i/o (3) . frc 7.37 mhz internal rc oscillator. frc w/ pll 4x 7.37 mhz internal rc oscillator, 4x pll enabled. frc w/ pll 8x 7.37 mhz internal rc oscillator, 8x pll enabled. frc w/ pll 16x 7.37 mhz internal rc oscillator, 16x pll enabled. lprc 512 khz internal rc oscillator. note 1: dspic30f maximum operating frequency of 120 mhz must be met. 2: lp oscillator can be conveniently shared as system clock, as well as real-time clock for timer1. 3: requires external r and c. fr equency operation up to 4 mhz. ? 2005 microchip technology inc. preliminary ds70139c-page 119 dspic30f2011/2012/3012/3013 figure 17-1: oscillator system block diagram primary osc1 osc2 sosco sosci oscillator 32 khz lp clock and control block switching oscillator x4, x8, x16 pll primary oscillator stability detector stability detector secondary oscillator programmable clock divider oscillator start-up timer fail-safe clock monitor (fscm) internal fast rc oscillator (frc) internal low power rc oscillator (lprc) pwrsav instruction wake-up request oscillator configuration bits system clock oscillator trap to timer1 lprc secondary osc por done primary osc f pll post<1:0> 2 fcksm<1:0> 2 pll lock cosc<2:0> nosc<2:0> oswen cf internal frc osc dspic30f2011/2012/3012/3013 ds70139c-page 120 preliminary ? 2005 microchip technology inc. 17.2 oscillator configurations 17.2.1 initial clock source selection while coming out of power- on reset or brown-out reset, the device selects its clock source based on: a) fos<2:0> configuration bits that select one of four oscillator groups, b) and fpr<4:0> configuration bits that select one of 15 oscillator choices within the primary group. the selection is as shown in table 17-2. 17.2.2 oscillator start-up timer (ost) in order to ensure that a cr ystal oscillator (or ceramic resonator) has started and stabilized, an oscillator start-up timer is included. it is a simple 10-bit counter that counts 1024 t osc cycles before releasing the oscillator clock to the rest of the system. the time-out period is designated as t ost . the t ost time is involved every time the oscillator has to restart (i.e., on por, bor and wake-up from sleep). the oscillator start-up timer is applied to the lp oscil- lator, xt, xtl and hs modes (upon wake-up from sleep, por and bor) for the primary oscillator. table 17-2: configuration bit values for clock selection oscillator mode oscillator source fos<2:0> fpr<4:0> osc2 function ecio w/ pll 4x pll 1 1 101101 i/o ecio w/ pll 8x pll 1 1 101110 i/o ecio w/ pll 16x pll 1 1 101111 i/o frc w/ pll 4x pll 1 1 100001 i/o frc w/ pll 8x pll 1 1 101010 i/o frc w/ pll 16x pll 1 1 100011 i/o xt w/ pll 4x pll 1 1 100101 osc2 xt w/ pll 8x pll 1 1 100110 osc2 xt w/ pll 16x pll 1 1 100111 osc2 hs2 w/ pll 4x pll 1 1 110001 osc2 hs2 w/ pll 8x pll 1 1 110010 osc2 hs2 w/ pll 16x pll 1 1 110011 osc2 hs3 w/ pll 4x pll 1 1 110101 osc2 hs3 w/ pll 8x pll 1 1 110110 osc2 hs3 w/ pll 16x pll 1 1 110111 osc2 ecio external 0 1 101100 i/o xt external 0 1 100100 osc2 hs external 0 1 100010 osc2 ec external 0 1 101011 clkout erc external 0 1 101001 clkout ercio external 0 1 101000 i/o xtl external 0 1 100000 osc2 lp secondary 0 0 0xxxxx (note 1, 2) frc internal frc 0 0 1xxxxx (note 1, 2) lprc internal lprc 0 1 0xxxxx (note 1, 2) note 1: osc2 pin function is determin ed by the primary oscillator mode selection (fpr<4:0>). 2: osc1 pin cannot be used as an i/o pi n even if the secondary oscillator or an internal clock source is selected at all times. ? 2005 microchip technology inc. preliminary ds70139c-page 121 dspic30f2011/2012/3012/3013 17.2.3 lp oscillator control enabling the lp oscillator is controlled with two elements: 1. the current oscillator group bits cosc<2:0>. 2. the lposcen bit (oscon register). the lp oscillator is on (even during sleep mode) if lposcen = 1. the lp oscillator is the device clock if: ? cosc<2:0> = 000 (lp selected as main oscillator) and ? lposcen = 1 keeping the lp oscillator on at all times allows for a fast switch to the 32 khz system clock for lower power oper- ation. returning to the faster main oscillator will still require a start-up time 17.2.4 phase locked loop (pll) the pll multiplies the clock which is generated by the primary oscillator or fast rc oscillator. the pll is selectable to have either gains of x4, x8, and x16. input and output frequency ra nges are summarized in table 17-3. table 17-3: pll frequency range the pll features a lock output which is asserted when the pll enters a phase lo cked state. should the loop fall out of lock (e.g., due to noise), the lock signal will be rescinded. the state of this signal is reflected in the read only lock bit in the osccon register. 17.2.5 fast rc oscillator (frc) the frc oscillator is a fast (7.37 mhz nominal) internal rc oscillator. this oscillator is intended to provide reasonable device operati ng speeds without the use of an external crystal, cerami c resonator, or rc network. the frc oscillator can be us ed with the pll to obtain higher clock frequencies. the dspic30f operates from the frc oscillator when- ever the current oscillator se lection control bits in the osccon register (osccon<14:12>) are set to ? 001 ?. the four bit field specified by tun<3:0> (osctun <3:0>) allows the user to tune the internal fast rc oscillator (nominal 7.37 mhz). the user can tune the frc oscillator within a range of +10.5% (840 khz) and -12% (960 khz) in steps of 1.50% around the factory-calibrated se tting, see table 17-4. if osccon<14:12> are set to ? 111 ? and fpr<4:0> are set to ? 00001 ?, ? 01010 ? or ? 00011 ?, then a pll multiplier of 4, 8 or 16 (respectively) is applied. table 17-4: frc tuning 17.2.6 low power rc oscillator (lprc) the lprc oscillator is a component of the watchdog timer (wdt) and oscillates at a nominal frequency of 512 khz. the lprc oscillator is the clock source for the power-up timer (pwrt) circuit, wdt, and clock monitor circuits. it may also be used to provide a low frequency clock source optio n for applications where power consumption is critical and timing accuracy is not required the lprc oscillator is al ways enabled at a power-on reset because it is the cl ock source for the pwrt. after the pwrt expires, the lprc oscillator will remain on if one of the following is true: ? the fail-safe clock monitor is enabled ? the wdt is enabled ? the lprc oscillator is selected as the system clock via the cosc<2:0> control bits in the osccon register if one of the above conditions is not true, the lprc will shut-off after the pwrt expires. f in pll multiplier f out 4 mhz-10 mhz x4 16 mhz-40 mhz 4 mhz-10 mhz x8 32 mhz-80 mhz 4 mhz-7.5 mhz x16 64 mhz-120 mhz note: when a 16x pll is used, the frc fre- quency must not be tuned to a frequency greater than 7.5 mhz. tun<3:0> bits frc frequency 0111 + 10.5% 0110 + 9.0% 0101 + 7.5% 0100 + 6.0% 0011 + 4.5% 0010 + 3.0% 0001 + 1.5% 0000 center frequency (oscillator is running at calibrated frequency) 1111 - 1.5% 1110 - 3.0% 1101 - 4.5% 1100 - 6.0% 1011 - 7.5% 1010 - 9.0% 1001 - 10.5% 1000 - 12.0% note 1: osc2 pin function is determined by the primary oscillator mode selection (fpr<4:0>). 2: osc1 pin cannot be used as an i/o pin even if the secondary oscillator or an internal clock source is selected at all times. dspic30f2011/2012/3012/3013 ds70139c-page 122 preliminary ? 2005 microchip technology inc. 17.2.7 fail-safe clock monitor the fail-safe clock monitor (fscm) allows the device to continue to operate even in the event of an oscillator failure. the fscm function is enabled by appropriately programming the fcksm configuration bits (clock switch and monitor selecti on bits) in the fosc device configuration register. if the fscm function is enabled, the lprc internal oscillator wi ll run at all times (except during sleep mode) and will not be subject to control by the swdten bit. in the event of an oscillator failure, the fscm will gen- erate a clock failure trap ev ent and will switch the sys- tem clock over to the frc os cillator. the user will then have the option to either at tempt to restart the oscillator or execute a controlled shutdown. the user may decide to treat the trap as a warm reset by simply loading the reset address into the oscillato r fail trap vector. in this event, the cf (clock fail) status bit (osccon<3>) is also set whenever a cloc k failure is recognized. in the event of a clock failure, the wdt is unaffected and continues to run on the lprc clock. if the oscillator has a very sl ow start-up time coming out of por, bor or sleep, it is possible that the pwrt timer will expire before the oscillator has started. in such cases, the fscm will be activated and the fscm will initiate a clock failure trap, and the cosc<2:0> bits are loaded with frc oscillator selection. this will effec- tively shut-off the original oscillator that was trying to start. the user may detect this situation and restart the oscillator in the clock fail trap isr. upon a clock failure detect ion, the fscm module will initiate a clock switch to th e frc oscillator as follows: 1. the cosc bits (osccon<14:12>) are loaded with the frc oscillator selection value. 2. cf bit is set (osccon<3>). 3. oswen control bit (osccon<0>) is cleared. for the purpose of clock sw itching, the clock sources are sectioned into four groups: 1. primary (with or without pll) 2. secondary 3. internal frc 4. internal lprc the user can switch between these functional groups but cannot switch between options within a group. if the primary group is selected, then the choice within the group is always determined by the fpr<4:0> configuration bits. the osccon register holds the control and status bits related to clock switching. ? cosc<2:0>: read only status bits always reflect the current oscillator group in effect. ? nosc<2:0>: control bits which are written to indicate the new oscillator group of choice. - on por and bor, cosc<2:0> and nosc<2:0> are both loaded with the configuration bit values fos<2:0>. ? lock: the lock status bit indicates a pll lock. ? cf: read only status bit indicating if a clock fail detect has occurred. ? oswen: control bit changes from a ? 0 ? to a ? 1 ? when a clock transition sequence is initiated. clearing the oswen control bit will abort a clock transition in progress (used for hang-up situations). if configuration bits fcksm<1:0> = 1x , then the clock switching and fail-safe cloc k monitoring functions are disabled. this is the defau lt configuration bit setting. if clock switching is disabl ed, then the fos<2:0> and fpr<4:0> bits directly cont rol the oscillator selection and the cosc<2:0> bits do not control the clock selec- tion. however, these bits w ill reflect the clock source selection. 17.2.8 protection against accidental writes to osccon a write to the osccon register is intentionally made difficult because it controls clock switching and clock scaling. to write to the osccon lo w byte, the following code sequence must be execut ed without any other instructions in between: byte write is allowed for one instruction cycle . write the desired value or use bit manipulation instruction. to write to the osccon high byte, the following instructions must be executed without any other instructions in between: byte write is allowed for one instruction cycle . write the desired value or use bit manipulation instruction. note: the application should not attempt to switch to a clock of frequency lower than 100 khz when the fail-safe clock monitor is enabled. if such clock switching is performed, the device may generate an oscillator fail trap and switch to the fast rc oscillator. byte write ?0x46? to osccon low byte write ?0x57? to osccon low byte write ? 0x78 ? to osccon high byte write ? 0x9a ? to osccon high ? 2005 microchip technology inc. preliminary ds70139c-page 123 dspic30f2011/2012/3012/3013 17.3 reset the dspic30f2011/2012/3012/3013 differentiates between various kinds of reset: a) power-on reset (por) b) mclr reset during normal operation c) mclr reset during sleep d) watchdog timer (wdt) reset (during normal operation) e) programmable brown-out reset (bor) f) reset instruction g) reset caused by trap lockup (trapr) h) reset caused by illegal opcode or by using an uninitialized w register as an address pointer (iopuwr) different registers are affected in different ways by var- ious reset conditions. most registers are not affected by a wdt wake-up since this is viewed as the resump- tion of normal operation. status bits from the rcon register are set or cleared differently in different reset situations, as indicated in table 17-5. these bits are used in software to determin e the nature of the reset. a block diagram of the on-c hip reset circuit is shown in figure 17-2. a mclr noise filter is provided in the mclr reset path. the filter detects and ignores small pulses. internally generated resets do not drive mclr pin low. figure 17-2: reset system block diagram 17.3.1 por: power-on reset a power-on event will gener ate an internal por pulse when a v dd rise is detected. the reset pulse will occur at the por circuit threshold voltage (v por ) which is nominally 1.85v. the device supply voltage character- istics must meet specified st arting voltage and rise rate requirements. the por pulse will reset a por timer and place the device in t he reset state. the por also selects the device clock so urce identified by the oscillator configuration fuses. the por circuit inserts a small delay, t por , which is nominally 10 s and ensures that the device bias cir- cuits are stable. furthermore, a user selected power- up time-out (t pwrt ) is applied. the t pwrt parameter is based on device configuration bits and can be 0 ms (no delay), 4 ms, 16 ms, or 64 ms. the total delay is at device power-up, t por + t pwrt . when these delays have expired, sysrst will be negated on the next leading edge of the q1 clock an d the pc will jump to the reset vector. the timing for the sysrst signal is shown in figure 17-3 through figure 17-5. s r q mclr v dd v dd rise detect por sysrst sleep or idle brown-out reset boren reset instruction wdt module digital glitch filter bor trap conflict illegal opcode/ uninitialized w register dspic30f2011/2012/3012/3013 ds70139c-page 124 preliminary ? 2005 microchip technology inc. figure 17-3: time-out sequence on power-up (mclr tied to v dd ) figure 17-4: time-out sequence on power-up (mclr not tied to v dd ): case 1 figure 17-5: time-out sequence on power-up (mclr not tied to v dd ): case 2 t pwrt t ost v dd internal por pwrt time-out ost time-out internal reset mclr t pwrt t ost v dd internal por pwrt time-out ost time-out internal reset mclr v dd mclr internal por pwrt time-out ost time-out internal reset t pwrt t ost ? 2005 microchip technology inc. preliminary ds70139c-page 125 dspic30f2011/2012/3012/3013 17.3.1.1 por with long crystal start-up time (with fscm enabled) the oscillator start-up circuitr y is not linked to the por circuitry. some crystal ci rcuits (especially low fre- quency crystals) will have a relatively long start-up time. therefore, one or more of the following conditions is possible after the por timer and the pwrt have expired: ? the oscillator circuit has not begun to oscillate. ? the oscillator start-up timer has not expired (if a crystal oscillator is used). ? the pll has not achieved a lock (if pll is used). if the fscm is enabled and one of the above conditions is true, then a clock failure trap will occur. the device will automatically switch to the frc oscillator and the user can switch to the desired crystal oscillator in the trap isr. 17.3.1.2 operating without fscm and pwrt if the fscm is disabled and the power-up timer (pwrt) is also disabled, then the device will exit rap- idly from reset on power- up. if the clock source is frc, lprc, extrc or ec, it will be active immediately. if the fscm is disabled a nd the system clock has not started, the device will be in a frozen state at the reset vector until the system clock starts. from the user?s perspective, the device will appear to be in reset until a system clock is available. 17.3.2 bor: programmable brown-out reset the bor (brown-out rese t) module is based on an internal voltage reference circuit. the main purpose of the bor module is to gener ate a device reset when a brown-out condition occurs. brown-out conditions are generally caused by glitch es on the ac mains (i.e., missing portions of the ac cycle waveform due to bad power transmission lines, or voltage sags due to exces- sive current draw when a large inductive load is turned on). the bor module allows selection of one of the following voltage trip points: ?2.0v ?2.7v ?4.2v ?4.5v a bor will generate a reset pulse which will reset the device. the bor will select the clock source based on the device configuration bit values (fos<1:0> and fpr<3:0>). furthermore, if an oscillator mode is selected, the bor will activa te the oscillator start-up timer (ost). the system clock is held until ost expires. if the pll is used, then the clock will be held until the lock bit (osccon<5>) is ? 1 ?. concurrently, the por time-out (t por ) and the pwrt time-out (t pwrt ) will be applied before the internal reset is released. if t pwrt = 0 and a crystal oscillator is being used, then a nominal delay of t fscm = 100 s is applied. the total delay in this case is (t por + t fscm ). the bor status bit (rcon<1>) will be set to indicate that a bor has occurred. the bor circuit, if enabled, will continue to operate while in sleep or idle modes and will reset the device should v dd fall below the bor threshold voltage. figure 17-6: external power-on reset circuit (for slow v dd power-up) note: the bor voltage trip points indicated here are nominal values provided for design guidance only. refer to the electrical specifications in the specific device data sheet for bor voltage limit specifications. note: dedicated supervisory devices, such as the mcp1xx and mcp8xx, may also be used as an external power-on reset circuit. note 1: external power-on reset circuit is required only if the v dd power-up slope is too slow. the diode d helps discharge the capacitor quickly when v dd powers down. 2: r should be suitably chosen so as to make sure that the voltage drop across r does not violate the device?s electrical specifications. 3: r1 should be suitably chosen so as to limit any current flowing into mclr from external capacitor c, in the event of mclr /v pp pin breakdown due to electrostatic discharge (esd), or electrical overstress (eos). c r1 r d v dd dspic30f mclr dspic30f2011/2012/3012/3013 ds70139c-page 126 preliminary ? 2005 microchip technology inc. table 17-5 shows the reset conditions for the rcon register. since the control bits within the rcon register are r/w, the information in th e table implies that all the bits are negated prior to th e action specified in the condition column. table 17-5: initialization condition for rcon register: case 1 table 17-6 shows a second example of the bit conditions for the rcon register . in this case, it is not assumed the user has set/cle ared specific bits prior to action specified in the condition column. table 17-6: initialization condition for rcon register: case 2 condition program counter trapr iopuwr extr swr wdto idle sleep por bor power-on reset 0x000000 000000011 brown-out reset 0x000000 000000001 mclr reset during normal operation 0x000000 001000000 software reset during normal operation 0x000000 000100000 mclr reset during sleep 0x000000 001000100 mclr reset during idle 0x000000 001001000 wdt time-out reset 0x000000 000010000 wdt wake-up pc + 2 000010100 interrupt wake-up from sleep pc + 2 (1) 000000100 clock failure trap 0x000004 000000000 trap reset 0x000000 100000000 illegal operation trap 0x000000 010000000 legend: u = unchanged, x = unknown, - = unimplemented bit, read as ? 0 ? note 1: when the wake-up is due to an enabled interrupt, the pc is loaded with the corresponding interrupt vector. condition program counter trapr iopuwr extr swr wdto idle sleep por bor power-on reset 0x000000 000000011 brown-out reset 0x000000 uuuuuuu01 mclr reset during normal operation 0x000000 uu10000uu software reset during normal operation 0x000000 uu01000uu mclr reset during sleep 0x000000 uu1u001uu mclr reset during idle 0x000000 uu1u010uu wdt time-out reset 0x000000 uu00100uu wdt wake-up pc + 2 uuuu1u1uu interrupt wake-up from sleep pc + 2 (1) uuuuuu1uu clock failure trap 0x000004 uuuuuuuuu trap reset 0x000000 1uuuuuuuu illegal operation reset 0x000000 u1uuuuuuu legend: u = unchanged, x = unknown, - = unimplemented bit, read as ? 0 ? note 1: when the wake-up is due to an enab led interrupt, the pc is loaded with the corresponding interrupt vector. ? 2005 microchip technology inc. preliminary ds70139c-page 127 dspic30f2011/2012/3012/3013 17.4 watchdog timer (wdt) 17.4.1 watchdog timer operation the primary function of th e watchdog timer (wdt) is to reset the processor in t he event of a software mal- function. the wdt is a free -running timer which runs off an on-chip rc oscillator , requiring no external com- ponent. therefore, the wdt ti mer will continue to oper- ate even if the main processor clock (e.g., the crystal oscillator) fails. 17.4.2 enabling and disabling the wdt the watchdog timer can be ?enabled? or ?disabled? only through a configurat ion bit (fwdten) in the configuration register, fwdt. setting fwdten = 1 enables the watchdog timer. the enabling is done when programming the device. by default, after chip erase, fwdten bit = 1 . any device programmer capable of programming dspic30f devices allows programming of this and other configuration bits. if enabled, the wdt will increment until it overflows or ?times out?. a wdt time-out will force a device reset (except during sleep). to pr event a wdt time-out, the user must clear the watchdog timer using a clrwdt instruction. if a wdt times out during sleep, the device will wake- up. the wdto bit in the rcon register will be cleared to indicate a wake-up resulting from a wdt time-out. setting fwdten = 0 allows user software to enable/ disable the watchdog timer via the swdten (rcon<5>) control bit. 17.5 low voltage detect the low voltage detect (lvd ) module is used to detect when the v dd of the device drops below a threshold value, v lvd , which is determined by the lvdl<3:0> bits (rcon<11:8>) and is thus user programmable. the internal voltage referenc e circuitry requires a nom- inal amount of time to stabilize, and the bgst bit (rcon<13>) indicates when the voltage reference has stabilized. in some devices, the lv d threshold voltage may be applied externally on the lvdin pin. the lvd module is enabled by setting the lvden bit (rcon<12>). 17.6 power saving modes there are two power saving st ates that can be entered through the execution of a special instruction, pwrsav ; these are sleep and idle. the format of the pwrsav instruction is as follows: pwrsav dspic30f2011/2012/3012/3013 ds70139c-page 128 preliminary ? 2005 microchip technology inc. any interrupt that is individually enabled (using the cor- responding ie bit) and meets the prevailing priority level will be able to wake-up the processor. the processor will process the interrupt and branch to the isr. the sleep status bit in the rcon register is set upon wake-up. all resets will wake-up the processor from sleep mode. any reset, other than por, will set the sleep status bit. in a por, th e sleep bit is cleared. if the watchdog timer is enabled, then the processor will wake-up from sleep mo de upon wdt time-out. the sleep and wdto status bits are both set. 17.6.2 idle mode in idle mode, the clock to the cpu is shutdown while peripherals keep running. un like sleep mode, the clock source remains active. several peripherals have a control bit in each module that allows them to operate during idle. lprc fail-safe clock remains active if clock failure detect is enabled. the processor wakes up from id le if at least one of the following conditions has occurred: ? any interrupt that is indi vidually enabled (ie bit is ? 1 ?) and meets the required priority level ? any reset (por, bor, mclr ) ? wdt time-out upon wake-up from idle mode, the clock is re-applied to the cpu and instruction execution begins immedi- ately, starting with the instruction following the pwrsav instruction. any interrupt that is indivi dually enabled (using ie bit) and meets the prevailing prio rity level will be able to wake-up the processor. the processor will process the interrupt and branch to the isr. the idle status bit in the rcon register is set upon wake-up. any reset other than por will set the idle status bit. on a por, the idle bit is cleared. if watchdog timer is enabled, then the processor will wake-up from idle mode up on wdt time-out. the idle and wdto status bits are both set. unlike wake-up from sleep, there are no time delays involved in wake-up from idle. 17.7 device configuration registers the configuration bits in each device configuration reg- ister specify some of the device modes and are programmed by a device programmer, or by using the in-circuit serial progra mming? (icsp?) feature of the device. each device configuration register is a 24-bit register, but only the lower 16 bits of each regis- ter are used to hold config uration data. there are four device configuration register s available to the user: 1. fosc (0xf80000): oscillator configuration register 2. fwdt (0xf80002): watchdog timer configuration register 3. fborpor (0xf80004): bor and por configuration register 4. fgs (0xf8000a): general code segment configuration register the placement of the configur ation bits is automatically handled when you select the device in your device programmer. the desired state of the configuration bits may be specified in the so urce code (dependent on the language tool used), or through the programming interface. after the device has been programmed, the application software may re ad the configuration bit values through the table re ad instructions. for addi- tional information, please refer to the programming specifications of the device. note: in spite of various delays applied (t por , t lock and t pwrt ), the crystal oscillator (and pll) may not be active at the end of the time-out (e.g., for low frequency crys- tals). in such cases, if fscm is enabled, then the device will detect this as a clock failure and process the clock failure trap, the frc oscillator will be enabled and the user will have to re-enable the crystal oscillator. if fscm is not enabled, then the device will simply suspend execution of code until the clock is stable and will remain in sleep until the oscillator clock has started. note: if the code protection configuration fuse bits (fgs ? 2005 microchip technology inc. preliminary ds70139c-page 129 dspic30f2011/2012/3012/3013 17.8 peripheral module disable (pmd) registers the peripheral module di sable (pmd) registers pro- vide a method to disable a peripheral module by stop- ping all clock sources suppli ed to that module. when a peripheral is disabled via the appropriate pmd control bit, the peripheral is in a minimum power consumption state. the control and status registers associated with the peripheral will also be di sabled so writes to those registers will have no effect and read values will be invalid. a peripheral module will only be enabled if both the associated bit in the the pm d register is cleared and the peripheral is supported by the specific dspic vari- ant. if the peripheral is present in the device, it is enabled in the pmd register by default. 17.9 in-circuit debugger when mplab icd2 is selected as a debugger, the in- circuit debugging functionalit y is enabled. this func- tion allows simple debugging functions when used with mplab ide. when the device has this feature enabled, some of the resources ar e not available for general use. these resources include the first 80 bytes of data ram and two i/o pins. one of four pairs of debug i/o pins may be selected by the user using configuration options in mplab ide. these pin pairs are named emud/emuc, emud1/ emuc1, emud2/emuc2 and emud3/emuc3. in each case, the selected emud pin is the emulation/ debug data line, and the emuc pin is the emulation/ debug clock line. these pins will interface to the mplab icd 2 module availa ble from microchip. the selected pair of debug i/o pins is used by mplab icd 2 to send commands and receive responses, as well as to send and receive data. to use the in-circuit debugger function of th e device, the design must implement icsp connections to mclr , v dd , v ss , pgc, pgd, and the selected emudx/emucx pin pair. this gives rise to two possibilities: 1. if emud/emuc is selected as the debug i/o pin pair, then only a 5-pin interface is required, as the emud and emuc pin functions are multi- plexed with the pgd and pgc pin functions in all dspic30f devices. 2. if emud1/emuc1, emud2/emuc2 or emud3/ emuc3 is selected as the debug i/o pin pair, then a 7-pin interface is required, as the emudx/emucx pin functions (x = 1, 2 or 3) are not multiplexed with the pgd and pgc pin functions. note: if a pmd bit is set, the corresponding mod- ule is disabled after a delay of 1 instruction cycle. similarly, if a pmd bit is cleared, the corresponding module is enabled after a delay of 1 instruction cycle (assuming the module control registers are already configured to enable module operation). note: in the dspic30f2011 , dspic30f3012 and dspic30f2012 device s, the u2md bit is readable and writable and will be read as ? 1 ? when set. dspic30f2011/2012/3012/3013 ds70139c-page 130 preliminary ? 2005 microchip technology inc. table 17-7: system integration register map table 17-8: device configuration register map note: refer to dspic30f family reference manua l (ds70046) for descriptions of register bit fields. sfr name addr. bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reset state rcon 0740 trapr iopuwr bgst lvden lvdl<3:0> extr swr swdten wdto sleep idle bor por (note 1) osccon 0742 ? cosc<2:0> ? nosc<2:0> post<1:0> lock ?cf ? lposcen oswen (note 2) osctun 0744 ? ? ? ? ? ? ? ? ? ? ? ? tun3 tun2 tun1 tun0 (note 2) pmd1 0770 ? ? t3md t2md t1md ? ? ? i2cmd u2md (3) u1md ?spi1md ? ? adcmd 0000 0000 0000 0000 pmd2 0772 ? ? ? ? ? ?ic2mdic1md ? ? ? ? ? ?oc2mdoc1md 0000 0000 0000 0000 note 1: reset state depends on type of reset. 2: reset state depends on configuration bits. 3: only available on DSPIC30F3013. file name addr. bits 23-16 bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 fosc f80000 ?fcksm<1:0> ? ? ?fos<2:0> ? ? ?fpr<4:0> fwdt f80002 ?fwdten ? ? ? ? ? ? ? ? ? fwpsa<1:0> fwpsb<3:0> fborpor f80004 ?mclren ? ? ? ? reserved (1) reserved (1) reserved (1) boren ?borv<1:0> ? ?fpwrt<1:0> fgs f8000a ? ? ? ? ? ? ? ? ? ? ? ? ? ? reserved (1) gcp gwrp note 1: always reads as ?1?. ? 2005 microchip technology inc. preliminary ds70139c-page 131 dspic30f2011/2012/3012/3013 18.0 instruction set summary the dspic30f instruction set adds many enhancements to the previous picmicro ? instruction sets, while maintaining an easy migration from picmicro instruction sets. most instructions are a single program memory word (24 bits). only three instructions require two program memory locations. each single word instruction is a 24-bit word divided into an 8-bit opcode which specifies the instruction type, and one or more operands which further specify the operation of the instruction. the instruction set is high ly orthogonal and is grouped into five basic categories: ? word or byte-oriented operations ? bit-oriented operations ? literal operations ? dsp operations ? control operations table 18-1 shows the general symbols used in describing the instructions. the dspic30f instruction set summary in table 18-2 lists all the instructions, al ong with the status flags affected by each instruction. most word or byte-orient ed w register instructions (including barrel shift instructions) have three operands: ? the first source operand which is typically a register ?wb? without any address modifier ? the second source operand which is typically a register ?ws? with or wi thout an address modifier ? the destination of the result which is typically a register ?wd? with or wi thout an address modifier however, word or byte-oriented file register instructions have two operands: ? the file register spec ified by the value ?f? ? the destination, which could either be the file register ?f? or the w0 register, which is denoted as ?wreg? most bit-oriented instructions (including simple rotate/ shift instructions) have two operands: ? the w register (with or without an address modifier) or file register (specified by the value of ?ws? or ?f?) ? the bit in the w register or file register (specified by a literal value or indirectly by the contents of register ?wb?) the literal instructions that involve data movement may use some of the following operands: ? a literal value to be loaded into a w register or file register (specified by the value of ?k?) ? the w register or file register where the literal value is to be loaded (s pecified by ?wb? or ?f?) however, literal instructions that involve arithmetic or logical operations use some of the following operands: ? the first source operand which is a register ?wb? without any address modifier ? the second source oper and which is a literal value ? the destination of the resu lt (only if not the same as the first source opera nd) which is typically a register ?wd? with or wi thout an address modifier the mac class of dsp instructions may use some of the following operands: ? the accumulator (a or b) to be used (required operand) ? the w registers to be used as the two operands ? the x and y address space pre-fetch operations ? the x and y address space pre-fetch destinations ? the accumulator write back destination the other dsp instructions do not involve any multiplication, and may include: ? the accumulator to be used (required) ? the source or destinati on operand (designated as wso or wdo, respectively) with or without an address modifier ? the amount of shift specif ied by a w register ?wn? or a literal value the control instructions may use some of the following operands: ? a program memory address ? the mode of the table read and table write instructions note: this data sheet summarizes features of this group of dspic30f devices and is not intended to be a complete reference source. for more information on the cpu, peripherals, register descr iptions and general device functionality, refer to the dspic30f family reference manual (ds70046). for more information on the device instruction set and programming, refer to the dspic30f programmer?s reference manual (ds70030). dspic30f2011/2012/3012/3013 ds70139c-page 132 preliminary ? 2005 microchip technology inc. all instructions are a single word, except for certain double-word instructions, which were made double- word instructions so that all the required information is available in these 48 bits. in the second word, the 8 msbs are ? 0 ?s. if this second word is executed as an instruction (by itself), it will execute as a nop . most single word instructio ns are executed in a single instruction cycle, unless a condi tional test is true or the program counter is changed as a result of the instruc- tion. in these cases, the ex ecution takes two instruction cycles with the additional instruction cycle(s) executed as a nop . notable exceptions are the bra (uncondi- tional/computed branch), indirect call/goto , all table reads and writes, and return/retfie instructions, which are single word instruct ions but take two or three cycles. certain instructions that involve skipping over the subsequent instruction require either two or three cycles if the skip is perfo rmed, depending on whether the instruction being skipped is a single word or two- word instruction. moreover, double-word moves require two cycles. the double-word instructions execute in two instruction cycles. note: for more details on the instruction set, refer to the programmer?s reference manual. table 18-1: symbols used in opcode descriptions field description #text means literal defined by ? text ? (text) means ?content of text ? [text] means ?the location addressed by text ? { } optional field or operation ? 2005 microchip technology inc. preliminary ds70139c-page 133 dspic30f2011/2012/3012/3013 wb base w register {w0..w15} wd destination w register { wd, [wd], [wd++], [wd--], [++wd], [--wd] } wdo destination w register { wnd, [wnd], [wnd++], [wnd--] , [++wnd], [--wnd], [wnd+wb] } wm,wn dividend, divisor working register pair (direct addressing) wm*wm multiplicand and multip lier working register pair for square instructions {w4*w4,w5*w5,w6*w6,w7*w7} wm*wn multiplicand and mult iplier working register pair for dsp instructions {w4*w5,w4*w6,w4*w7,w5*w6,w5*w7,w6*w7} wn one of 16 working registers {w0..w15} wnd one of 16 destination working registers {w0..w15} wns one of 16 source working registers {w0..w15} wreg w0 (working register used in file register instructions) ws source w register { ws, [ws], [ws++], [ws --], [++ws], [--ws] } wso source w register { wns, [wns], [wns++], [wns--], [++wns], [--wns], [wns+wb] } wx x data space pre-fetch address register for dsp instructions {[w8]+=6, [w8]+=4, [w8]+=2, [w8], [w8]-=6, [w8]-=4, [w8]-=2, [w9]+=6, [w9]+=4, [w9]+=2, [w9], [w9]-=6, [w9]-=4, [w9]-=2, [w9+w12],none} wxd x data space pre-fetch destinati on register for dsp instructions {w4..w7} wy y data space pre-fetch address register for dsp instructions {[w10]+=6, [w10]+=4, [w10]+=2, [w 10], [w10]-=6, [w10]-=4, [w10]-=2, [w11]+=6, [w11]+=4, [w11]+=2, [w11], [w11]-=6, [w11]-=4, [w11]-=2, [w11+w12], none} wyd y data space pre-fetch destinati on register for dsp instructions {w4..w7} table 18-1: symbols used in opcode descriptions (continued) field description dspic30f2011/2012/3012/3013 ds70139c-page 134 preliminary ? 2005 microchip technology inc. table 18-2: instruction set overview base instr # assembly mnemonic assembly syntax description # of words # of cycles status flags affected 1 add add acc add accumulators 1 1 oa,ob,sa,sb add f f = f + wreg 1 1 c,dc,n,ov,z add f,wreg wreg = f + wreg 1 1 c,dc,n,ov,z add #lit10,wn wd = lit10 + wd 1 1 c,dc,n,ov,z add wb,ws,wd wd = wb + ws 1 1 c,dc,n,ov,z add wb,#lit5,wd wd = wb + lit5 1 1 c,dc,n,ov,z add wso,#slit4,acc 16-bit signed a dd to accumulator 1 1 oa,ob,sa,sb 2 addc addc f f = f + wreg + (c) 1 1 c,dc,n,ov,z addc f,wreg wreg = f + wreg + (c) 1 1 c,dc,n,ov,z addc #lit10,wn wd = lit10 + wd + (c) 1 1 c,dc,n,ov,z addc wb,ws,wd wd = wb + ws + (c) 1 1 c,dc,n,ov,z addc wb,#lit5,wd wd = wb + lit5 + (c) 1 1 c,dc,n,ov,z 3 and and f f = f .and. wreg 1 1 n,z and f,wreg wreg = f .and. wreg 1 1 n,z and #lit10,wn wd = lit10 .and. wd 1 1 n,z and wb,ws,wd wd = wb .and. ws 1 1 n,z and wb,#lit5,wd wd = wb .and. lit5 1 1 n,z 4 asr asr f f = arithmetic right shift f 1 1 c,n,ov,z asr f,wreg wreg = arithmetic right shift f 1 1 c,n,ov,z asr ws,wd wd = arithmetic right shift ws 1 1 c,n,ov,z asr wb,wns,wnd wnd = arithmetic right shift wb by wns 1 1 n,z asr wb,#lit5,wnd wnd = arithmetic right shift wb by lit5 1 1 n,z 5 bclr bclr f,#bit4 bit clear f 1 1 none bclr ws,#bit4 bit clear ws 1 1 none 6 bra bra c,expr branch if carry 1 1 (2) none bra ge,expr branch if greater than or equal 1 1 (2) none bra geu,expr branch if unsigned greater than or equal 1 1 (2) none bra gt,expr branch if greater than 1 1 (2) none bra gtu,expr branch if unsigned greater than 1 1 (2) none bra le,expr branch if less than or equal 1 1 (2) none bra leu,expr branch if unsigned less than or equal 1 1 (2) none bra lt,expr branch if less than 1 1 (2) none bra ltu,expr branch if unsigned less than 1 1 (2) none bra n,expr branch if negative 1 1 (2) none bra nc,expr branch if not carry 1 1 (2) none bra nn,expr branch if not negative 1 1 (2) none bra nov,expr branch if not overflow 1 1 (2) none bra nz,expr branch if not zero 1 1 (2) none bra oa,expr branch if accumulator a overflow 1 1 (2) none bra ob,expr branch if accumulator b overflow 1 1 (2) none bra ov,expr branch if overflow 1 1 (2) none bra sa,expr branch if accumulator a saturated 1 1 (2) none bra sb,expr branch if accumulator b saturated 1 1 (2) none bra expr branch unconditionally 1 2 none bra z,expr branch if zero 1 1 (2) none bra wn computed branch 1 2 none 7 bset bset f,#bit4 bit set f 1 1 none bset ws,#bit4 bit set ws 1 1 none 8 bsw bsw.c ws,wb write c bit to ws ? 2005 microchip technology inc. preliminary ds70139c-page 135 dspic30f2011/2012/3012/3013 9 btg btg f,#bit4 bit toggle f 1 1 none btg ws,#bit4 bit toggle ws 1 1 none 10 btsc btsc f,#bit4 bit test f, skip if clear 1 1 (2 or 3) none btsc ws,#bit4 bit test ws, skip if clear 1 1 (2 or 3) none 11 btss btss f,#bit4 bit test f, skip if set 1 1 (2 or 3) none btss ws,#bit4 bit test ws, skip if set 1 1 (2 or 3) none 12 btst btst f,#bit4 bit test f 1 1 z btst.c ws,#bit4 bit test ws to c 1 1 c btst.z ws,#bit4 bit test ws to z 1 1 z btst.c ws,wb bit test ws dspic30f2011/2012/3012/3013 ds70139c-page 136 preliminary ? 2005 microchip technology inc. 29 disi disi #lit14 disable interrupt s for k instruction cycles 1 1 none 30 div div.s wm,wn signed 16/16-bit integer divide 1 18 n,z,c,ov div.sd wm,wn signed 32/16-bit integer divide 1 18 n,z,c,ov div.u wm,wn unsigned 16/16-bit integer divide 1 18 n,z,c,ov div.ud wm,wn unsigned 32/16-bit integer divide 1 18 n,z,c,ov 31 divf divf wm,wn si gned 16/16-bit fractional divide 1 18 n,z,c,ov 32 do do #lit14,expr do code to pc+expr, lit14+1 times 2 2 none do wn,expr do code to pc+expr, (wn)+1 times 2 2 none 33 ed ed wm*wm,acc,wx,wy,wxd euclidean di stance (no accumulate) 1 1 oa,ob,oab, sa,sb,sab 34 edac edac wm*wm,acc,wx,wy,wxd euclidean distance 1 1 oa,ob,oab, sa,sb,sab 35 exch exch wns,wnd swap wns with wnd 1 1 none 36 fbcl fbcl ws,wnd find bit change from left (msb) side 1 1 c 37 ff1l ff1l ws,wnd find first o ne from left (msb) side 1 1 c 38 ff1r ff1r ws,wnd find first one from right (lsb) side 1 1 c 39 goto goto expr go to address 2 2 none goto wn go to indirect 1 2 none 40 inc inc f f = f + 1 1 1 c,dc,n,ov,z inc f,wreg wreg = f + 1 1 1 c,dc,n,ov,z inc ws,wd wd = ws + 1 1 1 c,dc,n,ov,z 41 inc2 inc2 f f = f + 2 1 1 c,dc,n,ov,z inc2 f,wreg wreg = f + 2 1 1 c,dc,n,ov,z inc2 ws,wd wd = ws + 2 1 1 c,dc,n,ov,z 42 ior ior f f = f .ior. wreg 1 1 n,z ior f,wreg wreg = f .ior. wreg 1 1 n,z ior #lit10,wn wd = lit10 .ior. wd 1 1 n,z ior wb,ws,wd wd = wb .ior. ws 1 1 n,z ior wb,#lit5,wd wd = wb .ior. lit5 1 1 n,z 43 lac lac wso,#slit4,acc load accumulator 1 1 oa,ob,oab, sa,sb,sab 44 lnk lnk #lit14 link frame pointer 1 1 none 45 lsr lsr f f = logical right shift f 1 1 c,n,ov,z lsr f,wreg wreg = logical right shift f 1 1 c,n,ov,z lsr ws,wd wd = logical right shift ws 1 1 c,n,ov,z lsr wb,wns,wnd wnd = logical right shift wb by wns 1 1 n,z lsr wb,#lit5,wnd wnd = logical ri ght shift wb by lit5 1 1 n,z 46 mac mac wm*wn,acc,wx,wxd,wy,wyd, awb multiply and accumulate 1 1 oa,ob,oab, sa,sb,sab mac wm*wm,acc,wx,wxd,wy,wyd square and accumulate 1 1 oa,ob,oab, sa,sb,sab 47 mov mov f,wn move f to wn 1 1 none mov f move f to f 1 1 n,z mov f,wreg move f to wreg 1 1 n,z mov #lit16,wn move 16-bit literal to wn 1 1 none mov.b #lit8,wn move 8-bit literal to wn 1 1 none mov wn,f move wn to f 1 1 none mov wso,wdo move ws to wd 1 1 none mov wreg,f move wreg to f 1 1 n,z mov.d wns,wd move doubl e from w(ns):w(ns+1) to wd 1 2 none mov.d ws,wnd move double from ws to w(nd+1):w(nd) 1 2 none 48 movsac movsac acc,wx,wxd,wy,wyd,awb pre-fetch and store accumulator 1 1 none table 18-2: instruction set overview (continued) base instr # assembly mnemonic assembly syntax description # of words # of cycles status flags affected ? 2005 microchip technology inc. preliminary ds70139c-page 137 dspic30f2011/2012/3012/3013 49 mpy mpy wm*wn, acc,wx,wxd,wy,wyd multiply wm by wn to accumulator 1 1 oa,ob,oab, sa,sb,sab mpy wm*wm, acc,wx,wxd,wy,wyd square wm to accumulator 1 1 oa,ob,oab, sa,sb,sab 50 mpy.n mpy.n wm*wn,acc,wx,wxd,wy,wy d -(multiply wm by wn) to accumulator 1 1 none 51 msc msc wm*wm,acc,wx,wxd,wy,wyd, awb multiply and subtract from accumulator 1 1 oa,ob,oab, sa,sb,sab 52 mul mul.ss wb,ws,wnd {wnd+1, wnd} = signed(wb) * signed(ws) 1 1 none mul.su wb,ws,wnd {wnd+1, wnd} = signed(wb) * unsigned(ws) 1 1 none mul.us wb,ws,wnd {wnd+1, wnd} = unsigned(wb) * signed(ws) 1 1 none mul.uu wb,ws,wnd {wnd+1, wnd} = unsigned(wb) * unsigned(ws) 1 1 none mul.su wb,#lit5,wnd {wnd+1, wnd} = signed(wb) * unsigned(lit5) 1 1 none mul.uu wb,#lit5,wnd {wnd+1, wnd} = unsigned(wb) * unsigned(lit5) 1 1 none mul f w3:w2 = f * wreg 1 1 none 53 neg neg acc negate accumulator 1 1 oa,ob,oab, sa,sb,sab neg f f = f + 1 1 1 c,dc,n,ov,z neg f,wreg wreg = f + 1 1 1 c,dc,n,ov,z neg ws,wd wd = ws + 1 1 1 c,dc,n,ov,z 54 nop nop no operation 1 1 none nopr no operation 1 1 none 55 pop pop f pop f from top-of-stack (tos) 1 1 none pop wdo pop from top-of-stack (tos) to wdo 1 1 none pop.d wnd pop from top-of-stack (tos) to w(nd):w(nd+1) 1 2 none pop.s pop shadow registers 1 1 all 56 push push f push f to top-of-stack (tos) 1 1 none push wso push wso to top-of-stack (tos) 1 1 none push.d wns push w(ns):w(ns+1) to top-of-stack (tos) 1 2 none push.s push shadow registers 1 1 none 57 pwrsav pwrsav #lit1 go into sleep or idle mode 1 1 wdto,sleep 58 rcall rcall expr relative call 1 2 none rcall wn computed call 1 2 none 59 repeat repeat #lit14 repeat next instruction lit14+1 times 1 1 none repeat wn repeat next instru ction (wn)+1 times 1 1 none 60 reset reset software device reset 1 1 none 61 retfie retfie return from interrupt 1 3 (2) none 62 retlw retlw #lit10,wn return with literal in wn 1 3 (2) none 63 return return return from subroutine 1 3 (2) none 64 rlc rlc f f = rotate left through carry f 1 1 c,n,z rlc f,wreg wreg = rotate left through carry f 1 1 c,n,z rlc ws,wd wd = rotate left through carry ws 1 1 c,n,z 65 rlnc rlnc f f = rotate left (no carry) f 1 1 n,z rlnc f,wreg wreg = rotate left (no carry) f 1 1 n,z rlnc ws,wd wd = rotate left (no carry) ws 1 1 n,z 66 rrc rrc f f = rotate right through carry f 1 1 c,n,z rrc f,wreg wreg = rotate right through carry f 1 1 c,n,z rrc ws,wd wd = rotate right through carry ws 1 1 c,n,z 67 rrnc rrnc f f = rotate right (no carry) f 1 1 n,z rrnc f,wreg wreg = rotate right (no carry) f 1 1 n,z rrnc ws,wd wd = rotate right (no carry) ws 1 1 n,z table 18-2: instruction set overview (continued) base instr # assembly mnemonic assembly syntax description # of words # of cycles status flags affected dspic30f2011/2012/3012/3013 ds70139c-page 138 preliminary ? 2005 microchip technology inc. 68 sac sac acc,#slit4,wdo store accumulator 1 1 none sac.r acc,#slit4,wdo store rounded accumulator 1 1 none 69 se se ws,wnd wnd = sign-extended ws 1 1 c,n,z 70 setm setm f f = 0xffff 1 1 none setm wreg wreg = 0xffff 1 1 none setm ws ws = 0xffff 1 1 none 71 sftac sftac acc,wn arithmetic shift accumulator by (wn) 1 1 oa,ob,oab, sa,sb,sab sftac acc,#slit6 arithmetic shift ac cumulator by slit6 1 1 oa,ob,oab, sa,sb,sab 72 sl sl f f = left shift f 1 1 c,n,ov,z sl f,wreg wreg = left shift f 1 1 c,n,ov,z sl ws,wd wd = left shift ws 1 1 c,n,ov,z sl wb,wns,wnd wnd = left shift wb by wns 1 1 n,z sl wb,#lit5,wnd wnd = left shift wb by lit5 1 1 n,z 73 sub sub acc subtract accumulators 1 1 oa,ob,oab, sa,sb,sab sub f f = f - wreg 1 1 c,dc,n,ov,z sub f,wreg wreg = f - wreg 1 1 c,dc,n,ov,z sub #lit10,wn wn = wn - lit10 1 1 c,dc,n,ov,z sub wb,ws,wd wd = wb - ws 1 1 c,dc,n,ov,z sub wb,#lit5,wd wd = wb - lit5 1 1 c,dc,n,ov,z 74 subb subb f f = f - wreg - (c ) 1 1 c,dc,n,ov,z subb f,wreg wreg = f - wreg - (c ) 1 1 c,dc,n,ov,z subb #lit10,wn wn = wn - lit10 - (c ) 1 1 c,dc,n,ov,z subb wb,ws,wd wd = wb - ws - (c ) 1 1 c,dc,n,ov,z subb wb,#lit5,wd wd = wb - lit5 - (c ) 1 1 c,dc,n,ov,z 75 subr subr f f = wreg - f 1 1 c,dc,n,ov,z subr f,wreg wreg = wreg - f 1 1 c,dc,n,ov,z subr wb,ws,wd wd = ws - wb 1 1 c,dc,n,ov,z subr wb,#lit5,wd wd = lit5 - wb 1 1 c,dc,n,ov,z 76 subbr subbr f f = wreg - f - (c ) 1 1 c,dc,n,ov,z subbr f,wreg wreg = wreg -f - (c ) 1 1 c,dc,n,ov,z subbr wb,ws,wd wd = ws - wb - (c ) 1 1 c,dc,n,ov,z subbr wb,#lit5,wd wd = lit5 - wb - (c ) 1 1 c,dc,n,ov,z 77 swap swap.b wn wn = nibble swap wn 1 1 none swap wn wn = byte swap wn 1 1 none 78 tblrdh tblrdh ws,wd read prog<23:16> to wd<7:0> 1 2 none 79 tblrdl tblrdl ws,wd read prog<15:0> to wd 1 2 none 80 tblwth tblwth ws,wd write ws<7:0> to prog<23:16> 1 2 none 81 tblwtl tblwtl ws,wd write ws to prog<15:0> 1 2 none 82 ulnk ulnk unlink frame pointer 1 1 none 83 xor xor f f = f .xor. wreg 1 1 n,z xor f,wreg wreg = f .xor. wreg 1 1 n,z xor #lit10,wn wd = lit10 .xor. wd 1 1 n,z xor wb,ws,wd wd = wb .xor. ws 1 1 n,z xor wb,#lit5,wd wd = wb .xor. lit5 1 1 n,z 84 ze ze ws,wnd wnd = zero-extend ws 1 1 c,z,n table 18-2: instruction set overview (continued) base instr # assembly mnemonic assembly syntax description # of words # of cycles status flags affected ? 2005 microchip technology inc. preliminary ds70139c-page 139 dspic30f2011/2012/3012/3013 19.0 development support the picmicro ? microcontrollers are supported with a full range of hardware an d software development tools: ? integrated development environment - mplab ? ide software ? assemblers/compilers/linkers -mpasm ? assembler - mplab c17 and mplab c18 c compilers -mplink ? object linker/ mplib ? object librarian - mplab c30 c compiler - mplab asm30 assembler/linker/library ? simulators - mplab sim software simulator - mplab dspic30 software simulator ?emulators - mplab ice 2000 in-circuit emulator - mplab ice 4000 in-circuit emulator ? in-circuit debugger - mplab icd 2 ? device programmers -pro mate ? ii universal device program- mer - picstart ? plus development programmer ? low-cost demonstration boards - picdem ? 1 demonstration board - picdem.net ? demonstration board - picdem 2 plus demonstration board - picdem 3 demonstration board - picdem 4 demonstration board - picdem 17 demonstration board - picdem 18r demonstration board - picdem lin demonstration board - picdem usb demonstration board ?evaluation kits -k ee l oq ? - picdem msc -microid ? -can - powersmart ? -analog 19.1 mplab integrated development environment software the mplab ide software brings an ease of software development previously unse en in the 8/16-bit micro- controller market. the mplab ide is a windows ? based application that contains: ? an interface to debugging tools - simulator - programmer (sold separately) - emulator (sold separately) - in-circuit debugger (sold separately) ? a full-featured editor with color coded context ? a multiple project manager ? customizable data windows with direct edit of contents ? high-level source code debugging ? mouse over variable inspection ? extensive on-line help the mplab ide allows you to: ? edit your source files (either assembly or c) ? one touch assemble (or compile) and download to picmicro emulator and simulator tools (automatically updates all project information) ? debug using: - source files (assembly or c) - absolute listing file (mixed assembly and c) - machine code mplab ide supports multiple debugging tools in a single development paradigm, from the cost effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. th is eliminates the learning curve when upgrading to tools with increasing flexibility and power. 19.2 mpasm assembler the mpasm assembler is a full-featured, universal macro assembler for all picmicro mcus. the mpasm assembler generates relocatable object files for the mplink object linker, intel ? standard hex files, map files to detail memory usage and symbol ref- erence, absolute lst files th at contain source lines and generated machine code and coff files for debugging. the mpasm assembler features include: ? integration into mplab ide projects ? user defined macros to streamline assembly code ? conditional assembly for multi-purpose source files ? directives that allow complete control over the assembly process dspic30f2011/2012/3012/3013 ds70139c-page 140 preliminary ? 2005 microchip technology inc. 19.3 mplab c17 and mplab c18 c compilers the mplab c17 and mplab c18 code development systems are complete ansi c compilers for microchip?s pic17cxxx and pic18cxxx family of microcontrollers. these compilers provide powerful integration capabilities, superior code optimization and ease of use not found with other compilers. for easy source level debug ging, the compilers provide symbol information that is optimized to the mplab ide debugger. 19.4 mplink object linker/ mplib object librarian the mplink object linker combines relocatable objects created by the mpasm assembler and the mplab c17 and mplab c18 c compilers. it can link relocatable objects from pr ecompiled libraries, using directives from a linker script. the mplib object librarian manages the creation and modification of library file s of precompiled code. when a routine from a library is ca lled from a source file, only the modules that contain that routine will be linked in with the application. this allows large libraries to be used efficiently in many different applications. the object linker/library features include: ? efficient linking of single libraries instead of many smaller files ? enhanced code maintainability by grouping related modules together ? flexible creation of libra ries with easy module listing, replacement, deletion and extraction 19.5 mplab c30 c compiler the mplab c30 c compiler is a full-featured, ansi compliant, optimizing compil er that translates standard ansi c programs into dspic30f assembly language source. the compiler also supports many command line options and language extensions to take full advantage of the dspic30f device hardware capabili- ties and afford fine control of the compiler code generator. mplab c30 is distributed wi th a complete ansi c standard library. all library functions have been vali- dated and conform to the an si c library standard. the library includes functions for string manipulation, dynamic memory allocation, data conversion, time- keeping and math functions (trigonometric, exponential and hyperbolic). the comp iler provides symbolic information for high-level source debugging with the mplab ide. 19.6 mplab asm30 assembler, linker and librarian mplab asm30 assembler produces relocatable machine code from symbol ic assembly language for dspic30f devices. mplab c30 compiler uses the assembler to produce it?s object file. the assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. notable features of the assembler include: ? support for the entire ds pic30f instruction set ? support for fixed-point and floating-point data ? command line interface ? rich directive set ? flexible macro language ? mplab ide compatibility 19.7 mplab sim software simulator the mplab sim software simu lator allows code devel- opment in a pc hosted environment by simulating the picmicro series microcontrollers on an instruction level. on any given instruction, the data areas can be examined or modified and st imuli can be applied from a file, or user defined key pr ess, to any pin. the execu- tion can be performed in single-step, execute until break or trace mode. the mplab sim simulator fully supports symbolic debugging using the mplab c17 and mplab c18 c compilers, as well as th e mpasm assembler. the software simulator offers t he flexibility to develop and debug code outside of the laboratory environment, making it an excellent, economical software development tool. 19.8 mplab sim30 software simulator the mplab sim30 software simulator allows code development in a pc hosted environment by simulating the dspic30f series microcon trollers on an instruction level. on any given instruction, the data areas can be examined or modified and st imuli can be applied from a file, or user defined key press, to any of the pins. the mplab sim30 simulator fully supports symbolic debugging using the mplab c30 c compiler and mplab asm30 assembler. the simulator runs in either a command line mode for au tomated tasks, or from mplab ide. this high-speed simulator is designed to debug, analyze and optimize time intensive dsp routines. ? 2005 microchip technology inc. preliminary ds70139c-page 141 dspic30f2011/2012/3012/3013 19.9 mplab ice 2000 high-performance universal in-circuit emulator the mplab ice 2000 universal in-circuit emulator is intended to provide the pr oduct development engineer with a complete microcont roller design tool set for picmicro microcontrollers. software control of the mplab ice 2000 in-circuit emulator is advanced by the mplab integrated development environment, which allows editing, building, downloading and source debugging from a single environment. the mplab ice 2000 is a full-featured emulator sys- tem with enhanced trace, tr igger and data monitoring features. interchangeable pr ocessor modules allow the system to be easily reconfigur ed for emulation of differ- ent processors. the universal architecture of the mplab ice in-circuit emulator allows expansion to support new picmicro microcontrollers. the mplab ice 2000 in-circu it emulator system has been designed as a real-t ime emulation system with advanced features that are typically found on more expensive development tool s. the pc platform and microsoft ? windows 32-bit operating system were chosen to best make these features available in a simple, unified application. 19.10 mplab ice 4000 high-performance universal in-circuit emulator the mplab ice 4000 universal in-circuit emulator is intended to provide the pr oduct development engineer with a complete microcontrol ler design tool set for high- end picmicro microcontrollers. software control of the mplab ice in-circuit emulator is provided by the mplab integrated development environment, which allows editing, building, downloading and source debugging from a single environment. the mplab icd 4000 is a premium emulator system, providing the features of mplab ice 2000, but with increased emulation memory and high-speed perfor- mance for dspic30f and pic18xxxx devices. its advanced emulator features include complex triggering and timing, up to 2 mb of emulation memory and the ability to view variables in real-time. the mplab ice 4000 in-circu it emulator system has been designed as a real-t ime emulation system with advanced features that are typically found on more expensive development tool s. the pc platform and microsoft windows 32-bit operating system were chosen to best make these features available in a simple, unified application. 19.11 mplab icd 2 in-circuit debugger microchip?s in-circuit debugger, mplab icd 2, is a powerful, low-cost, run- time development tool, connecting to the host pc vi a an rs-232 or high-speed usb interface. this tool is based on the flash picmicro mcus and can be used to develop for these and other picmicro micr ocontrollers. the mplab icd 2 utilizes the in-circuit debugging capability built into the flash devices. this feature, along with microchip?s in-circuit serial programming ? (icsp ? ) protocol, offers cost effective in-circuit flash debugging from the graphical user interface of the mplab integrated development environment. this enables a designer to develop and debu g source code by setting breakpoints, single-stepping and watching variables, cpu status and peripheral re gisters. running at full speed enables testing hardw are and applications in real-time. mplab icd 2 also serves as a development programmer for select ed picmicro devices. 19.12 pro mate ii universal device programmer the pro mate ii is a univer sal, ce compliant device programmer with programmabl e voltage verification at v ddmin and v ddmax for maximum reliability. it features an lcd display for instruct ions and error messages and a modular detachable sock et assembly to support various package types. in stand-alone mode, the pro mate ii device programme r can read, verify and program picmicro devices wi thout a pc connection. it can also set code protection in this mode. 19.13 picstart plus development programmer the picstart plus development programmer is an easy-to-use, low-cost, prot otype programmer. it con- nects to the pc via a com (rs-232) port. mplab integrated development environment software makes using the programmer simple and efficient. the picstart plus development programmer supports most picmicro devices up to 40 pins. larger pin count devices, such as the pic16c92x and pic17c76x, may be supported with an adapter socket. the picstart plus development programmer is ce compliant. dspic30f2011/2012/3012/3013 ds70139c-page 142 preliminary ? 2005 microchip technology inc. 19.14 picdem 1 picmicro demonstration board the picdem 1 demonstration board demonstrates the capabilities of the pic16c5x (pic16c54 to pic16c58a), pic16c61, pic16c62x, pic16c71, pic16c8x, pic17c42, pic17c43 and pic17c44. all necessary hardware and soft ware is included to run basic demo programs. th e sample microcontrollers provided with the picdem 1 demonstration board can be programmed with a pro mate ii device program- mer or a picstart plus development programmer. the picdem 1 demonstration board can be connected to the mplab ice in-circuit emulator for testing. a prototype area extends the ci rcuitry for additional appli- cation components. features include an rs-232 interface, a potentiometer for simulated analog input, push button switches and eight leds. 19.15 picdem.net internet/ethernet demonstration board the picdem.net demonstratio n board is an internet/ ethernet demonstration board using the pic18f452 microcontroller and tcp/ip firmware. the board supports any 40-pin dip dev ice that conforms to the standard pinout used by the pic16f877 or pic18c452. this kit features a user friendly tcp/ip stack, web server with html, a 24l256 serial eeprom for xmodem download to web pages into serial eeprom, icsp/mplab icd 2 interface con- nector, an ethernet interface, rs-232 interface and a 16 x 2 lcd display. also included is the book and cd-rom ?tcp/ip lean, web servers for embedded systems,? by jeremy bentham 19.16 picdem 2 plus demonstration board the picdem 2 plus demonstration board supports many 18, 28 and 40-pin microcontrollers, including pic16f87x and pic18fxx2 devices. all the neces- sary hardware and software is included to run the dem- onstration programs. th e sample microcontrollers provided with the picdem 2 demonstration board can be programmed with a pro mate ii device program- mer, picstart plus development programmer, or mplab icd 2 with a univ ersal programmer adapter. the mplab icd 2 and mplab ice in-circuit emulators may also be used with the picdem 2 demonstration board to test firmware. a prototype area extends the circuitry for additional a pplication components. some of the features include an rs-232 interface, a 2 x 16 lcd display, a piezo speaker, an on-board temperature sensor, four leds and sample pic18f452 and pic16f877 flash microcontrollers. 19.17 picdem 3 pic16c92x demonstration board the picdem 3 demonstrat ion board supports the pic16c923 and pic16c924 in the plcc package. all the necessary hardware and software is included to run the demonstration programs. 19.18 picdem 4 8/14/18-pin demonstration board the picdem 4 can be used to demonstrate the capa- bilities of the 8, 14 and 18-pin pic16xxxx and pic18xxxx mcus, including the pic16f818/819, pic16f87/88, pic16f62xa and the pic18f1320 family of microcontrollers . picdem 4 is intended to showcase the many features of these low pin count parts, including lin and motor control using eccp. special provisions are ma de for low-power operation with the supercapacitor circ uit and jumpers allow on- board hardware to be disa bled to eliminate current draw in this mode. included on the demo board are pro- visions for crystal, rc or canned oscillator modes, a five volt regulator for use wi th a nine volt wall adapter or battery, db-9 rs-232 interface, icd connector for programming via icsp and development with mplab icd 2, 2 x 16 liquid crystal display, pcb footprints for h-bridge motor driver, li n transceiver and eeprom. also included are: header for expansion, eight leds, four potentiometers, three push buttons and a proto- typing area. included with th e kit is a pic16f627a and a pic18f1320. tutorial firmwa re is included along with the user?s guide. 19.19 picdem 17 demonstration board the picdem 17 demonstratio n board is an evaluation board that demonstrates the capabilities of several microchip microcontrolle rs, including pic17c752, pic17c756a, pic17c762 and pic17c766. a pro- grammed sample is includ ed. the pro mate ii device programmer, or the picstart plus development pro- grammer, can be used to re program the device for user tailored application development. the picdem 17 demonstration board suppor ts program download and execution from external on-board flash memory. a generous prototype area is available for user hardware expansion. ? 2005 microchip technology inc. preliminary ds70139c-page 143 dspic30f2011/2012/3012/3013 19.20 picdem 18r pic18c601/801 demonstration board the picdem 18r demonstration board serves to assist development of the pic18c601/801 family of microchip microcontrollers. it provides hardware implementation of both 8-bit multiplexed/demultiplexed and 16-bit memory modes. the board includes 2 mb external flash memory and 128 kb sram memory, as well as serial eeprom, allowing access to the wide range of memory types supported by the pic18c601/801. 19.21 picdem lin pic16c43x demonstration board the powerful lin hardware and software kit includes a series of boards and three picmicro microcontrollers. the small footprint pic16c432 and pic16c433 are used as slaves in the li n communication and feature on-board lin transceivers. a pic16f874 flash microcontroller serves as the master. all three micro- controllers are programmed with firmware to provide lin bus communication. 19.22 pickit? 1 flash starter kit a complete ?development sy stem in a box?, the pickit flash starter kit includes a convenient multi-section board for programming, eval uation and development of 8/14-pin flash pic ? microcontrollers. powered via usb, the board operates un der a simple windows gui. the pickit 1 starter kit includes the user?s guide (on cd rom), pickit 1 tutorial software and code for various applications. also included are mplab ? ide (integrated development environment) software, software and hardware ?tips 'n tricks for 8-pin flash pic ? microcontrollers? handbo ok and a usb interface cable. supports all current 8/14-pin flash pic microcontrollers, as well as many future planned devices. 19.23 picdem usb pic16c7x5 demonstration board the picdem usb demonstration board shows off the capabilities of the pic16c745 and pic16c765 usb microcontrollers. this boar d provides the basis for future usb products. 19.24 evaluation and programming tools in addition to the picdem series of circuits, microchip has a line of evaluation kits and demonstration software for these products. ?k ee l oq evaluation and prog ramming tools for microchip?s hcs secure data products ? can developers kit fo r automotive network applications ? analog design boards and filter design software ? powersmart battery charging evaluation/ calibration kits ?irda ? development kit ? microid development and rflab ? development software ? seeval ? designer kit for memory evaluation and endurance calculations ? picdem msc demo boards for switching mode power supply, high-power ir driver, delta sigma adc and flow rate sensor check the microchip web pa ge and the latest product selector guide for the comple te list of demonstration and evaluation kits. dspic30f2011/2012/3012/3013 ds70139c-page 144 preliminary ? 2005 microchip technology inc. notes: ? 2005 microchip technology inc. preliminary ds70139c-page 145 dspic30f2011/2012/3012/3013 20.0 electrical characteristics this section provides an overview of ds pic30f electrical characteri stics. additional informatio n will be provided in future revisions of this document as it becomes available. for detailed information about the dspic3 0f architecture and core, refer to dspic30f family reference manual (ds70046). absolute maximum ratings for the dspic30f family are listed below. exposure to these maximum rating conditions for extended periods may affect devic e reliability. functional operati on of the device at these or any other conditions above the parameters indicated in t he operation listings of this specification is not implied. absolute maximum ratings (?) ambient temperature under bias...... .............................................. ............................................. ............-40c to +125c storage temperature . ........................................ .................................. ................................. .................. -65c to +150c voltage on any pin with respect to v ss (except v dd and mclr ) (note 1) .................................... -0.3v to (v dd + 0.3v) voltage on v dd with respect to v ss ........................................ ........................................ ......................... -0.3v to +5.5v voltage on mclr with respect to v ss ...................................... ........................................ .......................... 0v to +13.25v maximum current out of v ss pin ................................... ............................................. ........................................... 300 ma maximum current into v dd pin (note 2) ......................................... ............................................. ..........................250 ma input clamp current, i ik (v i < 0 or v i > v dd ) ........................................ .............................................. ....................20 ma output clamp current, i ok (v o < 0 or v o > v dd ) ....................................... ........................................ .................... 20 ma maximum output current sunk by any i/o pin...................................... ............................. .................. .....................25 ma maximum output current sourced by any i/o pin ................................ ............................. ..................... ..................25 ma maximum current sunk by all ports .. .................................. ................................... ....................... .........................200 ma maximum current sourced by all ports (note 2) ........................................ ........................................ ....................200 ma note 1: voltage spikes below v ss at the mclr /v pp pin, inducing currents greater than 80 ma, may cause latchup. thus, a series re sistor of 50-100 should be used when applyi ng a ?low? level to the mclr /v pp pin, rather than pulling this pin directly to v ss . 2: maximum allowable current is a fu nction of device maximum power dissipation. see table 20-2 for p dmax . 20.1 dc characteristics ? notice: stresses above those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rati ng only and functional op eration of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. ex posure to maximum rating conditions for extended periods may affect device reliability. note: all peripheral electrical characteristics are spec ified. for exact periphera ls available on specific devices, please refer the the family cross reference table. table 20-1: operating mips vs. voltage v dd range temp range max mips dspic30fxxx-30i dspic30fxxx-20i dspic30fxxx-20e 4.5-5.5v -40c to 85c 30 20 ? 4.5-5.5v -40c to 125c ? ? 20 3.0-3.6v -40c to 85c 20 15 ? 3.0-3.6v -40c to 125c ? ? 15 2.5-3.0v -40c to 85c 10 7.5 ? dspic30f2011/2012/3012/3013 ds70139c-page 146 preliminary ? 2005 microchip technology inc. table 20-2: thermal operating conditions rating symbol min typ max unit dspic30f201x-30i dspic30f301x-30i operating junction temperature range t j -40 +125 c operating ambient temperature range t a -40 +85 c dspic30f201x-20i dspic30f301x-20i operating junction temperature range t j -40 +150 c operating ambient temperature range t a -40 +85 c dspic30f201x-20e dspic30f301x-20e operating junction temperature range t j -40 +150 c operating ambient temperature range t a -40 +125 c power dissipation: internal chip power dissipation: p d p int + p i / o w i/o pin power dissipation: maximum allowed power dissipation p dmax (t j - t a ) / ja w table 20-3: thermal pack aging characteristics characteristic symbol typ max unit notes package thermal resistance, 18-pin pdip (p) ja 44 ? c/w 1 package thermal resistance, 18-pin soic (so) ja 57 ? c/w 1 package thermal resistance, 28-pin spdip (sp) ja 42 ? c/w 1 package thermal resistance, 28-pin (soic) ja 49 ? c/w 1 package thermal resistance, 44-pin qfn ja 28 ? c/w 1 note 1: junction to ambient therma l resistance, theta-ja ( ja ) numbers are achieved by package simulations. table 20-4: dc temperature and voltage specifications dc characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min typ (1) max units conditions operating voltage (2) dc10 v dd supply voltage 2.5 ? 5.5 v industrial temperature dc11 v dd supply voltage 3.0 ? 5.5 v extended temperature dc12 v dr ram data retention voltage (3) ?1.5?v dc16 v por v dd start voltage (to ensure internal power-on reset signal) ?v ss ?v dc17 s vdd v dd rise rate (to ensure internal power-on reset signal) 0.05 v/ms 0-5v in 0.1 sec 0-3v in 60 ms note 1: ?typ? column data is at 5v, 25c unless otherwise stated. parameters are fo r design guidance only and are not tested. 2: these parameters are characterize d but not tested in manufacturing. 3: this is the limit to which v dd can be lowered without losing ram data. p int v dd i dd i oh ? () = p i / o v dd v oh ? {} i oh () v ol i ol () + = ? 2005 microchip technology inc. preliminary ds70139c-page 147 dspic30f2011/2012/3012/3013 table 20-5: dc characteristics: operating current (i dd ) dc characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended parameter no. typical (1) max units conditions operating current (i dd ) (2) dc20 ? ? ma -40c 3.3v 1 mips ec mode dc20a tbd ? ma 25c dc20b ? ? ma 85c dc20c ? ? ma 125c dc20d ? ? ma -40c 5v dc20e tbd ? ma 25c dc20f ? ? ma 85c dc20g ? ? ma 125c dc23 ? ? ma -40c 3.3v 4 mips ec mode, 4x pll dc23a tbd ? ma 25c dc23b ? ? ma 85c dc23c ? ? ma 125c dc23d ? ? ma -40c 5v dc23e tbd ? ma 25c dc23f ? ? ma 85c dc23g ? ? ma 125c dc24 ? ? ma -40c 3.3v 10 mips ec mode, 4x pll dc24a tbd ? ma 25c dc24b ? ? ma 85c dc24c ? ? ma 125c dc24d ? ? ma -40c 5v dc24e tbd ? ma 25c dc24f ? ? ma 85c dc24g ? ? ma 125c dc25 ? ? ma -40c 3v 8 mips ec mode, 8x pll dc25a tbd ? ma 25c dc25b ? ? ma 85c dc25c ? ? ma 125c dc25d ? ? ma -40c 5v dc25e tbd ? ma 25c dc25f ? ? ma 85c dc25g ? ? ma 125c note 1: data in ?typical? column is at 5v, 25c unless otherw ise stated. parameters are for design guidance only and are not tested. 2: the supply current is mainly a function of the operat ing voltage and frequency. other factors such as i/o pin loading and switching rate, oscillator type, inte rnal code execution pattern and temperature also have an impact on the current consumpt ion. the test conditions for all i dd measurements are as follows: osc1 driven with external square wave fr om rail to rail. all i/o pins are configured as inputs and pulled to v dd . mclr = v dd , wdt, fscm, lvd and bor are disabled. cpu, sram, program memory and data memory are operational. no per ipheral modules are operating. dspic30f2011/2012/3012/3013 ds70139c-page 148 preliminary ? 2005 microchip technology inc. dc27 ? ? ma -40c 3.3v 20 mips ec mode, 8x pll dc27a tbd ? ma 25c dc27b ? ? ma 85c dc27c ? ? ma -40c 5v dc27d tbd ? ma 25c dc27e ? ? ma 85c dc27f ? ? ma 125c dc28 ? ? ma -40c 3.3v 16 mips ec mode, 16x pll dc28a tbd ? ma 25c dc28b ? ? ma 85c dc28c ? ? ma -40c 5v dc28d tbd ? ma 25c dc28e ? ? ma 85c dc28f ? ? ma 125c dc29 ? ? ma -40c 5v 30 mips ec mode, 16x pll dc29a tbd ? ma 25c dc29b ? ? ma 85c dc29c ? ? ma 125c dc30 ? ? ma -40c 3.3v frc (~ 2 mips) dc30a tbd ? ma 25c dc30b ? ? ma 85c dc30c ? ? ma 125c dc30d ? ? ma -40c 5v dc30e tbd ? ma 25c dc30f ? ? ma 85c dc30g ? ? ma 125c dc31 ? ? ma -40c 3.3v lprc (~ 512 khz) dc31a tbd ? ma 25c dc31b ? ? ma 85c dc31c ? ? ma 125c dc31d ? ? ma -40c 5v dc31e tbd ? ma 25c dc31f ? ? ma 85c dc31g ? ? ma 125c table 20-5: dc characteristics: operating current (i dd ) (continued) dc characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended parameter no. typical (1) max units conditions operating current (i dd ) (2) note 1: data in ?typical? column is at 5v, 25c unless othe rwise stated. parameters ar e for design guidance only and are not tested. 2: the supply current is mainly a function of the operat ing voltage and frequency. other factors such as i/o pin loading and switching rate, oscill ator type, internal code execution pattern and temperature also have an impact on the current consumption. the test conditions for all i dd measurements are as follows: osc1 driven with external square wave from rail to rail. all i/o pins are co nfigured as inputs and pulled to v dd . mclr = v dd , wdt, fscm, lvd and bor are disabled. cpu, sram, program memory and data memory are operational. no per ipheral modules are operating. ? 2005 microchip technology inc. preliminary ds70139c-page 149 dspic30f2011/2012/3012/3013 table 20-6: dc characteristics: idle current (i idle ) dc characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended parameter no. typical (1) max units conditions idle current (i idle ): core off clock on base current (2) dc40 ? ? ma -40c 3.3v 1 mips ec mode dc40a tbd ? ma 25c dc40b ? ? ma 85c dc40c ? ? ma 125c dc40d ? ? ma -40c 5v dc40e tbd ? ma 25c dc40f ? ? ma 85c dc40g ? ? ma 125c dc43 ? ? ma -40c 3.3v 4 mips ec mode, 4x pll dc43a tbd ? ma 25c dc43b ? ? ma 85c dc43c ? ? ma 125c dc43d ? ? ma -40c 5v dc43e tbd ? ma 25c dc43f ? ? ma 85c dc43g ? ? ma 125c dc44 ? ? ma -40c 3.3v 10 mips ec mode, 4x pll dc44a tbd ? ma 25c dc44b ? ? ma 85c dc44c ? ? ma 125c dc44d ? ? ma -40c 5v dc44e tbd ? ma 25c dc44f ? ? ma 85c dc44g ? ? ma 125c dc45 ? ? ma -40c 3.3v 8 mips ec mode, 8x pll dc45a tbd ? ma 25c dc45b ? ? ma 85c dc45c ? ? ma 125c dc45d ? ? ma -40c 5v dc45e tbd ? ma 25c dc45f ? ? ma 85c dc45g ? ? ma 125c note 1: data in ?typical? column is at 5v, 25c unless otherw ise stated. parameters are for design guidance only and are not tested. 2: base i idle current is measured with core off, clock on an d all modules turned off. dspic30f2011/2012/3012/3013 ds70139c-page 150 preliminary ? 2005 microchip technology inc. dc47 ? ? ma -40c 3.3v 20 mips ec mode, 8x pll dc47a tbd ? ma 25c dc47b ? ? ma 85c dc47c ? ? ma -40c 5v dc47d tbd ? ma 25c dc47e ? ? ma 85c dc47f ? ? ma 125c dc48 ? ? ma -40c 3.3v 16 mips ec mode, 16x pll dc48a tbd ? ma 25c dc48b ? ? ma 85c dc48c ? ? ma -40c 5v dc48d tbd ? ma 25c dc48e ? ? ma 85c dc48f ? ? ma 125c dc49 ? ? ma -40c 5v 30 mips ec mode, 16x pll dc49a tbd ? ma 25c dc49b ? ? ma 85c dc49c ? ? ma 125c dc50 ? ? ma -40c 3.3v frc (~ 2 mips) dc50a tbd ? ma 25c dc50b ? ? ma 85c dc50c ? ? ma 125c dc50d ? ? ma -40c 5v dc50e tbd ? ma 25c dc50f ? ? ma 85c dc50g ? ? ma 125c dc51 ? ? ma -40c 3.3v lprc (~ 512 khz) dc51a tbd ? ma 25c dc51b ? ? ma 85c dc51c ? ? ma 125c dc51d ? ? ma -40c 5v dc51e tbd ? ma 25c dc51f ? ? ma 85c dc51g ? ? ma 125c table 20-6: dc characteristics: idle current (i idle ) (continued) dc characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended parameter no. typical (1) max units conditions idle current (i idle ): core off clock on base current (2) note 1: data in ?typical? column is at 5v, 25c unless othe rwise stated. parameters ar e for design guidance only and are not tested. 2: base i idle current is measured with core off, clock on and all modules turned off. ? 2005 microchip technology inc. preliminary ds70139c-page 151 dspic30f2011/2012/3012/3013 table 20-7: dc characteristics: power-down current (i pd ) dc characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended parameter no. typical (1) max units conditions power down current (i pd ) (2) dc60 ? ? a -40c 3.3v base power down current (3) dc60a tbd ? a25c dc60b ? ? a85c dc60c ? ? a 125c dc60d ? ? a -40c 5v dc60e tbd ? a25c dc60f ? ? a85c dc60g ? ? a 125c dc61 ? ? a -40c 3.3v watchdog timer current: i wdt (3) dc61a tbd ? a25c dc61b ? ? a85c dc61c ? ? a 125c dc61d ? ? a -40c 5v dc61e tbd ? a25c dc61f ? ? a85c dc61g ? ? a 125c dc62 ? ? a -40c 3.3v timer 1 w/32 khz crystal: i ti 32 (3) dc62a tbd ? a25c dc62b ? ? a85c dc62c ? ? a 125c dc62d ? ? a -40c 5v dc62e tbd ? a25c dc62f ? ? a85c dc62g ? ? a 125c dc63 ? ? a -40c 3.3v bor on: i bor (3) dc63a tbd ? a25c dc63b ? ? a85c dc63c ? ? a 125c dc63d ? ? a -40c 5v dc63e tbd ? a25c dc63f ? ? a85c dc63g ? ? a 125c note 1: data in the typical column is at 5v, 25c unless otherwise stated. paramete rs are for design guidance only and are not tested. 2: base i pd is measured with all peripheral s and clocks shut down. all i/os are configured as inputs and pulled high. lvd, bor, wdt, etc. are all switched off. 3: the current is the additional curr ent consumed when the module is enabled. this current should be added to the base i pd current. dspic30f2011/2012/3012/3013 ds70139c-page 152 preliminary ? 2005 microchip technology inc. dc66 ? ? a-40c 3.3v low voltage detect: i lvd (3) dc66a tbd ? a 25c dc66b ? ? a 85c dc66c ? ? a125c dc66d ? ? a-40c 5v dc66e tbd ? a 25c dc66f ? ? a 85c dc66g ? ? a125c table 20-7: dc characteristic s: power-down current (i pd ) (continued) dc characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended parameter no. typical (1) max units conditions power down current (i pd ) (2) note 1: data in the typical column is at 5v, 25c unless otherwise stated. parameters are fo r design guidance only and are not tested. 2: base i pd is measured with all peripher als and clocks shut down. all i/os are configured as inputs and pulled high. lvd, bor, wdt, etc. are all switched off. 3: the current is the additional curr ent consumed when the module is enabled. this current should be added to the base i pd current. ? 2005 microchip technology inc. preliminary ds70139c-page 153 dspic30f2011/2012/3012/3013 table 20-8: dc characteristics: i/o pin input specifications dc characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min typ (1) max units conditions v il input low voltage (2) di10 i/o pins: with schmitt trigger buffer v ss ?0.2v dd v di15 mclr v ss ?0.2v dd v di16 osc1 (in xt, hs and lp modes) v ss ?0.2v dd v di17 osc1 (in rc mode) (3) v ss ?0.3v dd v di18 sda, scl tbd ? tbd v sm bus disabled di19 sda, scl tbd ? tbd v sm bus enabled v ih input high voltage (2) di20 i/o pins: with schmitt trigger buffer 0.8 v dd ?v dd v di25 mclr 0.8 v dd ?v dd v di26 osc1 (in xt, hs and lp modes) 0.7 v dd ?v dd v di27 osc1 (in rc mode) (3) 0.9 v dd ?v dd v di28 sda, scl tbd ? tbd v sm bus disabled di29 sda, scl tbd ? tbd v sm bus enabled i cnpu cn xx pull-up current (2) di30 50 250 400 av dd = 5v, v pin = v ss di31 tbd tbd tbd av dd = 3v, v pin = v ss i il input leakage current (2)(4)(5) di50 i/o ports ? 0.01 1 av ss v pin v dd , pin at hi-impedance di51 analog input pins ? 0.50 ? av ss v pin v dd , pin at hi-impedance di55 mclr ?0.055 av ss v pin v dd di56 osc1 ? 0.05 5 av ss v pin v dd , xt, hs and lp osc mode note 1: data in ?typ? column is at 5v, 25c unless otherw ise stated. parameters are for design guidance only and are not tested. 2: these parameters are characterized but not tested in manufacturing. 3: in rc oscillator configuration, the osc1/clkl pin is a schmitt trigger input. it is not recommended that the dspic30f device be driven with an external clock while in rc mode. 4: the leakage current on the mclr pin is strongly depend ent on the applied voltage level. the specified levels represent normal oper ating conditions. higher leakage curren t may be measured at different input voltages. 5: negative current is defined as current sourced by the pin. dspic30f2011/2012/3012/3013 ds70139c-page 154 preliminary ? 2005 microchip technology inc. figure 20-1: low-voltage detect characteristics table 20-9: dc characteristics: i/o pin output specifications dc characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min typ (1) max units conditions v ol output low voltage (2) do10 i/o ports ? ? 0.6 v i ol = 8.5 ma, v dd = 5v ??tbdvi ol = 2.0 ma, v dd = 3v do16 osc2/clkout ? ? 0.6 v i ol = 1.6 ma, v dd = 5v (rc or ec osc mode) ? ? tbd v i ol = 2.0 ma, v dd = 3v v oh output high voltage (2) do20 i/o ports v dd ? 0.7 ? ? v i oh = -3.0 ma, v dd = 5v tbd ? ? v i oh = -2.0 ma, v dd = 3v do26 osc2/clkout v dd ? 0.7 ? ? v i oh = -1.3 ma, v dd = 5v (rc or ec osc mode) tbd ? ? v i oh = -2.0 ma, v dd = 3v capacitive loading specs on output pins (2) do50 c osc 2 osc2/sosc2 pin ? ? 15 pf in xtl, xt, hs and lp modes when external clock is used to drive osc1. do56 c io all i/o pins and osc2 ? ? 50 pf rc or ec osc mode do58 c b scl, sda ? ? 400 pf in i 2 c mode note 1: data in ?typ? column is at 5v, 25 c unless otherwise stated. paramete rs are for design guidance only and are not tested. 2: these parameters are characterized but not tested in manufacturing. lv10 lvdif v dd (lvdif set by hardware) ? 2005 microchip technology inc. preliminary ds70139c-page 155 dspic30f2011/2012/3012/3013 table 20-10: electrical characteristics: lvdl figure 20-2: brown-out reset characteristics dc characteristics standard operating condi tions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ max units conditions lv10 v plvd lvdl voltage on v dd transition high to low lvdl = 0000 (2) ???v lvdl = 0001 (2) ???v lvdl = 0010 (2) ???v lvdl = 0011 (2) ???v lvdl = 0100 2.50 ? 2.65 v lvdl = 0101 2.70 ? 2.86 v lvdl = 0110 2.80 ? 2.97 v lvdl = 0111 3.00 ? 3.18 v lvdl = 1000 3.30 ? 3.50 v lvdl = 1001 3.50 ? 3.71 v lvdl = 1010 3.60 ? 3.82 v lvdl = 1011 3.80 ? 4.03 v lvdl = 1100 4.00 ? 4.24 v lvdl = 1101 4.20 ? 4.45 v lvdl = 1110 4.50 ? 4.77 v lv15 v lvdin external lvd input pin threshold voltage lvdl = 1111 ???v note 1: these parameters are characterize d but not tested in manufacturing. 2: these values not in us able operating range. bo10 reset (due to bor) v dd (device in brown-out reset) (device not in brown-out reset) power up time-out bo15 dspic30f2011/2012/3012/3013 ds70139c-page 156 preliminary ? 2005 microchip technology inc. table 20-11: electrical characteristics: bor table 20-12: dc characteristics: program and eeprom dc characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min typ (1) max units conditions bo10 v bor bor voltage (2) on v dd transition high to low borv = 00 (3) ? ? ? v not in operating range borv = 01 2.7 ? 2.86 v borv = 10 4.2 ? 4.46 v borv = 11 4.5 ? 4.78 v bo15 v bhys ?5?mv note 1: data in ?typ? column is at 5v, 25 c unless otherwise stated. paramete rs are for design guidance only and are not tested. 2: these parameters are characterized but not tested in manufacturing. 3: 00 values not in usable operating range. dc characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min typ (1) max units conditions data eeprom memory (2) d120 e d byte endurance 100k 1m ? e/w -40 c t a +85c d121 v drw v dd for read/write v min ? 5.5 v using eecon to read/write v min = minimum operating voltage d122 t dew erase/write cycle time ? 2 ? ms d123 t retd characteristic retention 40 100 ? yea r provided no other specifications are violated d124 i dew i dd during programming ? 10 30 ma row erase program flash memory (2) d130 e p cell endurance 10k 100k ? e/w -40 c t a +85c d131 v pr v dd for read v min ?5.5vv min = minimum operating voltage d132 v eb v dd for bulk erase 4.5 ? 5.5 v d133 v pew v dd for erase/write 3.0 ? 5.5 v d134 t pew erase/write cycle time ? 2 ? ms d135 t retd characteristic retention 40 100 ? yea r provided no other specifications are violated d136 t eb icsp block erase time ? 4 ? ms d137 i pew i dd during programming ? 10 30 ma row erase d138 i eb i dd during programming ? 10 30 ma bulk erase note 1: data in ?typ? column is at 5v, 25c unless otherwise stated. 2: these parameters are characterized but not tested in manufacturing. ? 2005 microchip technology inc. preliminary ds70139c-page 157 dspic30f2011/2012/3012/3013 20.2 ac characteristics and timing parameters the information contained in this section defines dspic30f ac charac teristics and timing parameters. table 20-13: temperature and voltage specifications ? ac figure 20-3: load conditions for device timing specifications figure 20-4: external clock timing ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended operating voltage v dd range as described in dc spec section 20.0. v dd /2 c l r l pin pin v ss v ss c l r l =464 c l = 50 pf for all pins except osc2 5 pf for osc2 output load condition 1 - for all pins except osc2 load condition 2 - for osc2 osc1 clkout q4 q1 q2 q3 q4 q1 os20 os25 os30 os30 os40 os41 os31 os31 dspic30f2011/2012/3012/3013 ds70139c-page 158 preliminary ? 2005 microchip technology inc. table 20-14: external clock timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min typ (1) max units conditions os10 f osc external clkin frequency (2) (external clocks allowed only in ec mode) dc 4 4 4 ? ? ? ? 40 10 10 7.5 mhz mhz mhz mhz ec ec with 4x pll ec with 8x pll ec with 16x pll oscillator frequency (2) dc 0.4 4 4 4 4 10 10 10 10 12 12 12 31 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? 7.37 7.37 7.37 7.37 512 4 4 10 10 10 7.5 25 20 20 15 25 25 22.5 33 ? ? ? ? ? mhz mhz mhz mhz mhz mhz mhz mhz mhz mhz mhz mhz mhz khz mhz mhz mhz mhz khz rc xtl xt xt with 4x pll xt with 8x pll xt with 16x pll hs hs/2 with 4x pll hs/2 with 8x pll hs/2 with 16x pll hs/3 with 4x pll hs/3 with 8x pll hs/3 with 16x pll lp frc internal frc internal w/4x pll frc internal w/8x pll frc internal w/16x pll lprc internal os20 t osc t osc = 1/f osc ? ? ? ? see parameter os10 for f osc value os25 t cy instruction cycle time (2)(3) 33 ? dc ns see table 20-16 os30 tosl, to s h external clock (2) in (osc1) high or low time .45 x t osc ??nsec os31 tosr, to s f external clock (2) in (osc1) rise or fall time ? ? 20 ns ec os40 tckr clkout rise time (2)(4) ? 6 10 ns os41 tckf clkout fall time (2)(4) ? 6 10 ns note 1: data in ?typ? column is at 5v, 25c unless otherwise stated. paramete rs are for design guidance only and are not tested. 2: these parameters are characterized but not tested in manufacturing. 3: instruction cycle period (t cy ) equals four times the input oscillator time-base period. all specified values are based on characterization data for that particular oscillator type under st andard operating conditions with the device executing code. ex ceeding these specified limits may result in an unstable oscillator operation and/or higher than expect ed current consumption. all devices are tested to operate at ?min.? values with an external clock applied to the osc1/c lki pin. when an external clock input is used, the ?max.? cycle time limit is ?dc? (no clock) for all devices. 4: measurements are taken in ec or erc modes. the clkout signal is measured on the osc2 pin. clkout is low for the q1-q2 period (1/2 t cy ) and high for the q3-q4 period (1/2 t cy ). ? 2005 microchip technology inc. preliminary ds70139c-page 159 dspic30f2011/2012/3012/3013 table 20-16: internal clock timing examples table 20-15: pll clock timing specifications (v dd = 2.5 to 5.5 v) ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ (2) max units conditions os50 f plli pll input frequency range (2) 4 ? 10 mhz ec, xt modes with pll os51 f sys on-chip pll output (2) 16 ? 120 mhz ec, xt modes with pll os52 t loc pll start-up time (lock time) ? 20 50 s os53 d clk clkout stability (jitter) tbd 1 tbd % measured over 100 ms period note 1: these parameters are characterize d but not tested in manufacturing. 2: data in ?typ? column is at 5v, 25c unless otherwis e stated. parameters are for design guidance only and are not tested. clock oscillator mode f osc (mhz) (1) t cy ( sec) (2) mips (3) w/o pll mips (3) w pll x4 mips (3) w pll x8 mips (3) w pll x16 ec 0.200 20.0 0.05 ? ? ? 4 1.0 1.0 4.0 8.0 16.0 10 0.4 2.5 10.0 20.0 ? 25 0.16 6.25 ? ? ? xt 4 1.0 1.0 4.0 8.0 16.0 10 0.4 2.5 10.0 20.0 ? note 1: assumption: oscillator post scaler is divide by 1. 2: instruction execution cycle time: t cy = 1 / mips. 3: instruction execution frequency: mips = (f osc * pllx) / 4 [since there ar e 4 q clocks per instruction cycle]. dspic30f2011/2012/3012/3013 ds70139c-page 160 preliminary ? 2005 microchip technology inc. table 20-17: ac characteristic s: internal rc accuracy ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40c t a +125c for extended param no. characteristic min typ max units conditions internal frc accuracy @ frc freq = 7.37 mhz (1) frc tbd % +25c v dd = 3.0-3.6v tbd % +25c v dd = 4.5-5.5v tbd % -40c t a +85c v dd = 3.0-3.6v tbd % -40c t a +85c v dd = 4.5-5.5v tbd % -40c t a +125c v dd = 4.5-5.5v frc with x4 pll tbd % +25c v dd = 3.0-3.6v tbd % +25c v dd = 4.5-5.5v tbd % -40c t a +85c v dd = 3.0-3.6v tbd % -40c t a +85c v dd = 4.5-5.5v tbd % -40c t a +125c v dd = 4.5-5.5v frc with x8 pll tbd % +25c v dd = 3.0-3.6v tbd % +25c v dd = 4.5-5.5v tbd % -40c t a +85c v dd = 3.0-3.6v tbd % -40c t a +85c v dd = 4.5-5.5v tbd % -40c t a +125c v dd = 4.5-5.5v frc with x16 pll tbd % +25c v dd = 3.0-3.6v tbd % +25c v dd = 4.5-5.5v tbd % -40c t a +85c v dd = 3.0-3.6v tbd % -40c t a +85c v dd = 4.5-5.5v tbd % -40c t a +125c v dd = 4.5-5.5v note 1: frequency calibrated at 25c and 5v. tun bits can be used to compensate for temperature drift. ? 2005 microchip technology inc. preliminary ds70139c-page 161 dspic30f2011/2012/3012/3013 table 20-18: ac characteristics: internal rc jitter ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40c t a +125c for extended param no. characteristic min typ max units conditions internal frc jitter @ frc freq = 7.37 mhz (1) frc tbd % +25c v dd = 3.0-3.6v tbd % +25c v dd = 4.5-5.5v tbd % -40c t a +85c v dd = 3.0-3.6v tbd % -40c t a +85c v dd = 4.5-5.5v tbd % -40c t a +125c v dd = 4.5-5.5v frc with x4 pll tbd % +25c v dd = 3.0-3.6v tbd % +25c v dd = 4.5-5.5v tbd % -40c t a +85c v dd = 3.0-3.6v tbd % -40c t a +85c v dd = 4.5-5.5v tbd % -40c t a +125c v dd = 4.5-5.5v frc with x8 pll tbd % +25c v dd = 3.0-3.6v tbd % +25c v dd = 4.5-5.5v tbd % -40c t a +85c v dd = 3.0-3.6v tbd % -40c t a +85c v dd = 4.5-5.5v tbd % -40c t a +125c v dd = 4.5-5.5v frc with x16 pll tbd % +25c v dd = 3.0-3.6v tbd % +25c v dd = 4.5-5.5v tbd % -40c t a +85c v dd = 3.0-3.6v tbd % -40c t a +85c v dd = 4.5-5.5v tbd % -40c t a +125c v dd = 4.5-5.5v note 1: frequency calibrated at 25c and 5v. tun bits ca n be used to compensate for temperature drift. table 20-19: internal rc accuracy ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. characteristic min typ max units conditions lprc @ freq = 512 khz f20 tbd ? tbd % -40c to +85c v dd =3v f21 tbd ? tbd % -40c to +85c v dd =5v note 1: frequency at 25c and 5v. 2: change of lprc frequency as v dd changes. dspic30f2011/2012/3012/3013 ds70139c-page 162 preliminary ? 2005 microchip technology inc. figure 20-5: clkout and i/o timing characteristics table 20-20: clkout and i/o timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1)(2)(3) min typ (4) max units conditions do31 t io r port output rise time ? 10 25 ns ? do32 t io f port output fall time ? 10 25 ns ? di35 t inp intx pin high or low time (output) 20 ? ? ns ? di40 t rbp cnx high or low time (input) 2 t cy ??ns ? note 1: these parameters are asynchronous events not related to any internal clock edges 2: measurements are taken in rc mode and ec mode where clkout output is 4 x t osc . 3: these parameters are characterized but not tested in manufacturing. 4: data in ?typ? column is at 5v, 25c unless otherwise stated. note: refer to figure 20-3 for load conditions. i/o pin (input) i/o pin (output) di35 old value new value di40 do31 do32 ? 2005 microchip technology inc. preliminary ds70139c-page 163 dspic30f2011/2012/3012/3013 figure 20-6: reset, watchdog timer, osci llator start-up timer and power-up timer timing characteristics v dd mclr internal por pwrt time-out osc time-out internal reset watchdog timer reset sy11 sy10 sy20 sy13 i/o pins sy13 note: refer to figure 20-3 for load conditions. fscm delay sy35 sy30 sy12 dspic30f2011/2012/3012/3013 ds70139c-page 164 preliminary ? 2005 microchip technology inc. table 20-21: reset, watchdog timer, oscill ator start-up timer, power-up timer and brown-out reset timing requirements figure 20-7: band gap start-up time characteristics ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ (2) max units conditions sy10 tmcl mclr pulse width (low) 2 ? ? s -40c to +85c sy11 t pwrt power-up timer period tbd tbd tbd tbd 0 4 16 64 tbd tbd tbd tbd ms -40c to +85c user programmable sy12 t por power on reset delay 3 10 30 s -40c to +85c sy13 t ioz i/o hi-impedance from mclr low or watchdog timer reset ??100ns sy20 t wdt 1 watchdog timer time-out period (no prescaler) 1.8 2.0 2.2 ms v dd = 5v, -40c to +85c t wdt 2 1.9 2.1 2.3 ms v dd = 3v, -40c to +85c sy25 t bor brown-out reset pulse width (3) 100 ? ? sv dd v bor (d034) sy30 t ost oscillation start-up timer period ? 1024 t osc ??t osc = osc1 period sy35 t fscm fail-safe clock monitor delay ? 100 ? s -40c to +85c note 1: these parameters are characterized but not tested in manufacturing. 2: data in ?typ? column is at 5v, 25c unless otherwise stated. 3: refer to figure 20-2 and table 20-11 for bor. v bgap enable band gap band gap 0v (see note) stable note: set lvden bit (rcon<12>) or fborpor<7>set. sy40 ? 2005 microchip technology inc. preliminary ds70139c-page 165 dspic30f2011/2012/3012/3013 table 20-22: band gap start-up time requirements figure 20-8: type a, b and c timer external clock timing characteristics ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ (2) max units conditions sy40 t bgap band gap start-up time ? 20 50 s defined as the time between the instant that the band gap is enabled and the moment that the band gap reference voltage is stable. rcon<13>status bit note 1: these parameters are characterize d but not tested in manufacturing. 2: data in ?typ? column is at 5v, 25c unless otherwise stated. note: refer to figure 20-3 for load conditions. tx11 tx15 tx10 tx20 tmrx os60 txck dspic30f2011/2012/3012/3013 ds70139c-page 166 preliminary ? 2005 microchip technology inc. table 20-23: type a timer (timer1) external clock timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min typ max units conditions ta10 t tx h txck high time synchronous, no prescaler 0.5 t cy + 20 ? ? ns must also meet parameter ta15 synchronous, with prescaler 10 ? ? ns asynchronous 10 ? ? ns ta11 t tx l txck low time synchronous, no prescaler 0.5 t cy + 20 ? ? ns must also meet parameter ta15 synchronous, with prescaler 10 ? ? ns asynchronous 10 ? ? ns ta15 t tx p txck input period synchronous, no prescaler t cy + 10 ? ? ns synchronous, with prescaler greater of: 20 ns or (t cy + 40)/n ? ? ? n = prescale value (1, 8, 64, 256) asynchronous 20 ? ? ns os60 ft1 sosc1/t1ck oscillator input frequency range (oscillator enabled by setting bit tcs (t1con, bit 1)) dc ? 50 khz ta20 t ckextmrl delay from external txck clock edge to timer increment 2 t osc 6 t osc ? note: timer1 is a type a. ? 2005 microchip technology inc. preliminary ds70139c-page 167 dspic30f2011/2012/3012/3013 table 20-24: type b timer (timer2 and timer4) external clock timing requirements table 20-25: type c timer (timer3 and time r5) external clock timing requirements ac characteristics standard operating condi tions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min typ max units conditions tb10 ttxh txck high time synchronous, no prescaler 0.5 t cy + 20 ? ? ns must also meet parameter tb15 synchronous, with prescaler 10 ? ? ns tb11 ttxl txck low time synchronous, no prescaler 0.5 t cy + 20 ? ? ns must also meet parameter tb15 synchronous, with prescaler 10 ? ? ns tb15 ttxp txck input period synchronous, no prescaler t cy + 10 ? ? ns n = prescale value (1, 8, 64, 256) synchronous, with prescaler greater of: 20 ns or (t cy + 40)/n tb20 t ckextmrl delay from external txck clock edge to timer increment 2 t osc ?6 t osc ? note: timer2 and timer4 are type b. ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min typ max units conditions tc10 ttxh txck high time synchronous 0.5 t cy + 20 ? ? ns must also meet parameter tc15 tc11 ttxl txck low time synchronous 0.5 t cy + 20 ? ? ns must also meet parameter tc15 tc15 ttxp txck input period synchronous, no prescaler t cy + 10 ? ? ns n = prescale value (1, 8, 64, 256) synchronous, with prescaler greater of: 20 ns or (t cy + 40)/n tc20 t ckextmrl delay from external txck clock edge to timer increment 2 t osc ?6 t osc ? note: timer3 and timer5 are type c. dspic30f2011/2012/3012/3013 ds70139c-page 168 preliminary ? 2005 microchip technology inc. figure 20-9: input capture (capx) timing characteristics table 20-26: input capture timing requirements figure 20-10: output compare module (o cx) timing characteristics table 20-27: output compare module timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min max units conditions ic10 tccl icx input low time no prescaler 0.5 t cy + 20 ? ns with prescaler 10 ? ns ic11 tcch icx input high time no prescaler 0.5 t cy + 20 ? ns with prescaler 10 ? ns ic15 tccp icx input period (2 t cy + 40)/n ? ns n = prescale value (1, 4, 16) note 1: these parameters are characterized but not tested in manufacturing. ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ (2) max units conditions oc10 tccf ocx output fall time ? 10 25 ns ? oc11 tccr ocx output rise time ? 10 25 ns ? note 1: these parameters are characterized but not tested in manufacturing. 2: data in ?typ? column is at 5v, 25c unless otherwise stated. parameters are for design guidance only and are not tested. ic x ic10 ic11 ic15 note: refer to figure 20-3 for load conditions. ocx oc11 oc10 (output compare note: refer to figure 20-3 for load conditions. or pwm mode) ? 2005 microchip technology inc. preliminary ds70139c-page 169 dspic30f2011/2012/3012/3013 figure 20-11: oc/pwm module timing characteristics table 20-28: simple oc/pwm mode timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ (2) max units conditions oc15 t fd fault input to pwm i/o change ? ? 25 ns v dd = 3v -40c to +85c tbd ns v dd = 5v oc20 t flt fault input pulse width ? ? 50 ns v dd = 3v -40c to +85c tbd ns v dd = 5v note 1: these parameters are characterize d but not tested in manufacturing. 2: data in ?typ? column is at 5v, 25c unless otherwis e stated. parameters are for design guidance only and are not tested. ocfa/ocfb ocx oc20 oc15 dspic30f2011/2012/3012/3013 ds70139c-page 170 preliminary ? 2005 microchip technology inc. figure 20-12: dci module (multichannel, i 2 s modes) timing characteristics cofs csck (scke = 1 ) csck (scke = 0 ) csdo csdi cs11 cs10 cs40 cs41 cs21 cs20 cs35 cs21 msb lsb msb in lsb in cs31 high-z high-z 70 cs30 cs51 cs50 cs55 note: refer to figure 20-3 for load conditions. cs20 cs56 ? 2005 microchip technology inc. preliminary ds70139c-page 171 dspic30f2011/2012/3012/3013 table 20-29: dci module (multichannel, i 2 s modes) timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ (2) max units conditions cs10 tc sckl csck input low time (csck pin is an input) t cy / 2 + 20 ? ? ns ? csck output low time (3) (csck pin is an output) 30 ? ? ns ? cs11 tc sckh csck input high time (csck pin is an input) t cy / 2 + 20 ? ? ns ? csck output high time (3) (csck pin is an output) 30 ? ? ns ? cs20 tc sckf csck output fall time (4) (csck pin is an output) ?1025ns ? cs21 tc sckr csck output rise time (4) (csck pin is an output) ?1025ns ? cs30 tc sdof csdo data output fall time (4) ?1025ns ? cs31 tc sdor csdo data output rise time (4) ?1025ns ? cs35 t dv clock edge to csdo data valid ? ? 10 ns ? cs36 t div clock edge to csdo tri-stated 10 ? 20 ns ? cs40 t csdi setup time of csdi data input to csck edge (csck pin is input or output) 20 ? ? ns ? cs41 t hcsdi hold time of csdi data input to csck edge (csck pin is input or output) 20 ? ? ns ? cs50 tco fsf cofs fall time (cofs pin is output) ?1025ns note 1 cs51 tco fsr cofs rise time (cofs pin is output) ?1025ns note 1 cs55 tsco fs setup time of cofs data input to csck edge (cofs pin is input) 20 ? ? ns ? cs56 t hcofs hold time of cofs data input to csck edge (cofs pin is input) 20 ? ? ns ? note 1: these parameters are characterize d but not tested in manufacturing. 2: data in ?typ? column is at 5v, 25c unless otherwis e stated. parameters are fo r design guidance only and are not tested. 3: the minimum clock period for csck is 100 ns. theref ore, the clock generated in master mode must not violate this specification. 4: assumes 50 pf load on all dci pins. dspic30f2011/2012/3012/3013 ds70139c-page 172 preliminary ? 2005 microchip technology inc. figure 20-13: dci module (ac-link mo de) timing characteristics table 20-30: dci module (ac-link mode) timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1)(2) min typ (3) max units conditions cs60 t bclkl bit_clk low time 36 40.7 45 ns ? cs61 t bclkh bit_clk high time 36 40.7 45 ns ? cs62 t bclk bit_clk period ? 81.4 ? ns bit clock is input cs65 t sacl input setup time to falling edge of bit_clk ? ? 10 ns ? cs66 t hacl input hold time from falling edge of bit_clk ? ? 10 ns ? cs70 t synclo sync data output low time ? 19.5 ? s note 1 cs71 t synchi sync data output high time ? 1.3 ? s note 1 cs72 t sync sync data output period ? 20.8 ? s note 1 cs75 t racl rise time, sync, sdata_out ? 10 25 ns c load = 50 pf, v dd = 5v cs76 t facl fall time, sync, sdata_out ? 10 25 ns c load = 50 pf, v dd = 5v cs77 t racl rise time, sync, sdata_out ? tbd tbd ns c load = 50 pf, v dd = 3v cs78 t facl fall time, sync, sdata_out ? tbd tbd ns c load = 50 pf, v dd = 3v cs80 t ovdacl output valid delay from rising edge of bit_clk ? ? 15 ns ? note 1: these parameters are characterized but not tested in manufacturing. 2: these values assume bit_clk frequency is 12.288 mhz. 3: data in ?typ? column is at 5v, 25 c unless otherwise stated. paramete rs are for design guidance only and are not tested. sync bit_clk sdo sdi cs61 cs60 cs65 cs66 cs80 cs21 msb in cs75 lsb cs76 (cofs) (csck) lsb msb cs72 cs71 cs70 cs76 cs75 (csdo) (csdi) cs62 cs20 ? 2005 microchip technology inc. preliminary ds70139c-page 173 dspic30f2011/2012/3012/3013 figure 20-14: spi module master mode (cke = 0 ) timing characteristics table 20-31: spi master mode (cke = 0 ) timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ (2) max units conditions sp10 tscl sck x output low time (3) t cy / 2 ? ? ns ? sp11 tsch sck x output high time (3) t cy / 2 ? ? ns ? sp20 tscf sck x output fall time (4 ?1025ns ? sp21 tscr sck x output rise time (4) ?1025ns ? sp30 tdof sdo x data output fall time (4) ?1025ns ? sp31 tdor sdo x data output rise time (4) ?1025ns ? sp35 tsch2dov, tscl2dov sdo x data output valid after sck x edge ??30ns ? sp40 tdiv2sch, tdiv2scl setup time of sdi x data input to sck x edge 20 ? ? ns ? sp41 tsch2dil, tscl2dil hold time of sdi x data input to sck x edge 20 ? ? ns ? note 1: these parameters are characterize d but not tested in manufacturing. 2: data in ?typ? column is at 5v, 25c unless otherwis e stated. parameters are for design guidance only and are not tested. 3: the minimum clock period for sck is 100 ns. theref ore, the clock generated in master mode must not violate this specification. 4: assumes 50 pf load on all spi pins. sckx (ckp = 0 ) sckx (ckp = 1 ) sdox sdix sp11 sp10 sp40 sp41 sp21 sp20 sp35 sp20 sp21 msb lsb bit14 - - - - - -1 msb in lsb in bit14 - - - -1 sp30 sp31 note: refer to figure 20-3 for load conditions. dspic30f2011/2012/3012/3013 ds70139c-page 174 preliminary ? 2005 microchip technology inc. figure 20-15: spi module master mode (cke = 1 ) timing characteristics table 20-32: spi module master mode (cke = 1 ) timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ (2) max units conditions sp10 tscl sck x output low time (3) t cy / 2 ? ? ns ? sp11 tsch sck x output high time (3) t cy / 2 ? ? ns ? sp20 tscf sck x output fall time (4) ?1025ns ? sp21 tscr sck x output rise time (4) ?1025ns ? sp30 tdof sdo x data output fall time (4) ?1025ns ? sp31 tdor sdo x data output rise time (4) ?1025ns ? sp35 tsch2dov, tscl2dov sdo x data output valid after sck x edge ? ? 30 ns ? sp36 tdov2sc, tdov2scl sdo x data output setup to first sck x edge 30 ? ? ns ? sp40 tdiv2sch, tdiv2scl setup time of sdi x data input to sck x edge 20 ? ? ns ? sp41 tsch2dil, tscl2dil hold time of sdi x data input to sck x edge 20 ? ? ns ? note 1: these parameters are characterized but not tested in manufacturing. 2: data in ?typ? column is at 5v, 25 c unless otherwise stated. paramete rs are for design guidance only and are not tested. 3: the minimum clock period for sck is 100 ns. therefor e, the clock generated in master mode must not violate this specification. 4: assumes 50 pf load on all spi pins. sck x (ckp = 0 ) sck x (ckp = 1 ) sdo x sdi x sp36 sp30,sp31 sp35 msb msb in bit14 - - - - - -1 lsb in bit14 - - - -1 lsb note: refer to figure 20-3 for load conditions. sp11 sp10 sp20 sp21 sp21 sp20 sp40 sp41 ? 2005 microchip technology inc. preliminary ds70139c-page 175 dspic30f2011/2012/3012/3013 figure 20-16: spi module slave mode (cke = 0 ) timing characteristics table 20-33: spi module slave mode (cke = 0 ) timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ (2) max units conditions sp70 tscl sck x input low time 30 ? ? ns ? sp71 tsch sck x input high time 30 ? ? ns ? sp72 tscf sck x input fall time (3) ?1025ns ? sp73 tscr sck x input rise time (3) ?1025ns ? sp30 tdof sdo x data output fall time (3) ?1025ns ? sp31 tdor sdo x data output rise time (3) ?1025ns ? sp35 tsch2dov, tscl2dov sdo x data output valid after sck x edge ? ? 30 ns ? sp40 tdiv2sch, tdiv2scl setup time of sdi x data input to sck x edge 20 ? ? ns ? sp41 tsch2dil, tscl2dil hold time of sdi x data input to sck x edge 20 ? ? ns ? sp50 tssl2sch, tssl2scl ss x to sck x or sck x input 120 ? ? ns ? sp51 tssh2doz ss x to sdo x output hi-impedance (3) 10 ? 50 ns ? sp52 tsch2ssh tscl2ssh ss x after sck edge 1.5 t cy +40 ? ? ns ? note 1: these parameters are characterize d but not tested in manufacturing. 2: data in ?typ? column is at 5v, 25c unless otherwis e stated. parameters are for design guidance only and are not tested. 3: assumes 50 pf load on all spi pins. ss x sck x (ckp = 0 ) sck x (ckp = 1 ) sdo x sdi sp50 sp40 sp41 sp30,sp31 sp51 sp35 sdi x msb lsb bit14 - - - - - -1 msb in bit14 - - - -1 lsb in sp52 sp73 sp72 sp72 sp73 sp71 sp70 note: refer to figure 20-3 for load conditions. dspic30f2011/2012/3012/3013 ds70139c-page 176 preliminary ? 2005 microchip technology inc. figure 20-17: spi module slave mode (cke = 1 ) timing characteristics ss x sck x (ckp = 0 ) sck x (ckp = 1 ) sdo x sdi sp50 sp60 sdi x sp30,sp31 msb bit14 - - - - - -1 lsb sp51 msb in bit14 - - - -1 lsb in sp35 sp52 sp52 sp73 sp72 sp72 sp73 sp71 sp70 sp40 sp41 note: refer to figure 20-3 for load conditions. ? 2005 microchip technology inc. preliminary ds70139c-page 177 dspic30f2011/2012/3012/3013 table 20-34: spi module slave mode (cke = 1 ) timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ (2) max units conditions sp70 ts c l sck x input low time 30 ? ? ns ? sp71 tsch sck x input high time 30 ? ? ns ? sp72 tscf sck x input fall time (3) ?1025ns ? sp73 tscr sck x input rise time (3) ?1025ns ? sp30 tdof sdo x data output fall time (3) ?1025ns ? sp31 tdor sdo x data output rise time (3) ?1025ns ? sp35 tsch2dov, tscl2dov sdo x data output valid after sck x edge ??30ns ? sp40 tdiv2sch, tdiv2scl setup time of sdi x data input to sck x edge 20 ? ? ns ? sp41 tsch2dil, tscl2dil hold time of sdi x data input to sck x edge 20 ? ? ns ? sp50 tssl2sch, ts s l 2 s c l ss x to sck x or sck x input 120 ? ? ns ? sp51 tssh2doz ss to sdo x output hi-impedance (4) 10 ? 50 ns ? sp52 tsch2ssh ts c l 2 s s h ss x after sck x edge 1.5 t cy + 40 ? ? ns ? sp60 tssl2dov sdo x data output valid after sck x edge ??50ns ? note 1: these parameters are characterize d but not tested in manufacturing. 2: data in ?typ? column is at 5v, 25c unless otherwis e stated. parameters are for design guidance only and are not tested. 3: the minimum clock period for sck is 100 ns. theref ore, the clock generated in master mode must not violate this specification. 4: assumes 50 pf load on all spi pins. dspic30f2011/2012/3012/3013 ds70139c-page 178 preliminary ? 2005 microchip technology inc. figure 20-18: i 2 c bus start/stop bits timing ch aracteristics (master mode) figure 20-19: i 2 c bus data timing characteristics (master mode) im31 im34 scl sda start condition stop condition im30 im33 note: refer to figure 20-3 for load conditions. im11 im10 im33 im11 im10 im20 im26 im25 im40 im40 im45 im21 scl sda in sda out note: refer to figure 20-3 for load conditions. ? 2005 microchip technology inc. preliminary ds70139c-page 179 dspic30f2011/2012/3012/3013 table 20-35: i 2 c bus data timing requirements (master mode) ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min (1) max units conditions im10 t lo : scl clock low time 100 khz mode t cy / 2 (brg + 1) ? s? 400 khz mode t cy / 2 (brg + 1) ? s? 1 mhz mode (2) t cy / 2 (brg + 1) ? s? im11 t hi : scl clock high time 100 khz mode t cy / 2 (brg + 1) ? s? 400 khz mode t cy / 2 (brg + 1) ? s? 1 mhz mode (2) t cy / 2 (brg + 1) ? s? im20 t f : scl sda and scl fall time 100 khz mode ? 300 ns c b is specified to be from 10 to 400 pf 400 khz mode 20 + 0.1 c b 300 ns 1 mhz mode (2) ?100ns im21 t r : scl sda and scl rise time 100 khz mode ? 1000 ns c b is specified to be from 10 to 400 pf 400 khz mode 20 + 0.1 c b 300 ns 1 mhz mode (2) ?300ns im25 t su : dat data input setup time 100 khz mode 250 ? ns ? 400 khz mode 100 ? ns 1 mhz mode (2) tbd ? ns im26 t hd : dat data input hold time 100 khz mode 0 ? ns ? 400 khz mode 0 0.9 s 1 mhz mode (2) tbd ? ns im30 t su : sta start condition setup time 100 khz mode t cy / 2 (brg + 1) ? s only relevant for repeated start condition 400 khz mode t cy / 2 (brg + 1) ? s 1 mhz mode (2) t cy / 2 (brg + 1) ? s im31 t hd : sta start condition hold time 100 khz mode t cy / 2 (brg + 1) ? s after this period the first clock pulse is generated 400 khz mode t cy / 2 (brg + 1) ? s 1 mhz mode (2) t cy / 2 (brg + 1) ? s im33 t su : sto stop condition setup time 100 khz mode t cy / 2 (brg + 1) ? s? 400 khz mode t cy / 2 (brg + 1) ? s 1 mhz mode (2) t cy / 2 (brg + 1) ? s im34 t hd : sto stop condition 100 khz mode t cy / 2 (brg + 1) ? ns ? hold time 400 khz mode t cy / 2 (brg + 1) ? ns 1 mhz mode (2) t cy / 2 (brg + 1) ? ns im40 t aa : scl output valid from clock 100 khz mode ? 3500 ns ? 400 khz mode ? 1000 ns ? 1 mhz mode (2) ??ns ? im45 t bf : sda bus free time 100 khz mode 4.7 ? s time the bus must be free before a new transmission can start 400 khz mode 1.3 ? s 1 mhz mode (2) tbd ? s im50 c b bus capacitive loading ? 400 pf note 1: brg is the value of the i 2 c baud rate generator. refer to section 21 ?inter-integrated circuit? (i 2 c)? in the dspic30f family reference manual. 2: maximum pin capacitance = 10 pf for all i 2 c pins (for 1 mhz mode only). dspic30f2011/2012/3012/3013 ds70139c-page 180 preliminary ? 2005 microchip technology inc. figure 20-20: i 2 c bus start/stop bits timing characteristics (slave mode) figure 20-21: i 2 c bus data timing characteristics (slave mode) is31 is34 scl sda start condition stop condition is30 is33 is30 is31 is33 is11 is10 is20 is26 is25 is40 is40 is45 is21 scl sda in sda out ? 2005 microchip technology inc. preliminary ds70139c-page 181 dspic30f2011/2012/3012/3013 table 20-36: i 2 c bus data timing requirements (slave mode) ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min max units conditions is10 t lo : scl clock low time 100 khz mode 4.7 ? s device must operate at a minimum of 1.5 mhz 400 khz mode 1.3 ? s device must operate at a minimum of 10 mhz. 1 mhz mode (1) 0.5 ? s? is11 t hi : scl clock high time 100 khz mode 4.0 ? s device must operate at a minimum of 1.5 mhz 400 khz mode 0.6 ? s device must operate at a minimum of 10 mhz 1 mhz mode (1) 0.5 ? s? is20 t f : scl sda and scl fall time 100 khz mode ? 300 ns c b is specified to be from 10 to 400 pf 400 khz mode 20 + 0.1 c b 300 ns 1 mhz mode (1) ?100ns is21 t r : scl sda and scl rise time 100 khz mode ? 1000 ns c b is specified to be from 10 to 400 pf 400 khz mode 20 + 0.1 c b 300 ns 1 mhz mode (1) ?300ns is25 t su : dat data input setup time 100 khz mode 250 ? ns ? 400 khz mode 100 ? ns 1 mhz mode (1) 100 ? ns is26 t hd : dat data input hold time 100 khz mode 0 ? ns ? 400 khz mode 0 0.9 s 1 mhz mode (1) 00.3 s is30 t su : sta start condition setup time 100 khz mode 4.7 ? s only relevant for repeated start condition 400 khz mode 0.6 ? s 1 mhz mode (1) 0.25 ? s is31 t hd : sta start condition hold time 100 khz mode 4.0 ? s after this period the first clock pulse is generated 400 khz mode 0.6 ? s 1 mhz mode (1) 0.25 ? s is33 t su : sto stop condition setup time 100 khz mode 4.7 ? s? 400 khz mode 0.6 ? s 1 mhz mode (1) 0.6 ? s is34 t hd : sto stop condition 100 khz mode 4000 ? ns ? hold time 400 khz mode 600 ? ns 1 mhz mode (1) 250 ns is40 t aa : scl output valid from clock 100 khz mode 0 3500 ns ? 400 khz mode 0 1000 ns 1 mhz mode (1) 0350ns is45 t bf : sda bus free time 100 khz mode 4.7 ? s time the bus must be free before a new transmission can start 400 khz mode 1.3 ? s 1 mhz mode (1) 0.5 ? s is50 c b bus capacitive loading ? 400pf ? note 1: maximum pin capacitance = 10 pf for all i 2 c pins (for 1 mhz mode only). dspic30f2011/2012/3012/3013 ds70139c-page 182 preliminary ? 2005 microchip technology inc. figure 20-22: can module i/o timing characteristics table 20-37: can module i/o timing requirements ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic (1) min typ (2) max units conditions ca10 tiof port output fall time ? 10 25 ns ? ca11 tior port output rise time ? 10 25 ns ? ca20 tcwf pulse width to trigger can wakeup filter 500 ns ? note 1: these parameters are characterized but not tested in manufacturing. 2: data in ?typ? column is at 5v, 25 c unless otherwise stated. paramete rs are for design guidance only and are not tested. c x t x pin (output) ca10 ca11 old value new value ca20 c x r x pin (input) ? 2005 microchip technology inc. preliminary ds70139c-page 183 dspic30f2011/2012/3012/3013 table 20-38: 12-bit a/d module specifications ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min. typ max. units conditions device supply ad01 av dd module v dd supply greater of v dd - 0.3 or 2.7 ? lesser of v dd + 0.3 or 5.5 v? ad02 av ss module v ss supply v ss - 0.3 ? v ss + 0.3 v ? reference inputs ad05 v refh reference voltage high av ss + 2.7 ? av dd v? ad06 v refl reference voltage low av ss ?av dd - 2.7 v ? ad07 v ref absolute reference voltage av ss - 0.3 ? av dd + 0.3 v ? ad08 i ref current drain ? 200 .001 300 3 a a a/d operating a/d off analog input ad10 v inh -v inl full-scale input span v refl v refh vsee note ad11 v in absolute input voltage av ss - 0.3 av dd + 0.3 v ? ad12 ? leakage current ? 0.001 0.610 av inl = av ss = v refl = 0v, av dd = v refh = 5v source impedance = 2.5 k ad13 ? leakage current ? 0.001 0.610 av inl = av ss = v refl = 0v, av dd = v refh = 3v source impedance = 2.5 k ad15 r ss switch resistance ? 3.2k ? ? ad16 c sample sample capacitor ? 18 pf ? ad17 r in recommended impedance of analog voltage source ??2.5k ? dc accuracy ad20 nr resolution 12 data bits bits ad21 inl integral nonlinearity ? 0.75 tbd lsb v inl = av ss = v refl = 0v, av dd = v refh = 5v ad21a inl integral nonlinearity ? 0.75 tbd lsb v inl = av ss = v refl = 0v, av dd = v refh = 3v ad22 dnl differential nonlinearity ? 0.5 < 1 lsb v inl = av ss = v refl = 0v, av dd = v refh = 5v ad22a dnl differential nonlinearity ? 0.5 < 1 lsb v inl = av ss = v refl = 0v, av dd = v refh = 3v ad23 g err gain error ? 1.25 tbd lsb v inl = av ss = v refl = 0v, av dd = v refh = 5v ad23a g err gain error ? 1.25 tbd lsb v inl = av ss = v refl = 0v, av dd = v refh = 3v note 1: the a/d conversion result never de creases with an increase in the input voltage, a nd has no missing codes. dspic30f2011/2012/3012/3013 ds70139c-page 184 preliminary ? 2005 microchip technology inc. ad24 e off offset error ? 1.25 tbd lsb v inl = av ss = v refl = 0v, av dd = v refh = 5v ad24a e off offset error ? 1.25 tbd lsb v inl = av ss = v refl = 0v, av dd = v refh = 3v ad25 ? monotonicity (1) ? ? ? ? guaranteed ad26 cmrr common-mode rejection ? tbd ? db ? ad27 psrr power supply rejection ratio ?tbd? db ? ad28 ctlk channel to channel crosstalk ?tbd? db ? dynamic performance ad30 thd total harmonic distortion ? ? ? db ? ad31 sinad signal to noise and distortion ?tbd? db ? ad32 sfdr spurious free dynamic range ?tbd? db ? ad33 f nyq input signal bandwidth ? ? 50 khz ? ad34 enob effective number of bits ? tbd tbd bits ? table 20-38: 12-bit a/d module specifications (continued) ac characteristics standard operating conditions: 2.5v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min. typ max. units conditions note 1: the a/d conversion result never decr eases with an increase in the input voltage, and has no missing codes. ? 2005 microchip technology inc. confidential ds70139c-page 185 dspic30f2011/2012/3012/3013 figure 20-23: 12-bit a/d conversion timing characteristics (asam = 0 , ssrc = 000 ) ad55 t samp clear samp set samp ad61 adclk instruction samp ch0_dischrg ch0_samp ad60 done adif adres( 0 ) 1 2 3 4 5 6 8 7 1 - software sets adcon. samp to start sampling. 2 - sampling starts after discharge period. 3 - software clears adcon. samp to start conversion. 4 - sampling ends, conversion sequence starts. 5 - convert bit 11 . 9 - one t ad for end of conversion. ad50 eoc 9 6 - convert bit 10 . 7 - convert bit 1 . 8 - convert bit 0 . execution t samp is described in the dspic30f family reference manual , section 18. dspic30f2011/2012/3012/3013 ds70139c-page 186 preliminary ? 2005 microchip technology inc. table 20-39: 12-bit a/d conversion timing requirements ac characteristics standard operating conditions: 2.7v to 5.5v (unless otherwise stated) operating temperature -40c t a +85c for industrial -40 c t a +125c for extended param no. symbol characteristic min. typ max. units conditions clock parameters ad50 t ad a/d clock period ? 667 ? ns v dd = 3-5.5v (note 1) ad51 t rc a/d internal rc oscillator period 1.2 1.5 1.8 s? conversion rate ad55 t conv conversion time ? 14 t ad ?ns ? ad56 f cnv throughput rate ? ? 100 ksps v dd = v ref = 5v ad57 t samp sampling time ? 1 t ad ?nsv dd = 3-5.5v source resistance r s = 0-2.5 k timing parameters ad60 t pcs conversion start from sample trigger ??t ad ns ? ad61 t pss sample start from setting sample (samp) bit 0.5 t ad ?1.5 t ad ns ? ad62 t css conversion completion to sample start (asam = 1 ) ??tbdns ? ad63 t dpu time to stabilize analog stage from a/d off to a/d on ??tbd s? note 1: because the sample caps will eventually lose c harge, clock rates below 10 khz can affect linearity performance, especially at elevated temperatures. 2: these parameters are characterized but not tested in manufacturing. ? 2005 microchip technology inc. preliminary ds70139c-page 187 dspic30f2011/2012/3012/3013 21.0 packaging information 21.1 package marking information xxxxxxxxxxxxxxxxx yywwnnn 28-lead spdip example xxxxxxxxxxxxxxxxx 18-lead pdip example xxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxx yywwnnn dspic30f3012 0510017 * standard picmicro device marking consists of mi crochip part number, year code, week code and traceability code. for pi cmicro device marking beyon d this, certain price adders apply. please check with your microchip sales office. for qtp devices, any special marking adders ar e included in qtp price. legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb -free jedec designator ( ) can be found on the outer pa ckaging for this package. note : in the event the full microchip part nu mber cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e dspic30f2012 0510017 30i/sp 3 e 30i/p 3 e 18-lead soic example yywwnnn xxxxxxxxxxxx xxxxxxxxxxxx xxxxxxxxxxxx 0510017 30i/so dspic30f2011 3 e dspic30f2011/2012/3012/3013 ds70139c-page 188 preliminary ? 2005 microchip technology inc. 21.2 package marking information (continued) 30f2011 28-lead soic (.300?) xxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx yywwnnn example DSPIC30F3013 0510017 xxxxxxxxxx xxxxxxxxxx xxxxxxxxxx yywwnnn 44-lead qfn dspic 30f3013 0510017 30i/so 3 e 30i/ml 3 e 28-lead qfn xxxxxxx xxxxxxx yywwnnn example 30i/mm 0510017 example 3 e ? 2005 microchip technology inc. preliminary ds70139c-page 189 dspic30f2011/2012/3012/3013 18-lead plastic dual in-line (p) ? 300 mil body (pdip) 15 10 5 15 10 5 mold draft angle bottom 15 10 5 15 10 5 mold draft angle top 10.92 9.40 7.87 .430 .370 .310 eb overall row spacing 0.56 0.46 0.36 .022 .018 .014 b lower lead width 1.78 1.46 1.14 .070 .058 .045 b1 upper lead width 0.38 0.29 0.20 .015 .012 .008 c lead thickness 3.43 3.30 3.18 .135 .130 .125 l tip to seating plane 22.99 22.80 22.61 .905 .898 .890 d overall length 6.60 6.35 6.10 .260 .250 .240 e1 molded package width 8.26 7.94 7.62 .325 .313 .300 e shoulder to shoulder width 0.38 .015 a1 base to seating plane 3.68 3.30 2.92 .145 .130 .115 a2 molded package thickness 4.32 3.94 3.56 .170 .155 .140 a top to seating plane 2.54 .100 p pitch 18 18 n number of pins max nom min max nom min dimension limits millimeters inches* units 1 2 d n e1 c eb e p a2 l b1 b a a1 * controlling parameter notes: dimensions d and e1 do not include mold flash or prot rusions. mold flash or pr otrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-001 drawing no. c04-007 significant characteristic dspic30f2011/2012/3012/3013 ds70139c-page 190 preliminary ? 2005 microchip technology inc. 18-lead plastic small outline (so) ? wide, 300 mil body (soic) foot angle 048048 15 12 0 15 12 0 mold draft angle bottom 15 12 0 15 12 0 mold draft angle top 0.51 0.42 0.36 .020 .017 .014 b lead width 0.30 0.27 0.23 .012 .011 .009 c lead thickness 1.27 0.84 0.41 .050 .033 .016 l foot length 0.74 0.50 0.25 .029 .020 .010 h chamfer distance 11.73 11.53 11.33 .462 .454 .446 d overall length 7.59 7.49 7.39 .299 .295 .291 e1 molded package width 10.67 10.34 10.01 .420 .407 .394 e overall width 0.30 0.20 0.10 .012 .008 .004 a1 standoff 2.39 2.31 2.24 .094 .091 .088 a2 molded package thickness 2.64 2.50 2.36 .104 .099 .093 a overall height 1.27 .050 p pitch 18 18 n number of pins max nom min max nom min dimension limits millimeters inches* units l c h 45 1 2 d p n b e1 e a2 a1 a * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-013 drawing no. c04-051 significant characteristic ? 2005 microchip technology inc. preliminary ds70139c-page 191 dspic30f2011/2012/3012/3013 28-lead skinny plastic dual in-line (sp) ? 300 mil body (pdip) 15 10 5 15 10 5 mold draft angle bottom 15 10 5 15 10 5 mold draft angle top 10.92 8.89 8.13 .430 .350 .320 eb overall row spacing 0.56 0.48 0.41 .022 .019 .016 b lower lead width 1.65 1.33 1.02 .065 .053 .040 b1 upper lead width 0.38 0.29 0.20 .015 .012 .008 c lead thickness 3.43 3.30 3.18 .135 .130 .125 l tip to seating plane 35.18 34.67 34.16 1.385 1.365 1.345 d overall length 7.49 7.24 6.99 .295 .285 .275 e1 molded package width 8.26 7.87 7.62 .325 .310 .300 e shoulder to shoulder width 0.38 .015 a1 base to seating plane 3.43 3.30 3.18 .135 .130 .125 a2 molded package thickness 4.06 3.81 3.56 .160 .150 .140 a top to seating plane 2.54 .100 p pitch 28 28 n number of pins max nom min max nom min dimension limits millimeters inches* units 2 1 d n e1 c eb e p l a2 b b1 a a1 notes: jedec equivalent: mo-095 drawing no. c04-070 * controlling parameter dimension d and e1 do not include mold flash or protrusions. mold flash or protrusions s hall not exceed .010? (0.254mm) per side. significant characteristic dspic30f2011/2012/3012/3013 ds70139c-page 192 preliminary ? 2005 microchip technology inc. 28-lead plastic small outline - wide, 300 mil body (soic) drawing no. c04-052 foot angle top f 048048 15 12 0 15 12 0 b mold draft angle bottom 15 12 0 15 12 0 a mold draft angle top 0.51 0.42 0.36 .020 .017 .014 b lead width 0.33 0.28 0.23 .013 .011 .009 c lead thickness 1.27 0.84 0.41 .050 .033 .016 l foot length 0.74 0.50 0.25 .029 .020 .010 h chamfer distance 18.08 17.87 17.65 .712 .704 .695 d overall length 7.59 7.49 7.32 .299 .295 .288 e1 molded package width 10.67 10.34 10.01 .420 .407 .394 e overall width 0.30 0.20 0.10 .012 .008 .004 a1 standoff 2.39 2.31 2.24 .094 .091 .088 a2 molded package thickness 2.64 2.50 2.36 .104 .099 .093 a overall height 1.27 .050 p pitch 28 28 n number of pins max nom min max nom min dimension limits millimeters inches units 2 1 d p n b e e1 l c b 45 h f a2 a a a1 ? 2005 microchip technology inc. preliminary ds70139c-page 193 dspic30f2011/2012/3012/3013 28-lead plastic quad flat no lead package (ml) 6x6x0.9 mm body (qfn-s) ? with 0.40 mm contact length (saw singulated) lead width *controlling parameter drawing no. c04-124 notes: jedec equivalent: mo-220 b .013 .015 .017 0.33 0.38 0.43 pitch number of pins overall width standoff overall length overall height max units dimension limits a1 d e n e a .000 inches .026 bsc min 28 nom max .002 0.00 6.00 millimeters* .039 min 28 0.65 bsc nom 0.05 1.00 0.90 .035 .001 0.02 lead length l .012 .016 .020 0.30 0.40 0.50 e2 d2 exposed pad width exposed pad length .169 .175 .177 4.30 4.45 4.50 .031 0.80 5.90 6.10 .240 .236 .232 .232 .236 6.00 .240 5.90 6.10 .169 .175 4.45 .177 4.30 4.50 b d2 d a1 a top view optional index area 1 2 l bottom view n e metal pad alternate exposed indicators index e e2 revised 05/24/04 dspic30f2011/2012/3012/3013 ds70139c-page 194 preliminary ? 2005 microchip technology inc. 44-lead plastic quad flat no lead package (ml) 8x8 mm body (qfn) ? 2005 microchip technology inc. preliminary ds70139c-page 195 dspic30f2011/2012/3012/3013 index numerics 12-bit analog-to-digital converte r (a/d) module .............. 109 a a/d ........................... .................... .................... ................. 109 aborting a conversion ............. .................. ............... 111 adchs register ......... .................. ................ ............ 109 adcon1 register....... .................. ................ ............ 109 adcon2 register....... .................. ................ ............ 109 adcon3 register....... .................. ................ ............ 109 adcssl register .................... .................. ............... 109 adpcfg register....... .................. ................ ............ 109 configuring analog port pins... .................. ......... 58, 113 connection considerations......... .................. ............ 113 conversion operation .............. .................. ............... 110 effects of a reset...... .................. .................. ............ 112 operation during cpu idle mode ............................. 112 operation during cpu sleep mode ................ .......... 112 output formats ...................... .................... ............... 112 power-down modes .................... .................. ............ 112 programming the sample trigger.. ........................... 111 register map............. .................. .................. ............ 115 result buffer .......... .................. .................. ............... 110 sampling requirements.............. .................. ............ 111 selecting the conversion clock ... ............................. 111 selecting the conversion seque nce......................... 110 ac characteristics ....... .................... .................. ............... 157 load conditions ....................... .................. ............... 157 ac temperature and voltage specif ications .................... 157 address generator units ............... .................... ................. 41 alternate vector table ................. ...................... ................. 67 analog-to-digital converter. see a/d. assembler mpasm assembler.................. .................. ............... 139 automatic clock stretch................. .................... ................. 96 during 10-bit addressing (stren = 1)....................... 96 during 7-bit addressing (stren = 1)......................... 96 receive mode ............. .................. .................. ............ 96 transmit mode ......................... ..................... .............. 96 b bandgap start-up time requirements.............. .................. ................ ............ 165 timing characteristics ............. .................. ............... 164 barrel shifter ................ .................... ..................... .............. 25 bit-reversed addressing ............... .................... ................. 44 example .................... .................. .................. .............. 45 implementation ........... .................. .................. ............ 44 modifier values table .............. ..................... .............. 45 sequence table (16-entry)......... .................. .............. 45 block diagrams 12-bit a/d functional ............... .................. ............... 109 16-bit timer1 module ............... ..................... .............. 71 16-bit timer2............. .................. .................. .............. 77 16-bit timer3............. .................. .................. .............. 77 32-bit timer2/3....................... .................... ................. 76 dsp engine ................ .................. .................. ............ 22 dspic30f2011 ......................... ..................... .............. 10 dspic30f2012 ......................... ..................... .............. 11 DSPIC30F3013 ......................... ..................... .............. 13 external power-on reset circuit.. ............................. 125 i 2 c.......................... ..................... .................. .............. 94 input capture mode ................. ..................... .............. 81 oscillator system................... .................... ............... 119 output compare mode .............. .................. ............... 85 reset system ............ .................. ................ ............. 123 shared port structure.............. .................... ............... 57 spi.................... ..................... .................... ................. 89 spi master/slave connection...... .................. ............. 90 uart receiver...................... .................... ............... 102 uart transmitter.................... .................. ............... 101 bor characteristics ...... .................. .................. ............... 156 bor. see brown-out reset. brown-out reset characteristics......... .................. .................. ............. 155 timing requirements ................ .................. ............. 164 c c compilers mplab c17........................... .................... ............... 140 mplab c18........................... .................... ............... 140 mplab c30........................... .................... ............... 140 can module i/o timing characteristics ....... .................. ............... 182 i/o timing requirements......... .................. ............... 182 clkout and i/o timing characteristics......... .................. .................. ............. 162 requirements ............ .................. ................ ............. 162 code examples data eeprom block erase ....... ................. ............... 54 data eeprom block write ....... .................. ............... 56 data eeprom read.... ........................ ...................... 53 data eeprom word erase ....... ................. ............... 54 data eeprom word write ....... .................. ............... 55 erasing a row of program memo ry ........................... 49 initiating a programming sequence . ................ .......... 50 loading write latches................. .................. ............. 50 code protection ............. .................. .................. ............... 117 control registers ......... .................... .................... ............... 48 nvmadr ................... .................. .................. ............. 48 nvmadru .............................. .................... ............... 48 nvmcon................... .................. .................. ............. 48 nvmkey ................... .................. .................. ............. 48 core architecture overview.................. .................. .................. ............... 17 cpu architecture overview ........... .................... ................. 17 customer change notification serv ice.............. ............... 201 customer notification service ....... .................... ............... 201 customer support.......... .................. ......................... 201, 202 d data accumulators and adder/subt ractor ........... ............... 23 data space write saturation ...... ................. ............... 25 overflow and saturation .......... .................... ............... 23 round logic .............. .................. .................. ............. 24 write back ............... .................. .................. ............... 24 data address space........ .................. .................. ............... 33 alignment................. .................. .................. ............... 36 alignment (figure) ................... .................... ............... 36 effect of invalid memory acce sses (table) ................ 36 mcu and dsp (mac class) instructions example .... 35 memory map.............. .................. ......................... 33, 34 near data space ....... .................. .................. ............. 37 software stack .......... .................. .................. ............. 37 spaces..................... .................. .................. ............... 36 width ................ ..................... .................... ................. 36 data eeprom memory................. .................... ................. 53 erasing .................... .................. .................. ............... 54 erasing, block........................ .................... ................. 54 dspic30f2011/2012/3012/3013 ds70139c-page 196 preliminary ? 2005 microchip technology inc. erasing, word ....................... .................... .................. 54 protection against spurious writ e ................. ............. 56 reading.................... .................. .................. ............... 53 write verify .............. .................. .................. ............... 56 writing ...................... .................. .................. ............... 55 writing, block ........................ .................... .................. 55 writing, word ........... .................. .................. ............... 55 dc characteristics ...................... .................... .................. 145 bor ...................... .................. .................. ................ 156 brown-out reset ..................... .................. ................ 155 i/o pin input specifications ..... .................. ................ 153 i/o pin output specifications .. .................. ................ 154 idle current (i idle ) .................. .................. ................ 149 low-voltage detect................. .................. ................ 154 lvdl ..................... .................. .................. ................ 155 operating current (i dd )....................... ...................... 147 power-down current (i pd ) .................... .................... 151 program and eeprom................ ................ ............. 156 temperature and voltage specifications .................. 145 dci module timing characteristics ac-link mode .................... .................. ............. 172 multichannel, i 2 s modes ............... .................... 170 timing requirements ac-link mode .................... .................. ............. 172 multichannel, i 2 s modes ............... .................... 171 demonstration boards picdem 1 ................ .................. .................. ............. 142 picdem 17 ................ .................. ................ ............. 142 picdem 18r ............. .................. ................ ............. 143 picdem 2 plus ..................... .................... ................ 142 picdem 3 ................ .................. .................. ............. 142 picdem 4 ................ .................. .................. ............. 142 picdem lin .............. .................. ................ ............. 143 picdem usb........................ .................... ................ 143 picdem.net internet/ethernet ... .................. ............. 142 development support ................... .................... ................ 139 device configuration register map............ .................. .................. ............. 130 device configuration registers fborpor ................. .................. ................ ............. 128 fgs....................... .................. .................. ................ 128 fosc ....................... .................. .................. ............. 128 fwdt....................... .................. .................. ............. 128 device overview ........... ..................... .................. ........... 9, 17 disabling the uart..................... .................... .................. 103 divide support............................. ...................... .................. 20 instructions (table) ................. ..................... ............... 20 dsp engine................. .................... ..................... ............... 21 multiplier.............................. ...................... .................. 23 dual output compare match mode ... .................. ............... 86 continuous pulse mode ............. .................. ............... 86 single pulse mode ..................... .................. ............... 86 e electrical characteristics ac ......................... .................. .................. ................ 157 dc ......................... .................. .................. ................ 145 enabling and setting up uart alternate i/o ............. .................. .................. ............. 103 setting up data, parity and stop bit selections ....... 103 enabling the uart ..................... .................... .................. 103 equations a/d conversion clock ............. .................. ................ 111 baud rate .................. .................. ................ ............. 105 serial clock rate ....... .................. .................. ............. 98 errata ....................... ....................... .................... .................. 7 evaluation and programming tools... ................. .............. 143 exception sequence trap sources ............... ........................ ....................... 65 external clock timing characteristics type a, b and c timer ............. .................. .............. 165 external clock timing requirem ents ............... ................ 158 type a timer .......................... .................. ................ 166 type b timer .......................... .................. ................ 167 type c timer ............ .................. ................ .............. 167 external interrupt requests .......... .................... .................. 68 f fast context saving ....... .................. .................. ................ 68 flash program memory .... .................. .................. .............. 47 i i/o pin specifications input...................... .................. .................. ................ 153 output ................... .................. .................. ................ 154 i/o ports............. ...................... ....................... .................... 57 parallel (pio) .......... .................. .................. ................ 57 i 2 c 10-bit slave mode operation..... ................... ................ 95 reception ............... .................. .................. ................ 96 transmission ............... ........................ ....................... 96 i 2 c 7-bit slave mode operation........ .................. ................ 95 reception ............... .................. .................. ................ 95 transmission ............... ........................ ....................... 95 i 2 c master mode operation............ .................... ................ 97 baud rate generator ............... .................. ................ 98 clock arbitration ..................... .................... ................ 98 multi-master communication, bus collision and bus arbitration ............. .................. .............. 98 reception ............... .................. .................. ................ 98 transmission ............... ........................ ....................... 97 i 2 c master mode support ............... .................... ................ 97 i 2 c module addresses............................. .................... .................. 95 bus data timing characteristics master mode..................... .................. .............. 178 slave mode....................... .................. .............. 180 bus data timing requirements master mode..................... .................. .............. 179 slave mode....................... .................. .............. 181 bus start/stop bits timing characteristics master mode..................... .................. .............. 178 slave mode....................... .................. .............. 180 general call address support .... .................. .............. 97 interrupts ................ .................. .................. ................ 97 ipmi support............. .................. .................. .............. 97 operating function description . ................. ................ 93 operation during cpu sleep and idle modes ............ 98 pin configuration .................... .................... ................ 93 programmer?s model ................ .................. ................ 93 register map ............ .................. .................. .............. 99 registers ................ .................. .................. ................ 93 slope control ............ .................. .................. .............. 97 software controlled clock stretching (stren = 1) ... 96 various modes........................ .................... ................ 93 idle current (i idle ) ..................... ..................... .................. 149 in-circuit serial programming (ics p)......................... 47, 117 input capture (capx) timing char acteristics .................. 168 input capture module ................... .................... .................. 81 interrupts ................ .................. .................. ................ 82 register map ............ .................. .................. .............. 83 ? 2005 microchip technology inc. preliminary ds70139c-page 197 dspic30f2011/2012/3012/3013 input capture operation duri ng sleep and idle modes ...... 82 cpu idle mode.......... .................. .................. .............. 82 cpu sleep mode .......... .................. ................ ............ 82 input capture timing requirements .................. ............... 168 input change notification module ....... .................. .............. 61 dspic30f2012/3013 register map (bits 7-0) ............. 61 instruction addressing modes.......... ..................... .............. 41 file register instructions ......... ..................... .............. 41 fundamental modes supported....... ............... ............ 41 mac instructions......... .................. .................. ............ 42 mcu instructions ..................... ..................... .............. 41 move and accumulator instructi ons................ ............ 42 other instructions...... .................. .................. .............. 42 instruction set overview ................ .................. .................. ............... 134 summary................... .................. .................. ............ 131 internal clock timing examples .... .................... ............... 159 internet address......... .................... .................... ............... 201 interrupt controller register map............. .................. .................. ........ 69, 70 interrupt priority ........... .................... ..................... .............. 64 traps.................. .................... .................... ................. 65 interrupt sequence ...................... ...................... ................. 67 interrupt stack frame .............. ..................... .............. 67 interrupts .................... .................... .................... ................. 63 l load conditions ................ .................. .................. ............ 157 low voltage detect (lvd) ............. .................... ............... 127 low-voltage detect characteristics . .................. ............... 154 lvdl characteristics ................... .................... ................. 155 m memory organization..................... .................... ................. 27 core register map................... ..................... .............. 37 microchip internet web site ......... .................... ................. 201 modulo addressing ........... .................. .................. .............. 42 applicability ............... .................. .................. .............. 44 incrementing buffer operation example..................... 43 start and end address................ .................. .............. 43 w address register selection .... .................. .............. 43 mplab asm30 assembler, linker, librarian ................... 140 mplab icd 2 in-circuit debugger .. .................. ............... 141 mplab ice 2000 high-performance universal in-circuit emulator ................. .................... ............... 141 mplab ice 4000 high-performance universal in-circuit emulator ................. .................... ............... 141 mplab integrated development environment software................. .................. .................. ............... 139 mplink object linker/mplib ob ject librarian ................ 140 n nvm register map............. .................. .................. .............. 51 o oc/pwm module timing characteri stics........... ............... 169 operating current (i dd ).................. .................... ............... 147 operating frequency vs voltage dspic30fxxxx-20 (extended)....... ................ .......... 145 oscillator configurations........... .................. .................. ............ 120 fail-safe clock monitor ........ ................ ............ 122 fast rc (frc) .................... .................. ............ 121 initial clock source selectio n ............... ............ 120 low power rc (lprc) ......... ................ ............ 121 lp oscillator control.......... .................. ............. 121 phase locked loop (pll) ...... ............... ........... 121 start-up timer (ost)........... ................ ............. 120 operating modes (table)........... .................. ............. 118 system overview................... .................... ............... 117 oscillator selection ................... ....................... ................. 117 oscillator start-up timer timing characteristics ............. .................. ............... 163 timing requirements ................ .................. ............. 164 output compare interrupts ............ .................... ................. 87 output compare module ................. .................... ............... 85 register map ........... .................. .................. ............... 88 timing characteristics ............. .................. ............... 168 timing requirements ................ .................. ............. 168 output compare operation duri ng cpu idle mode ........... 87 output compare sleep mode operatio n ............................ 87 p packaging information ................... .................... ............... 187 marking.................. .................. ......................... 187, 188 peripheral module disable (pmd) registers .................... 129 pickit 1 flash starter kit ............ ..................... ................. 143 picstart plus development programmer..................... 141 pinout descriptions........ .................... .................. ............... 14 pll clock timing specifications ..... .................. ............... 159 por. see power-on reset. port write/read example .............. .................... ................. 58 portb register map for dspic30f2011/ 3012 ....................... 59 register map for dspic30f2012/ 3013 ....................... 59 portc register map for dspic30f 2011/2012/3012/3013 ..... 59 portd register map for dspic30f2011/ 3012 ....................... 59 register map for dspic30f2012/ 3013 ....................... 60 portf register map for dspic30f2012/ 3013 ....................... 60 power saving modes......... .................. ................ ............. 127 idle.................. .................... ..................... ................. 128 sleep ..................... .................. .................. ............... 127 sleep and idle.......................... .................. ............... 117 power-down current (i pd )................. .................. ............. 151 power-up timer timing characteristics ............. .................. ............... 163 timing requirements ................ .................. ............. 164 pro mate ii universal device programmer ................... 141 program address space................ .................... ................. 27 construction .......................... .................... ................. 29 data access from program memory using program space visibility...... .................. ............. 31 data access from program memory using table instructions .............. .................. ............... 30 data access from, address generation ..................... 29 data space window into operat ion .............. ............. 32 data table access (ls word) ..... .................. ............. 30 data table access (ms byte) ..... .................. ............. 31 memory map.............. .................. .................. ............. 28 table instructions tblrdh ................. ................ ............... ............. 30 tblrdl.................. ................ ............... ............. 30 tblwth............................ .................. ............... 30 tblwtl ............................ .................. ............... 30 program and eeprom characteristic s............................ 156 program counter ........................ ....................... ................. 18 programmable ............... .................. .................. ............... 117 dspic30f2011/2012/3012/3013 ds70139c-page 198 preliminary ? 2005 microchip technology inc. programmer?s model..................... .................... .................. 18 diagram ................... .................. .................. ............... 19 programming operations .............. .................... .................. 49 algorithm for program flash ...... .................. ............... 49 erasing a row of program memo ry ............... ............. 49 initiating the programming sequenc e ......................... 50 loading write latches ............... .................. ............... 50 protection against accidental writes to osccon ........... 122 r reset....................... .................... .................... .......... 117, 123 bor, programmable............... .................. ................ 125 brown-out reset (bor) ............. .................. ............. 117 oscillator start-up timer (ost ) ................ ................ 117 por operating without fscm and pwrt ................ 125 with long crystal start-up ti me....................... 125 por (power-on reset) .............. .................. ............. 123 power-on reset (por) .............. .................. ............. 117 power-up timer (pwrt) ........... .................. ............. 117 reset sequence............... .................. .................. ............... 65 reset sources ........................ ..................... ............... 65 reset sources brown-out reset (bor) ............. .................. ............... 65 illegal instruction trap............. ..................... ............... 65 trap lockout ................ .................. ................ ............. 65 uninitialized w register trap .... .................. ............... 65 watchdog time-out.................... .................. ............... 65 reset timing characteristics ........ .................... ................ 163 reset timing requirements............ .................. ................ 164 run-time self-programming (rtsp) .................. ............... 47 s simple capture event mode ........... ..................... ............... 81 buffer operation.................... .................... .................. 82 hall sensor mode ................... ..................... ............... 82 prescaler .................. .................. .................. ............... 81 timer2 and timer3 selection m ode ............... ............. 82 simple oc/pwm mode timing requirements.................. 169 simple output compare match mode .................. ............... 86 simple pwm mode ....................... .................... .................. 86 input pin fault protection........ ..................... ............... 86 period....................... .................. .................. ............... 87 software simulator (mplab sim)... .................. ................ 140 software simulator (mplab sim30) ................. ................ 140 software stack pointer, frame poin ter................ ............... 18 call stack frame..................... .................. ............... 37 spi module.................. .................... ..................... ............... 89 framed spi support .................. .................. ............... 90 operating function description .... ................. ............. 89 operation during cpu idle mode .................. ............. 91 operation during cpu sleep mode ............... ............. 91 sdox disable ......................... ..................... ............... 90 slave select synchronization .... .................. ............... 91 spi1 register map .................. ..................... ............... 92 timing characteristics master mode (cke = 0) ....... ................ ............. 173 master mode (cke = 1) ....... ................ ............. 174 slave mode (cke = 1) ......... ..................... 175, 176 timing requirements master mode (cke = 0) ....... ................ ............. 173 master mode (cke = 1) ....... ................ ............. 174 slave mode (cke = 0) ......... ................ ............. 175 slave mode (cke = 1) ......... ................ ............. 177 word and byte communication .... ................. ............. 90 status bits, their significance and the initialization condition for rcon register, case 1 ...................... 126 status bits, their significance and the initialization condition for rcon register, case 2 ...................... 126 status register ........... .................... .................... ................ 18 symbols used in opcode descripti ons ............................ 132 system integration register map ............ .................. ................ .............. 130 t table instruction operation summa ry ................ ................ 47 temperature and voltage specifications ac.................. .................... ..................... .................. 157 dc ................. .................... ..................... .................. 145 timer 2/3 module.......... .................... .................. ................ 75 timer1 module.............. .................... .................. ................ 71 16-bit asynchronous counter m ode ............. .............. 71 16-bit synchronous counter mode ............... .............. 71 16-bit timer mode........ ........................ ....................... 71 gate operation ......... .................. .................. .............. 72 interrupt .................. .................. .................. ................ 72 operation during sleep mode .... .................. .............. 72 prescaler ................ .................. .................. ................ 72 real-time clock ..................... .................... ................ 72 interrupts ............... ................ ............... .............. 73 oscillator operation............ .................. .............. 73 register map ............ .................. .................. .............. 74 timer2 and timer3 selection mode .................... ................ 86 timer2/3 module 16-bit timer mode........ ........................ ....................... 75 32-bit synchronous counter mode ............... .............. 75 32-bit timer mode........ ........................ ....................... 75 adc event trigger....... ........................ ....................... 78 gate operation ......... .................. .................. .............. 78 interrupt .................. .................. .................. ................ 78 operation during sleep mode .... .................. .............. 78 register map ............ .................. .................. .............. 79 timer prescaler ...................... .................... ................ 78 timing characteristics a/d conversion low-speed (asam = 0, ssrc = 000) .............. 185 bandgap start-up time............. .................. .............. 164 can module i/o........... ........................ ..................... 182 clkout and i/o .................... .................. ................ 162 dci module ac-link mode................... .................. .............. 172 multichannel, i 2 s modes.............. ..................... 170 external clock....................... .................... ................ 157 i 2 c bus data master mode..................... .................. .............. 178 slave mode....................... .................. .............. 180 i 2 c bus start/stop bits master mode..................... .................. .............. 178 slave mode....................... .................. .............. 180 input capture (capx)............... .................. .............. 168 oc/pwm module.................... .................. ................ 169 oscillator start-up timer......... .................. ................ 163 output compare module .......... .................. .............. 168 power-up timer ...................... .................. ................ 163 reset .................... .................. .................. ................ 163 spi module master mode (cke = 0)......... ............... ............ 173 master mode (cke = 1)......... ............... ............ 174 slave mode (cke = 0)........... ............... ............ 175 slave mode (cke = 1)........... ............... ............ 176 ? 2005 microchip technology inc. preliminary ds70139c-page 199 dspic30f2011/2012/3012/3013 type a, b and c timer external clock ..................... 165 watchdog timer....................... .................. ............... 163 timing diagrams pwm output ............... .................. .................. ............ 87 time-out sequence on power-up (mclr not tied to v dd ), case 1...................... 124 time-out sequence on power-up (mclr not tied to v dd ), case 2...................... 124 time-out sequence on power-up (mclr tied to v dd )....................... ................... 124 timing diagrams and specifications dc characteristics - internal rc accuracy............... 159 timing diagrams.see timing characteristics timing requirements a/d conversion low-speed .......................... .................. ............ 186 bandgap start-up time............ .................. ............... 165 brown-out reset .................... .................... ............... 164 can module i/o.......... .................. ................ ............ 182 clkout and i/o.................... .................... ............... 162 dci module ac-link mode ..................... .................. ............ 172 multichannel, i 2 s modes ................ ................... 171 external clock...................... .................... ................. 158 i 2 c bus data (master mode)....... .................. ............ 179 i 2 c bus data (slave mode)......... .................. ............ 181 input capture ............ .................. .................. ............ 168 oscillator start-up timer .......... .................. ............... 164 output compare module............. .................. ............ 168 power-up timer .......... .................. ................ ............ 164 reset...................... .................. .................. ............... 164 simple oc/pwm mode............ .................. ............... 169 spi module master mode (cke = 0) ...... .................. ............ 173 master mode (cke = 1) ...... .................. ............ 174 slave mode (cke = 0) .......... ................ ............ 175 slave mode (cke = 1) .......... ................ ............ 177 type a timer external clock ...... .................. ............ 166 type b timer external clock ...... .................. ............ 167 type c timer external clock ...... .................. ............ 167 watchdog timer....................... .................. ............... 164 timing specifications pll clock............................. .................... ................. 159 trap vectors ................ .................... ..................... .............. 67 u uart module address detect mode .............. .................. ............... 105 auto baud support .................. .................. ............... 106 baud rate generator ................ .................. ............. 105 enabling and setting up............ .................. ............. 103 framing error (ferr) ............. .................. ............... 105 idle status.............. .................. .................. ............... 105 loopback mode ......................... .................. ............. 105 operation during cpu sleep and idle modes.......... 106 overview.................. .................. .................. ............. 101 parity error (perr) ............... .................... ............... 105 receive break ........... .................. ................ ............. 105 receive buffer (uxrxb).......... .................. ............... 104 receive buffer overrun error (oerr bit) ................ 104 receive interrupt ................... .................... ............... 104 receiving data .......... .................. ................ ............. 104 receiving in 8-bit or 9-bit da ta mode ....................... 104 reception error handling .......... .................. ............. 104 transmit break .......... .................. ................ ............. 104 transmit buffer (uxtxb) ......... .................. ............... 103 transmit interrupt ...... .................. ................ ............. 104 transmitting data .................... .................. ............... 103 transmitting in 8-bit data mode .................. ............. 103 transmitting in 9-bit data mode .................. ............. 103 uart1 register map .............. .................. ............... 107 uart2 register map .............. .................. ............... 107 uart operation idle mode............... .................. .................. ............... 106 sleep mode ............... .................. ................ ............. 106 unit id locations ......... .................... .................. ............... 117 universal asynchronous receiver transmitter (uart) module.......... .................. ................ ............. 101 w wake-up from sleep ................... ..................... ................. 117 wake-up from sleep and idle .......... .................... ............... 68 watchdog timer timing characteristics ............. .................. ............... 163 timing requirements ................ .................. ............. 164 watchdog timer (wdt).............. .................. ............ 117, 127 enabling and disabling.............. .................. ............. 127 operation................. .................. .................. ............. 127 www address .............. .................. .................. ............... 201 www, on-line support .................. .................... ................. 7 dspic30f2011/2012/3012/3013 ds70139c-page 200 preliminary ? 2005 microchip technology inc. notes: ? 2005 microchip technology inc. preliminary ds70139c-page 201 dspic30f2011/2012/3012/3013 the microchip web site microchip provides online su pport via our www site at www.microchip.com. this web site is used as a means to make files and inform ation easily available to customers. accessible by us ing your favorite internet browser, the web site contains the following information: ? product support ? data sheets and errata, application notes and sample programs, design resources, user?s guid es and hardware support documents, latest software releases and archived software ? general technical support ? frequently asked questions (faq), techni cal support requests, online discussion groups, microchip consultant program member listing ? business of microchip ? product selector and ordering guides, latest mi crochip press releases, listing of seminars and events, listings of microchip sales offices, distributors and factory representatives customer change notification service microchip?s customer notifi cation service helps keep customers current on microc hip products. subscribers will receive e-mail notific ation whenever there are changes, updates, revisions or errata related to a specified product family or de velopment tool of interest. to register, access the microchip web site at www.microchip.com, click on customer change notification and follow the registration instructions. customer support users of microchip produc ts can receive assistance through several channels: ? distributor or representative ? local sales office ? field application engineer (fae) ? technical support ? development systems information line customers should contact their distributor, representative or field appl ication engineer (fae) for support. local sales offices are also available to help customers. a listing of sales offices and locations is included in the back of this document. technical support is available through the web site at: http://support.microchip.com in addition, there is a development systems information line which list s the latest versions of microchip?s development systems software products. this line also provides information on how customers can receive currently available upgrade kits. the development systems information line numbers are: 1-800-755-2345 ? united stat es and most of canada 1-480-792-7302 ? other in ternational locations dspic30f2011/2012/3012/3013 ds70139c-page 202 preliminary ? 2005 microchip technology inc. reader response it is our intention to provide you with th e best documentation possible to ensure successful use of your microchip prod- uct. if you wish to provide your comm ents on organization, clarity, subject ma tter, and ways in which our documentation can better serve you, please fax your comments to th e technical publications manager at (480) 792-4150. please list the following information, and use this outline to provide us wi th your comments about this document. to : technical publications manager re: reader response total pages sent ________ from: name company address city / state / zip / country telephone: (_______) _________ - _________ application (optional): would you like a reply? y n device: literature number: questions: fax: (______) _ ________ - _________ ds70139c dspic30f2011/2012/3012/3013 1. what are the best featur es of this document? 2. how does this document meet your ha rdware and software development needs? 3. do you find the organization of this document easy to follow? if not, why? 4. what additions to the docume nt do you think would enhanc e the structure and subject? 5. what deletions from the document could be made without affecting the overall usefulness? 6. is there any incorrect or mislea ding information (what and where)? 7. how would you improve this document? ? 2005 microchip technology inc. preliminary ds70139c-page 203 dspic30f2011/2012/3012/3013 product identification system to order or obtain information, e.g., on pricing or del ivery, refer to the factory or the listed sales office. DSPIC30F3013at-30i/sp-es example: DSPIC30F3013at-30i/sp = 30 mips, indus trial temp., spdip package, rev. a trademark architecture flash e = extended high temp -40c to +125c i = industrial -40c to +85c temperature device id package p=dip so = soic sp = spdip ml = qfn (8x8) memory size in bytes 0 = romless 1 = 1k to 6k 2 = 7k to 12k 3 = 13k to 24k 4 = 25k to 48k 5 = 49k to 96k 6 = 97k to 192k 7 = 193k to 384k 8 = 385k to 768k 9 = 769k and up custom id (3 digits) or t = tape and reel a,b,c? = revision level engineering sample (es) speed 20 = 20 mips 30 = 30 mips ds70139c-page 204 preliminary ? 2005 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://support.microchip.com web address: www.microchip.com atlanta alpharetta, ga tel: 770-640-0034 fax: 770-640-0307 boston westford, ma tel: 978-692-3848 fax: 978-692-3821 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit farmington hills, mi tel: 248-538-2250 fax: 248-538-2260 kokomo kokomo, in tel: 765-864-8360 fax: 765-864-8387 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 san jose mountain view, ca tel: 650-215-1444 fax: 650-961-0286 toronto mississauga, ontario, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8528-2100 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8676-6200 fax: 86-28-8676-6599 china - fuzhou tel: 86-591-8750-3506 fax: 86-591-8750-3521 china - hong kong sar tel: 852-2401-1200 fax: 852-2401-3431 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8203-2660 fax: 86-755-8203-1760 china - shunde tel: 86-757-2839-5507 fax: 86-757-2839-5571 china - qingdao tel: 86-532-502-7355 fax: 86-532-502-7205 asia/pacific india - bangalore tel: 91-80-2229-0061 fax: 91-80-2229-0062 india - new delhi tel: 91-11-5160-8631 fax: 91-11-5160-8632 japan - kanagawa tel: 81-45-471- 6166 fax: 81-45-471-6122 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - kaohsiung tel: 886-7-536-4818 fax: 886-7-536-4803 taiwan - taipei tel: 886-2-2500-6610 fax: 886-2-2508-0102 taiwan - hsinchu tel: 886-3-572-9526 fax: 886-3-572-6459 europe austria - weis tel: 43-7242-2244-399 fax: 43-7242-2244-393 denmark - ballerup tel: 45-4450-2828 fax: 45-4485-2829 france - massy tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - ismaning tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 england - berkshire tel: 44-118-921-5869 fax: 44-118-921-5820 w orldwide s ales and s ervice 10/20/04 |
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